TWI491674B - A resin composition for a light-emitting semiconductor element, and a light-emitting device - Google Patents

Description

Resin composition for optical semiconductor element sealing and light-emitting device

The present invention relates to a resin composition for sealing a polyfluorene-based optical semiconductor element, and a light-emitting device sealed by a cured product of the resin composition.

In the resin composition for coating protection of an optical semiconductor element such as a light-emitting diode (LED), the cured product of the resin composition is required to have transparency, and the composition generally uses a bisphenol A-type ring. An epoxy resin composition such as an epoxy resin or an alicyclic epoxy resin and an acid anhydride-based curing agent (refer to Patent Document 1: Japanese Patent No. 3241338, Patent Document 2: Japanese Patent Laid-Open No. 7-25987 Bulletin).

However, since the cured product of the epoxy resin composition has low light transmittance to short-wavelength light, it has low light durability and coloring due to photodegradation. Therefore, there is proposed a resin composition for coating protection of an optical semiconductor element, which comprises an organic compound containing at least two SiH groups and a reactive carbon-carbon double bond in one molecule, and at least 2 molecules in one molecule. For example, JP-A-2002-327126, and JP-A-2002-338833, JP-A-2002-338833, and JP-A-2002-338833.

However, compared with the cured product of the conventional epoxy resin composition, the cured product of the above polyoxyxylene resin composition, particularly the cured product of the polyoxyxylene resin composition having a refractive index of less than 1.45, has a high gas permeability. The disadvantage of penetrating the sulfur-containing gas present in the storage environment and the use environment. Therefore, the sulfur-plated surface of the lead frame of the LED package substrate is changed to the vulcanized silver sulfide by the sulfur-containing gas which penetrates the hardened material of the polyoxymethylene resin composition, and as a result, a silver-plated surface black is produced. Problem.

In general, the gas permeability of the cured product of the polyoxyxene resin composition is 20 g/m ² ‧24 hr or more, and particularly, the cured product of the polyoxyxylene resin composition having a refractive index of less than 1.45 has a gas permeability of 50 g/m. ² ‧ 24 hr or more, so that the sulfur-containing gas in the external environment can be easily penetrated. Examples of the sulfur-containing gas present in the external environment include sulfur oxides in the atmosphere (SO _X ), and sulfur components contained in a ochre material such as a carton. Further, from the viewpoint of light reflection efficiency, the lead frame surface of the LED package is generally subjected to silver plating treatment. On the silver-plated lead frame described above, the light-emitting diode enclosed by the cured product of the polyoxynoxy resin composition having a refractive index of less than 1.45 is placed in the presence of a sulfur-containing gas, and the sulfur-containing gas is worn. The cured product of the silicone resin composition is permeable and subjected to a sulfurization reaction of silver. As a result, silver sulfide is generated on the surface of the lead frame. Due to the formation of the silver sulfide, the surface of the LED package substrate is blackened, and the light reflection efficiency is remarkably lowered, which is one of the main reasons why long-term reliability cannot be maintained.

Therefore, in recent years, proposals have been made to solve the problem of vulcanization of the silver-plated surface by using a polyoxyxylene resin composition having a small gas permeability and a refractive index of 1.45 or more after curing. However, compared with the cured product of the polyoxyxene resin composition having a refractive index of less than 1.45, the cured product of the polyoxynoxy resin composition having a refractive index of 1.45 or more is brittle and has low strength, so that moisture absorption reflow and thermal shock are performed. In the thermal stress test such as the test, resin cracking occurs and the reliability test fails.

