JP5640476B2 - Resin composition for sealing optical semiconductor element and light emitting device - Google Patents

Description

  The present invention relates to a silicone-based resin composition for encapsulating an optical semiconductor element, and a light-emitting device sealed with a cured product of the resin composition.

  The resin composition for protecting a coating of an optical semiconductor element such as a light emitting diode (LED) is required to have a cured product having transparency, and as the composition, generally, a bisphenol A type epoxy resin or An epoxy resin composition containing an epoxy resin such as an alicyclic epoxy resin and an acid anhydride curing agent is used (Patent Document 1: Japanese Patent No. 3241338, Patent Document 2: Japanese Patent Laid-Open No. 7-25987). reference).

  However, the cured product of the epoxy resin composition has a drawback that it has low light resistance or is colored due to light deterioration because of its low light transmittance with respect to light having a short wavelength. Therefore, it contains an organic compound containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule, a silicon compound containing at least two SiH groups in one molecule, and a hydrosilylation catalyst. A resin composition for coating protection of an optical semiconductor element has been proposed (see Patent Document 3: JP 2002-327126 A, Patent Document 4: JP 2002-338833 A).

  However, a cured product of such a silicone resin composition, particularly a cured product of a silicone resin composition having a refractive index of less than 1.45, has a larger gas permeability than a cured product of a conventional epoxy resin composition, The sulfur-containing gas existing in the storage environment and the use environment permeates. Therefore, the sulfur-containing gas that has passed through the cured product of the silicone resin composition causes the silver-plated surface of the lead frame, which is the substrate of the LED package, to be sulfided and changed to silver sulfide, resulting in blackening of the silver-plated surface. There was a problem.

In general, the gas permeability of the cured product of the silicone resin composition is 20 g / m ² · 24 hr or more, and particularly the gas permeability of the cured product of the silicone resin composition having a refractive index of less than 1.45. At 50 g / m ² · 24 hr or more, sulfur-containing gas existing in the external environment can be easily permeated. Examples of the sulfur-containing gas existing in the external environment include sulfur oxides (SO _x ) in the atmosphere and sulfur components contained in packaging materials such as cardboard boxes. The lead frame surface of the LED package is generally subjected to silver plating from the viewpoint of light reflection efficiency. When a light emitting diode sealed with a cured product of a silicone resin composition having a refractive index of less than 1.45 on such a silver-plated lead frame is left in an atmosphere containing a sulfur-containing gas, the sulfur-containing gas becomes silicone. The cured product of the resin composition passes through and the silver sulfidation reaction proceeds. As a result, silver sulfide is generated on the surface of the lead frame. Due to the formation of silver sulfide, the surface of the LED package substrate is blackened, the light reflection efficiency is remarkably lowered, and this is one of the factors that cannot maintain long-term reliability.

  Therefore, as a countermeasure against sulfuration, in recent years, by using a silicone resin composition having a relatively low gas permeability and a refractive index after curing of 1.45 or more, it is possible to solve the above-mentioned silver plating surface sulfurization problem. Proposed. However, a cured product of a silicone resin composition having a refractive index of 1.45 or more is brittle and lower in strength than a cured product of a silicone resin composition having a refractive index of less than 1.45. When a thermal stress test such as the above was performed, a resin crack occurred and the reliability test could not be passed.

  In general, it is known to use a silica filler as a filler for reinforcing the strength of a cured product of a silicone resin composition. However, the shape of the silica filler is isotropic, and when such a silica filler-containing silicone resin composition is used as a sealant for a pre-mold package as shown in FIG. Although the defect rate is improved, thermal stress such as moisture absorption reflow and thermal shock test acts on the sealing resin in a complicated manner, and the reinforcing effect of the silica filler alone cannot withstand the thermal stress, and the resin itself breaks. Defects occurred, and it was difficult to make the defect rate zero. FIG. 1 is a cross-sectional view showing an embodiment of a conventional light emitting device. 1 is an optical semiconductor element, 2 is a conductive wire, 3 is a silver-plated lead frame, 4 is an optical semiconductor element sealing resin, Reference numeral 5 denotes a mold package substrate, and 6 denotes a silica filler.

