JP5658459B2 - ワイヤ及びケーブルを調製するための半導電体ポリマー組成物 - Google Patents
ワイヤ及びケーブルを調製するための半導電体ポリマー組成物 Download PDFInfo
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- JP5658459B2 JP5658459B2 JP2009543017A JP2009543017A JP5658459B2 JP 5658459 B2 JP5658459 B2 JP 5658459B2 JP 2009543017 A JP2009543017 A JP 2009543017A JP 2009543017 A JP2009543017 A JP 2009543017A JP 5658459 B2 JP5658459 B2 JP 5658459B2
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- 150000003624 transition metals Chemical class 0.000 description 1
- 238000004627 transmission electron microscopy Methods 0.000 description 1
- ZSDSQXJSNMTJDA-UHFFFAOYSA-N trifluralin Chemical compound CCCN(CCC)C1=C([N+]([O-])=O)C=C(C(F)(F)F)C=C1[N+]([O-])=O ZSDSQXJSNMTJDA-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 239000012178 vegetable wax Substances 0.000 description 1
- 229920002554 vinyl polymer Chemical group 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
- Y10S977/742—Carbon nanotubes, CNTs
Description
(具体的な実施形態)
Claims (4)
- ポリオレフィンポリマー、組成物全量に対し30重量%より少ない量のカーボンブラック、及び下記膨張黒鉛を含む組成物:
組成物の総重量の0.1パーセントから16パーセントの間を構成し、少なくとも250m2/gから1500m2/gのBET表面積を有する膨張黒鉛。 - ポリオレフィンポリマーが、ポリプロピレンホモポリマー、ポリエチレンホモポリマー、ポリプロピレンコポリマー、ポリエチレンコポリマーおよび線状低密度ポリエチレンからなる群から選択される、請求項1に記載の組成物。
- 請求項1または2に記載の組成物から作られた半導電性シールド層を含む電力ケーブル。
- ポリオレフィンポリマーが、エチレンと、4個から20個の炭素原子を有する少なくとも1つの不飽和エステルとを含み、前記不飽和エステルが10重量パーセントから60重量パーセントの量で存在する、請求項3に記載の電力ケーブル。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/613,771 | 2006-12-20 | ||
US11/613,771 US7863522B2 (en) | 2006-12-20 | 2006-12-20 | Semi-conducting polymer compositions for the preparation of wire and cable |
PCT/US2007/085832 WO2008079585A1 (en) | 2006-12-20 | 2007-11-29 | Semi-conducting polymer compositions for the preparation of wire and cable |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010513685A JP2010513685A (ja) | 2010-04-30 |
JP2010513685A5 JP2010513685A5 (ja) | 2011-01-20 |
JP5658459B2 true JP5658459B2 (ja) | 2015-01-28 |
Family
ID=39301648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009543017A Active JP5658459B2 (ja) | 2006-12-20 | 2007-11-29 | ワイヤ及びケーブルを調製するための半導電体ポリマー組成物 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7863522B2 (ja) |
EP (1) | EP2094773B2 (ja) |
JP (1) | JP5658459B2 (ja) |
CN (1) | CN101578329A (ja) |
CA (1) | CA2673291C (ja) |
MX (1) | MX2009006736A (ja) |
TW (1) | TWI443111B (ja) |
WO (1) | WO2008079585A1 (ja) |
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-
2006
- 2006-12-20 US US11/613,771 patent/US7863522B2/en active Active
-
2007
- 2007-11-29 CN CNA2007800498405A patent/CN101578329A/zh active Pending
- 2007-11-29 MX MX2009006736A patent/MX2009006736A/es active IP Right Grant
- 2007-11-29 JP JP2009543017A patent/JP5658459B2/ja active Active
- 2007-11-29 EP EP07864856.5A patent/EP2094773B2/en active Active
- 2007-11-29 CA CA2673291A patent/CA2673291C/en active Active
- 2007-11-29 WO PCT/US2007/085832 patent/WO2008079585A1/en active Application Filing
- 2007-12-06 TW TW096146513A patent/TWI443111B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN101578329A (zh) | 2009-11-11 |
EP2094773B1 (en) | 2017-05-31 |
WO2008079585A1 (en) | 2008-07-03 |
TW200837083A (en) | 2008-09-16 |
EP2094773A1 (en) | 2009-09-02 |
CA2673291A1 (en) | 2008-07-03 |
US7863522B2 (en) | 2011-01-04 |
US20080149363A1 (en) | 2008-06-26 |
CA2673291C (en) | 2014-06-17 |
MX2009006736A (es) | 2009-06-30 |
JP2010513685A (ja) | 2010-04-30 |
TWI443111B (zh) | 2014-07-01 |
EP2094773B2 (en) | 2020-02-12 |
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