In general, in order to enhance the strength of the cured product of the polyoxymethylene resin composition, a method of using a ceria filler as a filler is known. However, the shape of the cerium oxide filler is the same, and the polyfluorene resin composition containing the above cerium oxide filler is used in the case of the pre-molding sealing agent shown in Fig. 1, although In the past, the defect rate of the reliability test was improved, but the thermal stress such as moisture absorption reflow and thermal shock test was complicated for the sealing resin, and only the effect of the cerium oxide filler was enhanced, and not only the heat resistant stress but also the resin body was caused. The badness of cracking occurs, and it is difficult to make the defect rate zero. 1 is a cross-sectional view showing an embodiment of a conventional light-emitting device, wherein 1 denotes an optical semiconductor element, 2 denotes a conductive line, 3 denotes a silver-plated lead frame, 4 denotes an optical semiconductor element sealing resin, and 5 denotes The molded package substrate and 6 represent a ruthenium dioxide filler.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 3241338

[Patent Document 2] Japanese Patent Laid-Open No. 7-25987

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2002-327126

[Patent Document 4] Japanese Patent Laid-Open Publication No. 2002-338833

The present invention has been developed in order to solve the above problems, and an object of the present invention is to provide a long-term reliability of a thermal stress test such as a moisture repellent reflow or a thermal shock test, which is excellent in sulfuric acid resistance after curing, and has a refractive index of 1.45 or more. A light-emitting device in which a resin composition for sealing an optical semiconductor element and a cured product of the resin composition for sealing the optical semiconductor element are sealed.

As a result of intensive studies to solve the above problems, the present inventors have found that (A) an organic polyoxyalkylene having one hydrocarbon group having an aliphatic unsaturated bond and (B) containing two or more molecules in one molecule are used. An optical semiconductor element for sealing an organic hydrogen polyoxyalkylene bonded to a hydrogen atom of a halogen atom, (C) a platinum-based catalyst, and (D) a glass filler having an anisotropic shape having an aspect ratio of 1.1 to 50 The light-emitting device in which the cured product of the resin composition is sealed is excellent in vulcanization resistance, and can ensure long-term reliability against thermal stress tests such as moisture absorption reflow or thermal shock test, and the present invention has been completed.

Therefore, the present invention provides the following resin composition for encapsulating an optical semiconductor element and a light-emitting device.

Patent application scope 1:

A resin composition for encapsulating an optical semiconductor element, comprising: (A) an organopolyoxane having a monovalent hydrocarbon group containing an aliphatic unsaturated bond, and (B) having two or more bonds in one molecule An organic hydrogen polyoxyalkylene of a hydrogen atom of a halogen atom, (C) a platinum-based catalyst, and (D) a glass filler having an anisotropic shape having an aspect ratio of 1.1 to 50, and a refractive index of the cured product of 1.45 the above.

Patent application scope 2:

The resin composition for encapsulating an optical semiconductor element according to the first aspect of the invention, wherein the component (A) is an organopolysiloxane selected from the group consisting of

【化1】

(wherein k and m satisfy an integer of 0≦k+m≦500, 0≦(k+m)≦0.5).

Patent application scope 3:

The resin composition for encapsulating an optical semiconductor element according to the first aspect or the second aspect of the invention, wherein the (D) glass filler having an anisotropic shape is a scaly glass or glass having an aspect ratio of 1.1 to 50. Cutting the fiber.

Patent application scope 4:

The resin composition for encapsulating an optical semiconductor element according to any one of the first to third aspects of the present invention, wherein the (D) having an anisotropic shape is contained in an amount of 5 to 60% by mass based on the entire resin composition. Glass filler.

Patent application scope 5:

The resin composition for encapsulating an optical semiconductor element according to any one of the above-mentioned (D), wherein the glass filler having an anisotropic shape has a refractive index of 1.45 to 1.55, and the above The cured product of the curable polyoxynene resin composition has a refractive index of 1.45 to 1.55.

Patent application scope 6:

A light-emitting device which is closed by a cured product of a resin composition for encapsulating an optical semiconductor element according to any one of the first to fifth aspects of the invention.

Patent application scope 7:

A light-emitting diode device using a preform package having a lead frame on which a light-emitting element is mounted, and mounting the light-emitting element on a lead frame, which is closed by a cured product of a sealing resin composition, and the above-mentioned sealing resin composition The resin composition as described in any one of claims 1 to 5.