Japanese Patent No. 3241338 JP 7-25987 A JP 2002-327126 A JP 2002-338833 A

  The present invention has been made in order to solve the above problems, and has a refractive index after curing of 1.45 or more, excellent sulfidation resistance, and can withstand thermal stress tests such as moisture absorption reflow and thermal shock tests. It is an object of the present invention to provide a resin composition for encapsulating an optical semiconductor element that can ensure long-term reliability, and a light-emitting device encapsulated with a cured product of the resin composition for encapsulating an optical semiconductor element.

  As a result of intensive studies to solve the above problems, the present inventors have (A) an organopolysiloxane having an aliphatic unsaturated bond-containing monovalent hydrocarbon group, and (B) a silicon atom in one molecule. An optical semiconductor containing an organohydrogenpolysiloxane containing two or more bonded hydrogen atoms, (C) a platinum-based catalyst, and (D) a glass filler having an anisotropic shape with an aspect ratio of 1.1 to 50 The light emitting device sealed with a cured product of the element sealing resin composition has excellent sulfidation resistance, and it can be found that long-term reliability that can withstand thermal stress tests such as moisture absorption reflow and thermal shock tests can be secured. The present invention has been completed.

（式中、ｋ，ｍは、５≦ｋ＋ｍ≦５００を満足する整数であり、０≦ｍ／（ｋ＋ｍ）≦０．５である。）
から選ばれるオルガノポリシロキサンであることを特徴とする請求項１記載の光半導体素子封止用樹脂組成物。
請求項３：
上記（Ｄ）異方性形状を有するガラスフィラーが、アスペクト比が１．１〜５０である鱗片状ガラス又はガラスカットファイバーであることを特徴とする請求項１又は２記載の光半導体素子封止用樹脂組成物。
請求項４：
上記（Ｄ）異方性形状を有するガラスフィラーを樹脂組成物全体の５〜６０質量％含有していることを特徴とする請求項１乃至３のいずれか１項記載の光半導体素子封止用樹脂組成物。
請求項５：
上記（Ｄ）異方性形状を有するガラスフィラーの屈折率が１．４５〜１．５５であり、かつ光半導体素子封止用樹脂組成物の硬化物の屈折率が１．４５〜１．５５であることを特徴とする請求項１乃至４のいずれか１項記載の光半導体素子封止用樹脂組成物。
請求項６：
請求項１乃至５のいずれか１項記載の光半導体素子封止用樹脂組成物の硬化物で封止された発光装置。
請求項７：
発光素子が搭載されるリードフレームを有するプレモールドパッケージを用い、発光素子をリードフレームに搭載し、封止樹脂組成物の硬化物で封止してなる発光ダイオード装置であって、上記封止樹脂組成物が請求項１乃至５のいずれか１項記載の樹脂組成物である発光ダイオード装置。 Accordingly, the present invention provides the following resin composition for sealing an optical semiconductor element and a light emitting device.
Claim 1:
(A) an organopolysiloxane having an aliphatic unsaturated bond-containing monovalent hydrocarbon group,
(B) an organohydrogenpolysiloxane containing two or more hydrogen atoms bonded to silicon atoms in one molecule;
(C) A platinum-based catalyst and (D) a glass filler having an anisotropic shape with an aspect ratio of 1.1 to 50 are contained, and the refractive index of the cured product is 1.45 or more. A resin composition for sealing an optical semiconductor element.
Claim 2:
The component (A) has the following formula

