JP5640476B2 - 光半導体素子封止用樹脂組成物及び発光装置 - Google Patents

光半導体素子封止用樹脂組成物及び発光装置 Download PDF

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Publication number
JP5640476B2
JP5640476B2 JP2010130831A JP2010130831A JP5640476B2 JP 5640476 B2 JP5640476 B2 JP 5640476B2 JP 2010130831 A JP2010130831 A JP 2010130831A JP 2010130831 A JP2010130831 A JP 2010130831A JP 5640476 B2 JP5640476 B2 JP 5640476B2
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resin composition
sealing
optical semiconductor
semiconductor element
light emitting
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Japanese (ja)
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JP2011256251A (ja
Inventor
克之 今澤
克之 今澤
柏木　努
努 柏木
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority to JP2010130831A priority Critical patent/JP5640476B2/ja
Priority to KR1020110054386A priority patent/KR20110134299A/ko
Priority to TW100119819A priority patent/TWI491674B/zh
Priority to CN201110265781.3A priority patent/CN102408724B/zh
Publication of JP2011256251A publication Critical patent/JP2011256251A/ja
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Publication of JP5640476B2 publication Critical patent/JP5640476B2/ja
Priority to KR1020170065528A priority patent/KR101979499B1/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2010130831A 2010-06-08 2010-06-08 光半導体素子封止用樹脂組成物及び発光装置 Active JP5640476B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010130831A JP5640476B2 (ja) 2010-06-08 2010-06-08 光半導体素子封止用樹脂組成物及び発光装置
KR1020110054386A KR20110134299A (ko) 2010-06-08 2011-06-07 광반도체 소자 밀봉용 수지 조성물 및 발광 장치
TW100119819A TWI491674B (zh) 2010-06-08 2011-06-07 A resin composition for a light-emitting semiconductor element, and a light-emitting device
CN201110265781.3A CN102408724B (zh) 2010-06-08 2011-06-08 光半导体元件密封用树脂组合物及发光装置
KR1020170065528A KR101979499B1 (ko) 2010-06-08 2017-05-26 광반도체 소자 밀봉용 수지 조성물 및 발광 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010130831A JP5640476B2 (ja) 2010-06-08 2010-06-08 光半導体素子封止用樹脂組成物及び発光装置

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JP2011256251A JP2011256251A (ja) 2011-12-22
JP5640476B2 true JP5640476B2 (ja) 2014-12-17

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JP (1) JP5640476B2 (zh)
KR (2) KR20110134299A (zh)
CN (1) CN102408724B (zh)
TW (1) TWI491674B (zh)

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CN103827216B (zh) 2011-07-22 2016-03-16 Lg化学株式会社 可固化组合物
JP5865216B2 (ja) 2012-09-12 2016-02-17 ルネサスエレクトロニクス株式会社 フォトカプラ
WO2014061318A1 (ja) * 2012-10-19 2014-04-24 信越化学工業株式会社 太陽電池セル封止用シリコーンゲル組成物及び太陽電池モジュール
JP2014086520A (ja) * 2012-10-23 2014-05-12 Sharp Corp 発光装置
CN103788660B (zh) * 2014-01-16 2016-11-02 上海工程技术大学 一种玻璃纤维/环氧树脂杂化改性硅橡胶模具胶及其制备方法
JP6018608B2 (ja) * 2014-08-08 2016-11-02 日東電工株式会社 封止シート、その製造方法、光半導体装置および封止光半導体素子
KR101767085B1 (ko) 2014-09-30 2017-08-10 삼성에스디아이 주식회사 경화형 오르가노 폴리실록산 조성물, 봉지재, 및 전자 소자
JP6445947B2 (ja) 2015-09-04 2018-12-26 株式会社東芝 光結合装置
JP6615557B2 (ja) * 2015-09-30 2019-12-04 日亜化学工業株式会社 発光装置及びその製造方法
JP6470157B2 (ja) * 2015-09-30 2019-02-13 関西ペイント株式会社 発光素子封止用樹脂組成物
JP6973360B2 (ja) * 2018-11-26 2021-11-24 信越化学工業株式会社 吸湿性シリコーン樹脂組成物、有機ｅｌ用透明封止材、有機ｅｌ用透明乾燥材、及びその使用方法

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JPH0725987A (ja) 1993-07-14 1995-01-27 Nitto Denko Corp 光半導体封止用エポキシ樹脂組成物
JP2938340B2 (ja) * 1994-03-29 1999-08-23 信越化学工業株式会社 熱伝導性複合シート
JP3241338B2 (ja) 1998-01-26 2001-12-25 日亜化学工業株式会社 半導体発光装置
JP3909826B2 (ja) 2001-02-23 2007-04-25 株式会社カネカ 発光ダイオード
JP3910080B2 (ja) 2001-02-23 2007-04-25 株式会社カネカ 発光ダイオード
JP3973448B2 (ja) * 2002-02-25 2007-09-12 松下電工株式会社 半導体装置の製造方法及び半導体装置
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5021151B2 (ja) * 2003-11-19 2012-09-05 株式会社カネカ 半導体のパッケージ用硬化性樹脂組成物および半導体
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JP5623697B2 (ja) * 2008-12-22 2014-11-12 株式会社朝日ラバー 光学レンズ付きシート部材、ならびに発光装置およびそれを用いた液晶表示装置、看板
JP2010161234A (ja) * 2009-01-08 2010-07-22 Showa Denko Kk 発光装置の製造方法、発光装置及び照明装置
JP5912600B2 (ja) * 2011-09-16 2016-04-27 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP5943179B2 (ja) * 2011-12-05 2016-06-29 京セラ株式会社 透明樹脂組成物

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Publication number Publication date
CN102408724B (zh) 2015-06-10
KR101979499B1 (ko) 2019-05-16
CN102408724A (zh) 2012-04-11
JP2011256251A (ja) 2011-12-22
KR20170061655A (ko) 2017-06-05
TWI491674B (zh) 2015-07-11
TW201213442A (en) 2012-04-01
KR20110134299A (ko) 2011-12-14

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