According to the present invention, it is possible to obtain a resin composition for encapsulating an optical semiconductor element which is excellent in vulcanization resistance and can ensure long-term reliability in thermal stress tests such as moisture absorption reflow or thermal shock test, and a resin for sealing the optical semiconductor element. A light-emitting device enclosed by a hardened material.

[Best Mode for Carrying Out the Invention]

Hereinafter, the present invention will be described in detail.

The resin composition for encapsulating an optical semiconductor element of the present invention contains:

(A) an organopolyoxane having a monovalent hydrocarbon group containing an aliphatic unsaturated bond,

(B) an organohydrogen polyoxyalkylene containing two or more hydrogen atoms bonded to a halogen atom in one molecule,

(C) platinum-based catalyst, and

(D) A glass filler having an anisotropic shape.

(A) component

The component (A) of the present invention is an organopolyoxyalkylene having a hydrocarbon group containing an aliphatic unsaturated bond, and can be suitably used as shown in the following general formula (1).

[Chemical 2]

(Wherein, R ¹ is based, one containing an aliphatic unsaturated bond monovalent hydrocarbon group, R ² ~ R ⁷ are the same or different one-based monovalent hydrocarbon group, wherein R ⁴ ~ R ⁷ is preferably not contain an aliphatically unsaturated bond of a monovalent hydrocarbon group, further, R ⁶ and/or R ⁷ is an aromatic monovalent hydrocarbon group. a is 0 ≦ a ≦ 500, preferably an integer of 10 ≦ a ≦ 500; b is 0 ≦ b ≦ 250, preferably An integer of 0 ≦ b ≦ 150; 0 ≦ a + b ≦ 500, preferably 10 ≦ a + b ≦ 500).

In this case, R ¹ has an aliphatic unsaturated bond, and particularly preferably has an aliphatic unsaturated double bond of 2 to 8 carbon atoms, more preferably 2 to 6 carbon monovalent hydrocarbon groups. The monovalent hydrocarbon group containing an aliphatic unsaturated bond of R ¹ , specifically, an alkenyl group such as a vinyl group, an allyl group, a propenyl group or a butenyl group, preferably a vinyl group or a propylene group. The base (allyl) is especially good.

R ² to R ⁷ are monovalent hydrocarbon groups, and those having a carbon number of from 1 to 20, particularly from 1 to 10, are suitable. The monovalent hydrocarbon group of R ² to R ⁷ may specifically be an alkyl group such as a methyl group, an ethyl group, a propyl group or a butyl group; a vinyl group, an allyl group, a propenyl group or a butyl group; An alkenyl group such as an alkenyl group; an aryl group such as a phenyl group, a tolyl group or a xylyl group; an aralkyl group such as a benzyl group; and the like, wherein R ⁴ to R ⁷ are an aliphatic unsaturated bond having no alkenyl group or the like. The base is preferred, and specifically, an alkyl group, an aryl group, an aralkyl group or the like is preferred. Further, R ⁶ and/or R ⁷ are preferably an aromatic monovalent hydrocarbon group such as an aryl group having 6 to 12 carbon atoms such as a phenyl group or a tolyl group.

The organopolyoxane represented by the above general formula (1) may be a cyclic diorganopolyoxygen oxide such as a cyclic diphenyl polysiloxane or a cyclic methylphenyl polyoxyalkylene. The alkane is obtained by a base equilibrium reaction with a dioxane such as diphenyltetraethylenedioxane or diethylenetetraphenyldioxane which constitutes a terminal group, but in this case, usually does not contain a decyl group. And chlorine.

The organopolyoxyalkylene represented by the above general formula (1) is specifically exemplified by the following structural formula.

[化3]

(In the above formula, k and m satisfy an integer of 0≦k+m≦500, preferably 5≦k+m≦250, and 0≦m/(k+m)≦0.5).

In addition to the organopolyoxane having the linear structure represented by the above general formula (1), the component (A) may be optionally used in combination with a trifunctional azide unit, a tetrafunctional azide unit, or the like. An organic polyoxane of a three-dimensional network structure.