(In the formula, k and m are integers satisfying 5 ≦ k + m ≦ 500, and 0 ≦ m / (k + m) ≦ 0.5.)
The resin composition for sealing an optical semiconductor element according to claim 1, wherein the composition is an organopolysiloxane selected from the group consisting of:
Claim 3:
3. The optical semiconductor element sealing according to claim 1, wherein the glass filler having the (D) anisotropic shape is a glass flake or a glass cut fiber having an aspect ratio of 1.1 to 50. Resin composition.
Claim 4:
The glass filler having the (D) anisotropic shape is contained in an amount of 5 to 60% by mass of the entire resin composition, for sealing an optical semiconductor element according to any one of claims 1 to 3. Resin composition.
Claim 5:
(D) The refractive index of the glass filler having an anisotropic shape is 1.45 to 1.55, and the refractive index of the cured product of the resin composition for sealing an optical semiconductor element is 1.45 to 1.55. The resin composition for sealing an optical semiconductor element according to any one of claims 1 to 4, wherein the resin composition is for sealing an optical semiconductor element.
Claim 6:
The light-emitting device sealed with the hardened | cured material of the resin composition for optical semiconductor element sealing of any one of Claims 1 thru | or 5.
Claim 7:
A light emitting diode device using a pre-mold package having a lead frame on which a light emitting element is mounted, mounting the light emitting element on a lead frame, and sealing with a cured product of a sealing resin composition, wherein the sealing resin The light emitting diode device whose composition is the resin composition of any one of Claims 1 thru | or 5.

  ADVANTAGE OF THE INVENTION According to this invention, the resin composition for optical semiconductor element sealing which is excellent in sulfidation resistance, and can ensure long-term reliability which can endure thermal stress tests, such as moisture absorption reflow and a thermal shock test, and this optical semiconductor element sealing A light emitting device sealed with a cured product of the resin composition can be obtained.

It is sectional drawing which shows one Embodiment of the conventional light-emitting device. It is sectional drawing which shows one Embodiment of the light-emitting device of this invention.

Hereinafter, the present invention will be described in detail.
The resin composition for sealing an optical semiconductor element of the present invention is
(A) an organopolysiloxane having an aliphatic unsaturated bond-containing monovalent hydrocarbon group,
(B) an organohydrogenpolysiloxane containing two or more hydrogen atoms bonded to silicon atoms in one molecule;
It contains (C) a platinum-based catalyst and (D) a glass filler having an anisotropic shape.

（式中、Ｒ¹は脂肪族不飽和結合含有一価炭化水素基であり、Ｒ²〜Ｒ⁷はそれぞれ同一又は異種の一価炭化水素基であり、このうちＲ⁴〜Ｒ⁷は、好ましくは脂肪族不飽和結合を有しない一価炭化水素基であり、また、Ｒ⁶及び／又はＲ⁷は芳香族一価炭化水素基である。ａは０＜ａ≦５００、好ましくは１０≦ａ≦５００の整数であり、ｂは０≦ｂ≦２５０、好ましくは０≦ｂ≦１５０の整数であり、０＜ａ＋ｂ≦５００、好ましくは１０≦ａ＋ｂ≦５００である。）。 Component (A) The component (A) of the present invention is an organopolysiloxane having an aliphatic unsaturated bond-containing hydrocarbon group, and those represented by the following general formula (1) can be suitably used.

(In the formula, R ¹ is an aliphatic unsaturated bond-containing monovalent hydrocarbon group, and R ^{2 to} R ⁷ are the same or different monovalent hydrocarbon groups, among which R ^{4 to} R ⁷ are preferably Is a monovalent hydrocarbon group having no aliphatic unsaturated bond, and R ⁶ and / or R ⁷ is an aromatic monovalent hydrocarbon group, a is 0 < a ≦ 500, preferably 10 ≦ a ≦ 500, b is an integer of 0 ≦ b ≦ 250, preferably 0 ≦ b ≦ 150, and 0 < a + b ≦ 500, preferably 10 ≦ a + b ≦ 500.

In this case, R ¹ is a monovalent hydrocarbon group having an aliphatic unsaturated bond, particularly an aliphatic unsaturated double bond, preferably 2 to 8 carbon atoms, more preferably 2 to 6 carbon atoms. Specifically, the aliphatic unsaturated bond-containing monovalent hydrocarbon group represented by R ¹ is preferably an alkenyl group such as a vinyl group, an allyl group, a propenyl group, or a butenyl group, and particularly preferably a vinyl group or an allyl group.

