JP5644791B2 - 離型フィルム - Google Patents

離型フィルム Download PDF

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Publication number
JP5644791B2
JP5644791B2 JP2012035473A JP2012035473A JP5644791B2 JP 5644791 B2 JP5644791 B2 JP 5644791B2 JP 2012035473 A JP2012035473 A JP 2012035473A JP 2012035473 A JP2012035473 A JP 2012035473A JP 5644791 B2 JP5644791 B2 JP 5644791B2
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JP
Japan
Prior art keywords
release
layer
release film
resin
film
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Active
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JP2012035473A
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English (en)
Japanese (ja)
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JP2013116620A (ja
Inventor
裕人 谷口
裕人 谷口
宏史 小柳
宏史 小柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Priority to JP2012035473A priority Critical patent/JP5644791B2/ja
Publication of JP2013116620A publication Critical patent/JP2013116620A/ja
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JP2012035473A 2011-10-31 2012-02-21 離型フィルム Active JP5644791B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012035473A JP5644791B2 (ja) 2011-10-31 2012-02-21 離型フィルム

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011238809 2011-10-31
JP2011238809 2011-10-31
JP2012035473A JP5644791B2 (ja) 2011-10-31 2012-02-21 離型フィルム

Related Child Applications (1)

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JP2014158040A Division JP5999146B2 (ja) 2011-10-31 2014-08-01 離型フィルム

Publications (2)

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JP2013116620A JP2013116620A (ja) 2013-06-13
JP5644791B2 true JP5644791B2 (ja) 2014-12-24

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ID=48711504

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JP2012035473A Active JP5644791B2 (ja) 2011-10-31 2012-02-21 離型フィルム
JP2014158040A Expired - Fee Related JP5999146B2 (ja) 2011-10-31 2014-08-01 離型フィルム

Family Applications After (1)

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JP2014158040A Expired - Fee Related JP5999146B2 (ja) 2011-10-31 2014-08-01 離型フィルム

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JP (2) JP5644791B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108221477A (zh) * 2016-12-09 2018-06-29 松本涂层科技（昆山）有限公司 一种柔性线路板压合用阻胶离型纸及其制备方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6299933B2 (ja) * 2016-03-30 2018-03-28 住友ベークライト株式会社 プリント回路基板製造用離型フィルムおよび成型品の製造方法
JP2018178106A (ja) * 2017-04-06 2018-11-15 積水化学工業株式会社 離型フィルム
CN107234764B (zh) * 2017-07-07 2023-11-07 昆山致信天城电子材料有限公司 一种耐高段差的高温离型膜及制造工艺
JP7343029B1 (ja) 2022-09-29 2023-09-12 住友ベークライト株式会社 離型フィルム
JP7343030B1 (ja) 2022-09-29 2023-09-12 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法
CN115534461B (zh) * 2022-11-29 2023-03-28 苏州博理新材料科技有限公司 一种五层离型膜及其制备方法和用途

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03293126A (ja) * 1990-04-11 1991-12-24 Sumitomo Bakelite Co Ltd 離型多層フィルム
JPH04286640A (ja) * 1991-03-15 1992-10-12 Sumitomo Bakelite Co Ltd 多層フイルム
JP2002079630A (ja) * 2000-06-28 2002-03-19 Sumitomo Bakelite Co Ltd 離型多層フィルム及びカバーレイ成形方法
JP2003276140A (ja) * 2002-03-25 2003-09-30 Sumitomo Bakelite Co Ltd 離型多層フィルム及びカバーレイ成形方法
JP2005014598A (ja) * 2003-05-30 2005-01-20 Mitsubishi Plastics Ind Ltd 離型用積層フィルム
TWI476103B (zh) * 2003-07-01 2015-03-11 Sumitomo Bakelite Co A release film and a method of manufacturing a flexible printed wiring board using the release film
JP4826196B2 (ja) * 2005-10-05 2011-11-30 住友ベークライト株式会社 離型フィルムおよび回路基板の製造方法
JP4598644B2 (ja) * 2005-10-06 2010-12-15 積水化学工業株式会社 多層離型フィルム及び多層離型フィルムの製造方法
JP2007175885A (ja) * 2005-12-27 2007-07-12 Asahi Kasei Chemicals Corp 離型フィルム
JP5353217B2 (ja) * 2008-12-11 2013-11-27 住友ベークライト株式会社 離型フィルム並びにそれを用いた接着方法及び回路基板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108221477A (zh) * 2016-12-09 2018-06-29 松本涂层科技（昆山）有限公司 一种柔性线路板压合用阻胶离型纸及其制备方法
CN108221477B (zh) * 2016-12-09 2020-06-19 松本涂层科技（昆山）有限公司 一种柔性线路板压合用阻胶离型纸及其制备方法

Also Published As

Publication number Publication date
JP5999146B2 (ja) 2016-09-28
JP2014221558A (ja) 2014-11-27
JP2013116620A (ja) 2013-06-13

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