The content of the monovalent hydrocarbon group containing an aliphatic unsaturated bond in the component (A) is preferably from 1 to 50 mol%, more preferably from 2 to 40 mol%, more preferably from 5 to 10% by mol of the monovalent hydrocarbon group. 30 moles %. When the content of the monovalent hydrocarbon group containing an aliphatic unsaturated bond is less than 1 mol%, the cured product cannot be obtained; if it is more than 50 mol%, the mechanical properties are deteriorated.

Further, the content of the aromatic group in the component (A) is preferably from 0 to 95 mol%, more preferably from 10 to 90 mol%, still more preferably from 20 to 80 mol%, based on the total monovalent hydrocarbon group. An appropriate amount of an aromatic group in the resin has an advantage of being excellent in mechanical properties and being easy to manufacture. Further, another advantage can be cited in that the refractive index can be controlled by introduction of an aromatic group.

(B) component

The component (B) is an organohydrogen polyoxyalkylene containing two or more hydrogen atoms bonded to a halogen atom in one molecule. The above-mentioned organohydrogen polyoxyalkylene is used as a crosslinking agent, and the monovalent hydrocarbon group (typically an alkene) of the SiH group in the organic hydrogen polyoxyalkylene and the aliphatic unsaturated bond of the component (A) The base is subjected to an addition reaction to form a hardened substance.

Further, since the above-mentioned organic hydrogen polyoxyalkylene has an aromatic hydrocarbon group, when the organic ruthenium compound having one of the aliphatic unsaturated groups containing the aliphatic unsaturated bond of the above component (A) has a high refractive index, the phase can be improved. It is soluble and imparts a transparent cured product. Therefore, the organic hydrogen polyoxyalkylene of the component (B) may contain an organic hydrogen polyoxyalkylene having an aromatic monovalent hydrocarbon group such as a phenyl group as part or all of the component (B).

Further, in the organic hydrogen polyoxyalkylene of the component (B), an organohydrogen polyoxyalkylene having a glycidyl structure may be contained as a part or all of the component (B), an organohydrogenpolyoxane, Since the epoxy group-containing structure is provided, it is possible to provide a cured product of the resin composition for encapsulating the optical semiconductor element having high adhesion to the substrate.

The organic hydrogen polyoxyalkylene is specifically not limited thereto, and examples thereof include 1,1,3,3-tetramethyldioxane and 1,3,5,7-tetramethylcyclotetra Oxane, tris(dimethylhydroperoxy)methane, tris(dimethylhydroquinooxy)phenylnonane,glycidoxypropyl-1,3,5, 7-Tetramethylcyclotetraoxane, 1,5-glycidoxypropyl-1,3,5,7-tetramethylcyclotetraoxane, 1-glycidoxypropyl- 5-trimethoxysilylethyl-1,3,5,7-tetramethylcyclotetraoxane, two-terminal trimethylphosphonium-terminated methylhydrogenpolyoxyalkylene, two terminal three Methyl methoxy-terminated dimethyl oxane ‧ methyl hydrazine copolymer, two-terminal dimethyl hydroquinone-terminated dimethyl polyoxy siloxane, two-terminal dimethyl hydroquinone Base-terminated dimethyloxane ‧ methylhydroquinoxane copolymer, two-terminal trimethyl methoxy-terminated methyl hydroquinone ‧ diphenyl decane copolymer, two-terminal trimethyl矽oxy-terminated methylhydroquinoxane, diphenyloxane, dimethyl methoxy hydride copolymer, trimethyl oxane polymer, (CH ₃ ) ₂ HSiO _1/2 unit and SiO a copolymer composed of _4/2 units, a copolymer of (CH ₃ ) ₂ HSiO _1/2 unit, and a copolymer of SiO _4/2 unit and (C ₆ H ₅ )SiO _3/2 unit.

Further, an organohydrogenpolyoxyalkylene obtained by using the unit represented by the following structural formula may also be used.