R ^{2 to} R ⁷ are monovalent hydrocarbon groups, and those having 1 to 20 carbon atoms, particularly 1 to 10 carbon atoms are preferred. Specific examples of R ^{2 to} R ⁷ monovalent hydrocarbon groups include alkyl groups such as methyl, ethyl, propyl, and butyl; alkenyl groups such as vinyl, allyl, propenyl, and butenyl; phenyl Group, aryl group such as tolyl group and xylyl group; aralkyl group such as benzyl group, etc., among which R ^{4 to} R ⁷ are groups having no aliphatic unsaturated bond such as alkenyl group. Specifically, an alkyl group, an aryl group, an aralkyl group, and the like are preferable. R ⁶ and / or R ⁷ is preferably an aromatic monovalent hydrocarbon group such as an aryl group having 6 to 12 carbon atoms such as a phenyl group or a tolyl group.

  The organopolysiloxane represented by the general formula (1) includes, for example, cyclic diorganopolysiloxanes such as cyclic diphenylpolysiloxane and cyclic methylphenylpolysiloxane, and diphenyltetravinyldisiloxane and divinyltetraphenyldisiloxane constituting the terminal group. Although it can be obtained by alkali equilibration reaction with disiloxane such as siloxane, in this case, silanol groups and chloro components are usually not contained.

（上記式において、ｋ，ｍは、５≦ｋ＋ｍ≦５００を満足する整数であり、好ましくは５≦ｋ＋ｍ≦２５０であり、０≦ｍ／（ｋ＋ｍ）≦０．５である。） Specific examples of the organopolysiloxane represented by the general formula (1) include those represented by the following structural formula.

(In the above formula, k and m are integers satisfying 5 ≦ k + m ≦ 500, preferably 5 ≦ k + m ≦ 250, and 0 ≦ m / (k + m) ≦ 0.5.)

  In addition to the organopolysiloxane having the linear structure represented by the general formula (1), the component (A) includes a three-dimensional network structure containing a trifunctional siloxane unit, a tetrafunctional siloxane unit, and the like as necessary. It is also possible to use organopolysiloxanes having

  The content of the aliphatic unsaturated bond-containing monovalent hydrocarbon group in the component (A) is preferably 1 to 50 mol%, more preferably 2 to 40 mol%, more preferably all monovalent hydrocarbon groups. Preferably it is 5-30 mol%. If the content of the aliphatic unsaturated bond-containing monovalent hydrocarbon group is less than 1 mol%, a cured product may not be obtained, and if it is more than 50 mol%, the mechanical properties may be deteriorated.

  Moreover, it is preferable that content of the aromatic group in (A) component is 0-95 mol% of all the monovalent hydrocarbon groups, More preferably, it is 10-90 mol%, More preferably, it is 20-80 mol%. %. When an appropriate amount of the aromatic group is contained in the resin, there is an advantage that the mechanical properties are good and the production is easy. Another advantage is that the refractive index can be controlled by introducing an aromatic group.

Component (B) Component (B) is an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule. The organohydrogenpolysiloxane acts as a cross-linking agent, and the SiH group in the organohydrogenpolysiloxane and the aliphatic unsaturated bond-containing monovalent hydrocarbon group (typically an alkenyl group) of the component (A). ) And an addition reaction to form a cured product.

  In addition, the organohydrogenpolysiloxane has an aromatic hydrocarbon group, so that the organosilicon compound having an aliphatic unsaturated bond-containing monovalent hydrocarbon group as the component (A) has a high refractive index. The solubility can be increased and a transparent cured product can be provided. Therefore, in the organohydrogenpolysiloxane of the component (B), the organohydrogenpolysiloxane having an aromatic monovalent hydrocarbon group such as a phenyl group can be included as a part or all of the component (B). .

  In addition, in the organohydrogenpolysiloxane of the component (B), the organohydrogenpolysiloxane having a glycidyl structure can be included as part or all of the component (B), and the organohydrogenpolysiloxane has a glycidyl structure. By containing the containing group, a cured product of the resin composition for sealing an optical semiconductor element having high adhesion to the substrate can be provided.

