JP5675161B2 - 外部電極用導電性ペースト、及びそれを用いて形成した外部電極を備えた積層セラミック電子部品 - Google Patents
外部電極用導電性ペースト、及びそれを用いて形成した外部電極を備えた積層セラミック電子部品 Download PDFInfo
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- JP5675161B2 JP5675161B2 JP2010104884A JP2010104884A JP5675161B2 JP 5675161 B2 JP5675161 B2 JP 5675161B2 JP 2010104884 A JP2010104884 A JP 2010104884A JP 2010104884 A JP2010104884 A JP 2010104884A JP 5675161 B2 JP5675161 B2 JP 5675161B2
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Classifications
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- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H01G4/002—Details
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- H—ELECTRICITY
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- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
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- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
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| Application Number | Priority Date | Filing Date | Title |
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| JP2010104884A JP5675161B2 (ja) | 2010-04-30 | 2010-04-30 | 外部電極用導電性ペースト、及びそれを用いて形成した外部電極を備えた積層セラミック電子部品 |
| KR1020110040488A KR101807876B1 (ko) | 2010-04-30 | 2011-04-29 | 외부 전극용 도전성 페이스트, 및 그것을 이용하여 형성한 외부 전극을 구비한 적층 세라믹 전자 부품 |
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| JP2011233452A JP2011233452A (ja) | 2011-11-17 |
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| KR101412822B1 (ko) * | 2012-09-06 | 2014-06-27 | 삼성전기주식회사 | 외부전극용 전도성 페이스트, 이를 이용한 적층 세라믹 전자부품 및 이의 제조방법 |
| KR101719838B1 (ko) * | 2012-09-06 | 2017-03-24 | 삼성전기주식회사 | 도전성 수지 조성물 및 이를 포함하는 적층 세라믹 전자 부품 |
| KR20140090466A (ko) | 2013-01-09 | 2014-07-17 | 삼성전기주식회사 | 도전성 수지 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법 |
| KR101565639B1 (ko) * | 2013-02-20 | 2015-11-03 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
| KR101462798B1 (ko) * | 2013-07-16 | 2014-11-20 | 삼성전기주식회사 | 외부 전극용 도전성 페이스트 조성물 및 이를 포함하는 적층 세라믹 전자 부품 |
| JP2016004659A (ja) | 2014-06-16 | 2016-01-12 | 株式会社村田製作所 | 導電性樹脂ペーストおよびセラミック電子部品 |
| KR101630050B1 (ko) * | 2014-07-25 | 2016-06-13 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
| JP2017147163A (ja) * | 2016-02-19 | 2017-08-24 | 三菱マテリアル株式会社 | 導電性ペースト及びこれを用いて形成された導電性膜 |
| JP2018009112A (ja) * | 2016-07-14 | 2018-01-18 | タツタ電線株式会社 | 導電性塗料及びそれを用いたシールドパッケージの製造方法 |
| JP6911754B2 (ja) * | 2017-12-27 | 2021-07-28 | Tdk株式会社 | 電子部品および積層セラミックコンデンサ |
| JP7528763B2 (ja) * | 2020-12-11 | 2024-08-06 | 株式会社村田製作所 | 積層セラミック電子部品および樹脂電極用導電性ペースト |
| WO2024202136A1 (ja) * | 2023-03-28 | 2024-10-03 | ナミックス株式会社 | エポキシ樹脂組成物、電子部品、半導体装置、半導体装置の製造方法 |
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| JP2603053B2 (ja) * | 1993-10-29 | 1997-04-23 | 松下電器産業株式会社 | ビアホール充填用導体ペースト組成物並びにそれを用いた両面及び多層プリント基板とその製造方法 |
| JPH11162771A (ja) * | 1997-11-25 | 1999-06-18 | Kyocera Corp | 積層セラミックコンデンサ |
| JP4019254B2 (ja) * | 2002-04-24 | 2007-12-12 | 信越化学工業株式会社 | 導電性樹脂組成物 |
| JP4380145B2 (ja) * | 2002-11-20 | 2009-12-09 | 株式会社村田製作所 | 導電ペースト及びセラミック電子部品の製造方法 |
| JP2005293851A (ja) * | 2004-03-10 | 2005-10-20 | Toyobo Co Ltd | 導電性ペースト |
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| JP2011233452A (ja) | 2011-11-17 |
| KR20110121572A (ko) | 2011-11-07 |
| KR101807876B1 (ko) | 2017-12-11 |
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