【化4】

The organohydrogen polyoxyalkylene obtained by using the unit shown by the above structural formula is as follows.

【化5】

The molecular structure of the above-mentioned organic hydrogen polyoxyalkylene may be any of linear, cyclic, branched, and three-dimensional network structures, and the number of germanium atoms (or polymerization degree) in one molecule may be 2 One or more, preferably 2 to 1,000, more preferably 2 to 300 or so.

The amount of the above-mentioned organic hydrogen polyoxyalkylene is preferably 0.75 to 2.0 (B) for one of the aliphatic unsaturated groups (typically alkenyl groups) of the aliphatic unsaturated bond per component (A). A sufficient amount of a hydrogen atom (SiH group) bonded to a ruthenium atom in the composition. When the amount is less than 0.75, the hardness may be lowered. When the amount is more than 2.0, the SiH group may remain and the hardness may change with time.

(C) component

The component (C) is a platinum-based catalyst. Examples of the platinum-based catalyst include chloroplatinic acid, alcohol-modified chloroplatinic acid, and a platinum complex of a chelate structure. These may be used alone or in combination of two or more.

The amount of the catalyst component to be added, that is, the amount of the catalyst, is usually 100 parts by mass of the total amount of the components (A) and (B), and is preferably 0.1 to 500 ppm in terms of the mass of the platinum group metal, particularly It is preferably in the range of 0.5 to 100 ppm.

(D) component

The component (D) is a glass material having an anisotropic shape having an aspect ratio of 1.1 to 50. The aspect ratio of the glass crucible having the anisotropic shape is preferably from 1.5 to 30, more preferably from 2 to 20. When the aspect ratio exceeds 50, the discharge accuracy when the resin is sealed may be unstable. As the glass filler, scaly glass, glass cut fiber, or the like is suitably used. Further, the length or average particle diameter of the glass filler having the above anisotropic shape is preferably 1 mm or less, more preferably 0.005 to 0.5 mm. If it exceeds 1 mm, there is a case where the discharge accuracy is unstable when the resin is sealed. Further, the average particle diameter is preferably from 1 to 50 μm, particularly preferably from 10 to 20 μm. Further, the length or the average particle diameter can be obtained by observation with a microscope, and is an average value of 50 test pieces.

The refractive index of the glass filler having the above anisotropic shape is preferably 1.45 to 1.55. If it exceeds the above range, the difference in refractive index from the polyoxyxylene resin may increase, and the transparency of the mixture may be impaired.

As the glass filler having the above-described anisotropic shape, a commercially available product can be used. For example, a scaly glass can be suitably used for a glass sheet (registered trademark) manufactured by Nippon Sheet Glass Co., Ltd. (Product No.: REF-600, REF-160) , REF-015, etc.). In addition, the glass-cut fiber may be suitably used as the ground fiber (product number: PFE-001, PFE-301, etc.) manufactured by Nitto Denko.

In the case of a filler having the same orientation, the linear expansion coefficient of the resin does not differ in the in-plane direction and the vertical direction. However, in the case of filling a filler having an anisotropic shape, the coefficient of linear expansion in the in-plane direction and the vertical direction of the resin is different, and the coefficient of linear expansion in the in-plane direction becomes smaller than the vertical direction, and the surface can be relaxed. Stress in the inner direction. Further, in the case of the preformed package, since the linear expansion of the metal frame in the in-plane direction and the linear expansion of the molding material are complicated, the stress on the sealant becomes larger than the vertical direction. Therefore, in the case of using a curable polyfluorene gas having a filler having an anisotropic shape as described above as a sealing resin, since the stress in the in-plane direction can be alleviated, it is considered that thermal stress for moisture absorption reflow or impact resistance test or the like is considered. The test can get a lot of results.

(E) Other ingredients

In the resin composition for encapsulating an optical semiconductor element used in the present invention, the above-mentioned components (A) to (D) are essential components. However, in order to improve the adhesion, various decane coupling agents may be further added as needed.