Specific examples of the organohydrogenpolysiloxane include, but are not limited to, 1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, tris ( Dimethylhydrogensiloxy) methylsilane, tris (dimethylhydrogensiloxy) phenylsilane, 1-glycidoxypropyl-1,3,5,7-tetramethylcyclotetrasiloxane, 1,5-glycidoxypropyl-1,3 , 5,7-tetramethylcyclotetrasiloxane, 1-glycidoxypropyl-5-trimethoxysilylethyl-1,3,5,7-tetramethylcyclotetrasiloxane, trimethylsiloxy group-blocked methylhydrogenpolysiloxane at both ends , Trimethylsiloxy group-blocked dimethyl at both ends Loxane / methylhydrogensiloxane copolymer, both ends dimethylhydrogensiloxy-blocked dimethylpolysiloxane, both ends dimethylhydrogensiloxy-blocked dimethylsiloxane / methylhydrogensiloxane copolymer, both ends trimethylsiloxy-blocked methylhydrogen Siloxane / diphenylsiloxane copolymer, trimethylsiloxy group-blocked methylhydrogensiloxane / diphenylsiloxane / dimethylsiloxane copolymer, trimethoxysilane polymer, (CH ₃ ) ₂ HSiO _1/2 unit and SiO _4/2 unit And a copolymer composed of (CH ₃ ) ₂ HSiO _1/2 units, SiO _4/2 units, and (C ₆ H ₅ ) SiO _3/2 units.

Moreover, the organohydrogenpolysiloxane obtained using the unit shown by the following structural formula can also be used.

Examples of the organohydrogenpolysiloxane obtained by using the unit represented by the above structural formula include the following.

  The molecular structure of such an organohydrogenpolysiloxane may be any of linear, cyclic, branched, and three-dimensional network structures, and the number of silicon atoms (or the degree of polymerization) in one molecule is two. As mentioned above, the thing about 2-1,000, More preferably, about 2-300 can be used.

  The compounding amount of such an organohydrogenpolysiloxane is such that (A) component-containing aliphatic unsaturated bond-containing monovalent hydrocarbon group (typically alkenyl group) per (B) component silicon-bonded hydrogen. The amount is preferably sufficient to give 0.75 to 2.0 atoms (SiH groups). If the amount is less than 0.75, the hardness may be low. If the amount is more than 2.0, SiH groups may remain and the hardness may change over time.

Component (C) The component (C) is a platinum catalyst. Examples of the platinum-based catalyst include chloroplatinic acid, alcohol-modified chloroplatinic acid, platinum complexes having a chelate structure, and the like. These can be used alone or in combination of two or more.

  The compounding amount of these catalyst components may be a so-called catalyst amount, and is usually 0.1 to 500 ppm in terms of platinum group metal mass per 100 parts by mass of the total amount of the above components (A) and (B). In particular, it is preferable to use in the range of 0.5 to 100 ppm.

Component (D) The component (D) is a glass filler having an anisotropic shape with an aspect ratio of 1.1 to 50. The aspect ratio of the glass filler having the anisotropic shape is preferably 1.5 to 30, and more preferably 2 to 20. If the aspect ratio exceeds 50, the ejection accuracy when sealing the resin may not be stable. As such a glass filler, scaly glass, glass cut fiber or the like is preferably used. The length or average particle size of the glass filler having the anisotropic shape is preferably 1 mm or less, and more preferably 0.005 to 0.5 mm. If it exceeds 1 mm, the discharge accuracy when sealing the resin may not be stable. Moreover, as an average particle diameter, 1-50 micrometers, especially 10-20 micrometers are preferable. In addition, length or an average particle diameter can be calculated | required by microscope observation, and is an average value of 50 specimens.

  The refractive index of the glass filler having the anisotropic shape is preferably 1.45 to 1.55. If it is out of the above range, the refractive index difference with the silicone resin becomes large, and the transparency of the mixture may be impaired.

  A commercially available product can be used as the glass filler having the anisotropic shape, for example, glass flake (registered trademark) manufactured by Nippon Sheet Glass Co., Ltd. (product numbers: REF-600, REF-160) as scale-like glass. , REF-015, etc.) can be preferably used. Further, milled fibers (product numbers: PFE-001, PFE-301, etc.) manufactured by Nitto Boseki Co., Ltd. can be suitably used as glass cut fibers.