Examples of the decane coupling agent include ethylene trimethoxy decane, ethylene triethoxy decane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxy decane, and 3-glycidoxypropyltrimethoxy decane. 3-glycidoxypropylmethyldiethoxydecane, 3-glycidoxypropyltriethoxydecane, 3-methylpropenyloxypropylmethyldimethoxydecane, 3-methyl Propylene oxime propyl trimethoxy decane, 3-methyl propylene oxiranyl methyl diethoxy decane, 3-methyl propylene oxypropyl triethoxy decane, N-2 (aminoethyl) 3- Aminopropyl methyldimethoxydecane, N-2 (aminoethyl) 3-aminopropyltrimethoxyoxane, N-2 (aminoethyl) 3-aminopropyltriethoxy decane, 3-aminopropyltrimethoxy decane, 3-aminopropyltriethoxy decane, N-phenyl-3-aminopropyltrimethoxy decane, 3-thiolpropyltrimethoxydecane, etc., or Trimethoxy decane, tetramethoxy decane, oligomers thereof, and the like. These decane coupling agents may be used singly or in combination of two or more kinds.

The blending amount of the decane coupling agent is preferably 10% by mass or less (0 to 10% by mass) based on the entire composition, and particularly preferably 5% by mass or less (0 to 5% by mass).

In addition, the addition-hardening type polyoxo resin composition used in the present invention may contain, for example, an antioxidant such as BHT or vitamin B, or an organic phosphorus, in a range where the performance of the optical semiconductor device is not deteriorated. Anti-tarnishing agent such as anti-tarnishing agent, photo-deterioration inhibitor such as hindered amine, vinyl ether, vinyl decylamine, epoxy resin, propylene oxide, allyl phthalate, ethylene adipate Reinforcing fillers such as reactive diluents, fumed cerium oxide or precipitated cerium oxide, flame retardant enhancers, phosphors, organic solvents, and the like. In addition, it is possible to color by coloring ingredients.

The cured product of the resin composition for encapsulating an optical semiconductor element of the present invention is used for the sealing of an optical semiconductor element, and the optical semiconductor is not particularly limited thereto, and examples thereof include a light-emitting diode, a photoelectric crystal, and a photodiode. Body, CCD, solar cell module, EPROM, optocoupler, etc., especially for the sealing of the light-emitting diode. At this time, in terms of the sealing method, a conventional method corresponding to the kind of the optical semiconductor element is employed.

Further, the curing conditions of the resin composition for encapsulating an optical semiconductor element of the present invention can be considered to be in the range of from room temperature to about 200 ° C for a period of several days from several tens of seconds, but at 80 to 180 ° C. It is better to have a time range of about 10 hours from about 1 minute in the temperature range.

Further, the cured product of the resin composition for encapsulating an optical semiconductor element of the present invention has a refractive index of 1.45 or more, preferably 1.45 to 1.55. If it is less than 1.45, the gas permeability may be lowered and the sulfidation resistance may be lowered. If it exceeds 1.55, the heat resistance may be lowered and the long-term reliability may be lowered. Further, the refractive index of the cured product can be adjusted to a desired value by adjusting the content of the aromatic monovalent hydrocarbon group such as a phenyl group in the component (B) according to the component (A) or the case. In general, if the amount of the aromatic monovalent hydrocarbon group is increased, the refractive index also rises. Further, the difference between the refractive index of the cured product and the refractive index of the component (D) is from 0 to 0.1, particularly preferably from 0 to 0.05.

Fig. 2 is a cross-sectional view schematically showing an embodiment of a light-emitting device of the present invention. The optical semiconductor element 1 is provided in the concave portion of the molded package substrate 5, and the silver-plated lead frame 3 is connected to the optical semiconductor element 1 through the conductive wire 2. In the concave portion of the molded package substrate 5 on which the optical semiconductor element 1 is provided, the optical semiconductor element sealing resin composition 4 in which the glass filler 7 having an anisotropic shape is placed is cured and cured to produce the light-emitting device of the present invention.