  In the case of a filler having an isotropic shape, there is no difference in the linear expansion coefficient of the resin between the in-plane direction and the vertical direction. However, when fillers with an anisotropic shape are filled, the linear expansion coefficient differs in the direction perpendicular to the in-plane direction of the resin, and the linear expansion coefficient in the in-plane direction is smaller than that in the vertical direction, reducing stress in the in-plane direction. can do. In the case of the pre-mold package, since the linear expansion of the metal frame and the linear expansion of the molding material interact in an in-plane direction, the stress on the sealant becomes larger than that in the vertical direction. Therefore, when curable silicone in which filler having an anisotropic shape as described above is dispersed as a sealing resin, stress in the in-plane direction can be relieved, so thermal stress tests such as moisture absorption reflow and thermal shock tests It is thought that a great effect can be obtained.

(E) Other components The resin composition for sealing an optical semiconductor element used in the present invention contains the above-described components (A) to (D) as essential components, and further, if necessary for improving adhesiveness. Various silane coupling agents may be added.

  Examples of the silane coupling agent include vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-glycidoxypropyl. Methyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxy Silane, N-2 (aminoethyl) 3-aminopropylmethyldimethoxysilane, N-2 (aminoethyl) 3-aminopropyltrimethoxysilane, N-2 (aminoethyl) 3-aminopropyltriethoxysilane, -Aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxylane, 3-mercaptopropyltrimethoxysilane, trimethoxysilane, tetramethoxysilane and oligomers thereof It is done. These silane coupling agents can be used alone or in combination of two or more.

  It is preferable that the compounding quantity of a silane coupling agent is 10 mass% or less (0-10 mass%) of the whole composition, and especially 5 mass% or less (0-5 mass%).

In addition, the resin composition for encapsulating an optical semiconductor element used in the present invention includes, for example, an antioxidant such as BHT and vitamin B, an organic phosphorus type, as long as it does not deteriorate the performance of the optical semiconductor device. Anti-discoloring agents such as anti-discoloring agents, photodegradation preventing agents such as hindered amines, reactive diluents such as vinyl ethers, vinyl amides, epoxy resins, oxetanes, allyl phthalates, vinyl adipate, fumed silica and precipitated silica A reinforcing filler such as a flame retardant, a flame retardant, a phosphor, an organic solvent, or the like may be added. Moreover, you may color with a coloring component.

  The cured product of the resin composition for sealing an optical semiconductor element of the present invention is used for sealing an optical semiconductor element, and the optical semiconductor is not limited to these. For example, a light emitting diode, a phototransistor, and a photodiode CCD, solar cell module, EPROM, photocoupler, and the like, which are particularly effective for sealing light emitting diodes. In this case, as a sealing method, a conventional method according to the type of the optical semiconductor element is employed.

  The curing condition of the resin composition for encapsulating an optical semiconductor element of the present invention may be a temperature range from room temperature to about 200 ° C., and a time range of about several tens of seconds to several days may be considered. A time range of about 1 minute to about 10 hours is preferable in the temperature range of ° C.

  Moreover, the refractive index of the hardened | cured material of the resin composition for optical semiconductor element sealing of this invention is 1.45 or more, and it is preferable that it is 1.45-1.55. If it is less than 1.45, the gas permeability may be lowered and the sulfidation resistance may be lowered. If it exceeds 1.55, the heat resistance may be lowered and the long-term reliability may be lowered. In addition, the refractive index of hardened | cured material can be match | combined with a desired value by adjusting content of aromatic monovalent hydrocarbon groups, such as a phenyl group in (A) component and the (B) component depending on the case. . In general, the refractive index increases as the amount of aromatic monovalent hydrocarbon group increases. Moreover, it is preferable that the difference of the refractive index of hardened | cured material and the refractive index of (D) component is 0-0.1, especially 0-0.05.

  FIG. 2 is a cross-sectional view schematically showing one embodiment of the light emitting device of the present invention. The optical semiconductor element 1 is installed in the recess of the mold package substrate 5, and the silver-plated lead frame 3 and the optical semiconductor element 1 are connected through the conductive wire 2. The resin composition 4 for sealing an optical semiconductor element in which a glass filler 7 having an anisotropic shape is blended is poured into a concave portion of the mold package substrate 5 on which the optical semiconductor element 1 is installed, and the resin composition 4 is cured by curing the resin composition 4. The light emitting device is manufactured.

  An optical semiconductor device coated and protected with a cured product of the resin composition for encapsulating an optical semiconductor element of the present invention has excellent heat resistance, moisture resistance, and light resistance of the device without discoloring the substrate surface due to the influence of the external environment. As a result, it is possible to provide an optical semiconductor device with excellent reliability, and there are significant industrial advantages.

  EXAMPLES The present invention will be specifically described below with reference to examples and comparative examples, but the present invention is not limited to the following examples. In the following examples, parts represent parts by mass, Me represents a methyl group, Et represents an ethyl group, and the viscosity is a value measured by a rotational viscometer.

で示される両末端ジメチルビニルシリル基封鎖ジメチルジフェニルポリシロキサン（粘度３Ｐａ・ｓ）１００部、（Ｂ）成分として、下記式（ＩＩ）

で示される両末端ジメチルハイドロジェンシリル基封鎖メチルハイドロジェンポリシロキサン（粘度１５ｍＰａ・ｓ）２．５部、（Ｃ）成分として、塩化白金酸２−エチルヘキシルアルコール変性溶液（Ｐｔ濃度２質量％）０．０３部、更にエチニルシクロヘキシルアルコール０．０５部、及び３−グリシドキシプロピルトリメトキシシラン７部をよく撹拌して屈折率１．５１のベースコンパウンドを調製した。 [Preparation of base compound]
As the component (A), the following formula (I)

100 parts of dimethyldiphenylpolysiloxane (viscosity: 3 Pa · s) blocked at both ends with dimethylvinylsilyl group, represented by the following formula (II)

Dimethylhydrogensilyl group-blocked methylhydrogenpolysiloxane (viscosity 15 mPa · s) represented by the formula: 2.5 parts of (C) component, chloroplatinic acid 2-ethylhexyl alcohol modified solution (Pt concentration 2 mass%) 0 A base compound having a refractive index of 1.51 was prepared by thoroughly stirring 0.03 parts, 0.05 parts of ethynylcyclohexyl alcohol, and 7 parts of 3-glycidoxypropyltrimethoxysilane.

[Example 1]
Glass flake (registered trademark) manufactured by Nippon Sheet Glass Co., Ltd. having a refractive index of 1.51 (product number: REP-015, average particle size: 15 μm, aspect ratio: 3 to 10) as the component (D) in the base compound. A non-encapsulated light-emitting diode (LED) was filled with a dispersion of 10% by mass, and was finally cured under conditions of 150 ° C. for 4 hours to produce a light-emitting diode for evaluation.

[Example 2]
Glass flake (registered trademark) manufactured by Nippon Sheet Glass Co., Ltd. having a refractive index of 1.51 (product number: REP-015, average particle size: 15 μm, aspect ratio: 3 to 10) as the component (D) in the base compound. A non-encapsulated light emitting diode (LED) was filled with a dispersion of 50% by mass, and was finally cured at 150 ° C. for 4 hours to produce an evaluation light emitting diode.

[Example 3]
To the above base compound, milled fiber manufactured by Nitto Boseki Co., Ltd. having a refractive index of 1.51 as the component (D) (product number: PFE-301, fine powdery glass fiber, average particle size 10 μm, aspect ratio: 1.1 to 10) was dispersed in a concentration of 10% by mass into an unsealed light emitting diode (LED), and was finally cured at 150 ° C. for 4 hours to produce a light emitting diode for evaluation.

[Example 4]
To the above base compound, milled fiber manufactured by Nitto Boseki Co., Ltd. having a refractive index of 1.51 as the component (D) (product number: PFE-301, fine powdery glass fiber, average particle size 10 μm, aspect ratio: 1.1 to 10) was dispersed in a concentration of 50% by mass, filled in an unsealed light emitting diode (LED), and finally cured at 150 ° C. for 4 hours to produce a light emitting diode for evaluation.