The optical semiconductor device protected by the cured product of the resin composition for encapsulating the optical semiconductor element of the present invention is excellent in heat resistance, moisture resistance, and light resistance, and is not affected by the external environment to discolor the surface of the substrate. As a result, an optical semiconductor device having excellent reliability can be provided, and industrial advantages are extremely large.

[Examples]

The present invention will be specifically described below by showing examples and comparative examples, but the present invention is not limited by the following examples. Further, in the following examples, the parts represent the parts by mass, the Me system represents a methyl group, the Et system represents an ethyl group, and the viscosity is a measured value obtained by a rotational viscometer.

[Modulation of matrix compounds]

The component (A) is the following formula (I)

【化6】

The two-terminal dimethylvinyl fluorenyl terminated dimethyldiphenyl polyoxyalkylene (viscosity 3Pa ‧) 100 parts, (B) component, is the following formula (II)

【化7】

The two-terminal dimethyl hydroquinone-terminated methylhydropolysiloxane (viscosity 15mPa‧a), 2.5 parts, (C) component, is a chloroplatinic acid 2-ethylhexanol denaturing solution (Pt concentration 2 0.03 parts by mass, and further 0.05 parts of ethynylcyclohexanol and 7 parts of 3-glycidoxypropyltrimethoxydecane were uniformly stirred to prepare a matrix compound having a refractive index of 1.51.

[Example 1]

In the above-mentioned matrix compound, the component (D) is a glass piece (registered trademark) made of Nippon Sheet Glass Co., Ltd. having a refractive index of 1.51 (product number: REF-015, average particle diameter: 15 μm, aspect ratio: 3 ～) 10) The dispersion was made into a concentration of 10% by mass, filled in an unsealed light-emitting diode (LED), and solidified at 150 ° C for 4 hours to prepare an evaluation light-emitting diode.

[Embodiment 2]

In the above-mentioned matrix compound, the component (D) is a glass piece (registered trademark) made of Nippon Sheet Glass Co., Ltd. having a refractive index of 1.51 (product number: REF-015, average particle diameter: 15 μm, aspect ratio: 3 ～) 10) When the concentration was 50% by mass, the film was filled in an unsealed light-emitting diode (LED), and was solidified at 150 ° C for 4 hours to prepare an evaluation light-emitting diode.

[Example 3]

In the above-mentioned matrix compound, the component (D) is a ground fiber made from Nitto Dough Co., Ltd. having a refractive index of 1.51 (product number: PFE-301, fine powdery glass fiber, average particle diameter: 10 μm, aspect ratio) : 1.1 to 10) The dispersion is 10% by mass, and is filled in an unsealed light-emitting diode (LED), and is finally hardened at 150 ° C for 4 hours to prepare an evaluation light-emitting diode.

[Example 4]

In the above-mentioned matrix compound, the component (D) is a ground fiber made from Nitto Dough Co., Ltd. having a refractive index of 1.51 (product number: PFE-301, fine powdery glass fiber, average particle diameter: 10 μm, aspect ratio) : 1.1 to 10) When the concentration is 50% by mass, it is filled in an unsealed light-emitting diode (LED), and is hardened at 150 ° C for 4 hours to prepare an evaluation light-emitting diode.

[Comparative Example 1]

Only the above-mentioned matrix compound was filled in an unsealed light-emitting diode (LED), and it was hardened at 150 ° C for 4 hours to prepare an evaluation light-emitting diode.

[Comparative Example 2]

In the above-mentioned polyoxyxylene resin composition, a spheroidal cerium oxide filler (trade name: high purity FF-L, average particle diameter: 3 μm) produced by Ronson is dispersed to a concentration of 10% by mass, and is filled in The light-emitting diode (LED) was not sealed, and it was hardened under conditions of 150 ° C for 4 hours to prepare a light-emitting diode for evaluation.

[Comparative Example 3]

In the above-mentioned matrix compound, a spheroidal cerium oxide filler (trade name: high purity FF-L, average particle diameter: 3 μm) produced by Ronson is dispersed to a concentration of 50% by mass, and is filled in an unblocked luminescent second. The electrode body (LED) was hardened under conditions of 150 ° C for 4 hours to prepare a light-emitting diode for evaluation.

The evaluation light-emitting diodes produced in the above examples and comparative examples were allowed to stand under high temperature and high humidity of 85 ° C / 60% RH for 168 hours, and then refluxed by IR at 260 ° C for 3 times, and observed by a stereoscopic microscope. Defects in peeling and cracking of the resin occur. Next, a thermal shock test at -40 ° C / 30 minutes to 120 ° C / 30 minutes was carried out, and the occurrence of defects such as peeling and cracking of the resin was observed in the same manner using a stereoscopic microscope. In addition, the lighting test was carried out by a power-on test. The results are shown in Table 1.

In Examples 1 to 4, in the moisture absorption reflow test and the thermal shock test, there was no defect such as peeling or cracking of the resin, and no LED failure occurred. However, in Comparative Example 1, cracking of the resin occurred in the moisture absorption reflow test. In Comparative Example 2, both the cracking of the resin and the peeling of the resin occurred. In Comparative Example 3, although cracking of the resin did not occur, peeling of the resin occurred. As a result, some of the LEDs are not defective in lighting.

1. . . Optical semiconductor component

2. . . Conductive wire

3. . . Silver plated lead frame

4. . . Optical semiconductor component sealing resin

5. . . Molded package substrate

6. . . Ceria filler

7. . . Anisotropic glass filler

[Fig. 1] is a cross-sectional view showing an embodiment of a conventional light-emitting device.

Fig. 2 is a cross-sectional view showing an embodiment of a light-emitting device of the present invention.

1. . . Optical semiconductor component

2. . . Conductive wire

3. . . Silver plated lead frame

4. . . Optical semiconductor component sealing resin

5. . . Molded package substrate

7. . . Anisotropic glass filler

Claims (7)

A resin composition for encapsulating an optical semiconductor element, characterized by containing (A) an organopolyoxane having a monovalent hydrocarbon group containing an aliphatic unsaturated bond, and (B) having two or more bonds in one molecule An organic hydrogen polyoxyalkylene of a hydrogen atom of a halogen atom, (C) a platinum-based catalyst, and (D) a glass filler having an anisotropic shape having an aspect ratio of 1.1 to 50, and a resin for encapsulating the optical semiconductor element The cured product of the object has a refractive index of 1.45 or more. The resin composition for encapsulating an optical semiconductor element according to the first aspect of the invention, wherein the component (A) is an organopolysiloxane selected from the group consisting of (wherein k and m satisfy an integer of 5≦k+m≦500, 0≦m/(k+m)≦0.5). The resin composition for encapsulating an optical semiconductor element according to the first or second aspect of the invention, wherein the (D) glass filler having an anisotropic shape is a scaly glass or glass having an aspect ratio of 1.1 to 50. Cutting the fiber. The resin composition for encapsulating an optical semiconductor element according to the first or second aspect of the invention is the glass filler of the above (D) having an anisotropic shape in an amount of 5 to 60% by mass of the entire resin composition. The resin composition for encapsulating an optical semiconductor element according to the first aspect or the second aspect of the invention, wherein the (D) glass filler having an anisotropic shape has a refractive index of 1.45 to 1.55, and the optical semiconductor element is sealed. The cured product of the resin composition has a refractive index of 1.45 to 1.55. A light-emitting device, which is a resin composition for encapsulating an optical semiconductor element according to any one of the first to fifth aspects of the invention. The hardened material is closed. A light-emitting diode device using a preform package having a lead frame on which a light-emitting element is mounted, and mounting the light-emitting element on a lead frame, which is closed by a cured product of a sealing resin composition, and the above-mentioned sealing resin composition The resin composition as described in any one of claims 1 to 5.