[Comparative Example 1]
Only the base compound was filled in an unsealed light emitting diode (LED), and was subjected to main curing at 150 ° C. for 4 hours to produce a light emitting diode for evaluation.

[Comparative Example 2]
A non-encapsulated luminescent material obtained by dispersing a spherical silica filler (trade name: high-purity FF-L, average particle size: 3 μm) manufactured by Tatsumori Co., Ltd. to a concentration of 10% by mass in the base compound. A light-emitting diode for evaluation was produced by filling a diode (LED) and performing main curing at 150 ° C. for 4 hours.

[Comparative Example 3]
A non-encapsulated luminescent material in which a spherical silica filler (trade name: high purity FF-L, average particle size: 3 μm) manufactured by Tatsumori Co., Ltd. is dispersed in the above base compound so as to have a concentration of 50% by mass. A light-emitting diode for evaluation was produced by filling a diode (LED) and performing main curing at 150 ° C. for 4 hours.

  The evaluation light-emitting diodes prepared in the above examples and comparative examples were left for 168 hours at a high temperature and high humidity of 85 ° C./60% RH, and then passed through IR reflow three times at 260 ° C., resulting in poor resin peeling and cracking. Development was observed with a stereomicroscope. Subsequently, a thermal shock test was performed at −40 ° C./30 minutes to 120 ° C./30 minutes. Similarly, the occurrence of defective resin peeling and cracking was observed with a stereomicroscope. Moreover, the lighting test by an electricity supply test was implemented. The results are shown in Table 1.

  In Examples 1 to 4, there were no defects such as resin peeling and cracking in the moisture absorption reflow test and thermal shock test, and no LED non-lighting failure occurred. However, in Comparative Example 1, cracking of the resin occurred in the moisture absorption reflow test. In Comparative Example 2, both resin cracking and resin peeling occurred, and in Comparative Example 3, no resin cracking occurred, but resin peeling occurred. As a result, non-lighting failure occurred in some LEDs.

DESCRIPTION OF SYMBOLS 1 Optical semiconductor element 2 Conductive wire 3 Silver plating lead frame 4 Resin for optical semiconductor element sealing 5 Mold package board | substrate 6 Silica filler 7 Glass filler which has anisotropic shape

Claims (7)

(A) an organopolysiloxane having an aliphatic unsaturated bond-containing monovalent hydrocarbon group,
(B) an organohydrogenpolysiloxane containing two or more hydrogen atoms bonded to silicon atoms in one molecule;
(C) A platinum-based catalyst and (D) a glass filler having an anisotropic shape with an aspect ratio of 1.1 to 50 are contained, and the refractive index of the cured product is 1.45 or more. A resin composition for sealing an optical semiconductor element. The component (A) has the following formula

(In the formula, k and m are integers satisfying 5 ≦ k + m ≦ 500, and 0 ≦ m / (k + m) ≦ 0.5.)
The resin composition for sealing an optical semiconductor element according to claim 1, wherein the composition is an organopolysiloxane selected from the group consisting of:   3. The optical semiconductor element sealing according to claim 1, wherein the glass filler having the (D) anisotropic shape is a glass flake or a glass cut fiber having an aspect ratio of 1.1 to 50. Resin composition.   The glass filler having the (D) anisotropic shape is contained in an amount of 5 to 60% by mass of the entire resin composition, for sealing an optical semiconductor element according to any one of claims 1 to 3. Resin composition. (D) The refractive index of the glass filler having an anisotropic shape is 1.45 to 1.55, and the refractive index of the cured product of the resin composition for sealing an optical semiconductor element is 1.45 to 1.55. The resin composition for sealing an optical semiconductor element according to any one of claims 1 to 4, wherein the resin composition is for sealing an optical semiconductor element.   The light-emitting device sealed with the hardened | cured material of the resin composition for optical semiconductor element sealing of any one of Claims 1 thru | or 5.   A light emitting diode device using a pre-mold package having a lead frame on which a light emitting element is mounted, mounting the light emitting element on a lead frame, and sealing with a cured product of a sealing resin composition, wherein the sealing resin The light emitting diode device whose composition is the resin composition of any one of Claims 1 thru | or 5.

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