KR101979499B1 - Resin composition for encapsulating optical semiconductor element and light emitting device - Google Patents

Abstract

(B) an organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to silicon atoms in one molecule, (C) an organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to silicon atoms, , And (D) a glass filler having an anisotropic shape having an aspect ratio of 1.1 to 50, wherein the refractive index of the cured product is 1.45 or more.
INDUSTRIAL APPLICABILITY According to the present invention, there is provided a resin composition for sealing optical semiconductor devices which is excellent in sulfidization resistance and can ensure long-term reliability that can withstand a thermal stress test such as moisture absorption reflow or thermal impact test, The light emitting device can be obtained.

Description

Technical Field [0001] The present invention relates to a resin composition for sealing an optical semiconductor device,

The present invention relates to a silicone-based resin composition for sealing optical semiconductor elements and a light-emitting device sealed by a cured product of the resin composition.

In the resin composition for protective coating of optical semiconductor elements such as light emitting diodes (LED), the cured product thereof is required to have transparency. As the composition, an epoxy resin such as bisphenol A type epoxy resin or alicyclic epoxy resin, An epoxy resin composition containing an anhydride-based curing agent is used (see Patent Document 1: Japanese Patent No. 3241338, Patent Document 2: Japanese Patent Application Laid-Open No. 7-25987).

However, since the cured product of the epoxy resin composition has a low light transmittance to light of a short wavelength, it has a drawback that it is low in durability against light or is colored by light deterioration. For this reason, it is preferable that an organic compound containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule and a silicon compound containing at least two SiH groups in one molecule, a hydrosilylation catalyst (JP-A-2002-327126, JP-A-2002-338833).

However, a cured product of such a silicone resin composition, particularly a silicone resin composition which does not satisfy the refractive index of 1.45, has a gas permeability larger than that of a conventional cured product of the epoxy resin composition, And the gas is permeable. As a result, the silver plating surface of the lead frame, which is a substrate of the LED package, is sulphided and changed to silver sulphide by the sulfur-containing gas which permeates the cured product of the silicone resin composition, resulting in a blackening of the plating surface.

In general, the gas permeability of the cured product of the silicone resin composition in which the gas permeability of the cured product of the silicone resin composition is 20 g / m ² ∙ 24 hr or more, in particular, the refractive index not satisfying 1.45 is 50 g / m ² ∙ 24 hr or more , The sulfur-containing gas present in the external environment can be easily permeated. Examples of the sulfur-containing gas present in the external environment include sulfur compounds contained in the wrapping materials such as sulfur oxides (SO _x ) and corrugated cardboard boxes in the atmosphere. Further, the surface of the lead frame of the LED package is generally subjected to a silver plating process in view of the reflection efficiency of light. When a light emitting diode sealed with a cured product of a silicone resin composition that does not satisfy a refractive index of 1.45 on the silver plating lead frame is left in an atmosphere in which a sulfur containing gas is present, the sulfur containing gas is passed through the cured product of the silicone resin composition So that the silver sulfide reaction proceeds. As a result, silver sulfide is generated on the surface of the lead frame. The surface of the LED package substrate is blackened by the generation of silver sulfide, and the reflection efficiency of light is remarkably decreased, which is one of the factors that can not maintain the reliability for a long period of time.

Therefore, as a countermeasure for sulfurization, recently, it has been proposed to solve the above-mentioned problem of sulfurization on the silver plating surface by using a silicone resin composition having a relatively low gas permeability and a refractive index of 1.45 or more after curing. However, since a cured product of a silicone resin composition having a refractive index of 1.45 or more is weaker than a cured product of a silicone resin composition having a refractive index of 1.45 and has a low strength, a heat stress test such as a moisture absorption reflow and a thermal impact test is conducted Resin cracks occurred and the reliability test could not be satisfied.

Generally, it is known to use a silica filler as a filler for reinforcing the strength of a cured product of a silicone resin composition. However, the shape of the silica filler is isotropic. When such a silica filler-containing silicone resin composition is used as the sealant of the preformed package as shown in Fig. 1, the defect rate of the reliability test is improved as compared with the conventional case, The thermal stress such as the impact test is complicated with respect to the sealing resin, and it can not withstand the thermal stress only by the reinforcing effect of the silica filler, and the resin itself is broken. 1 is a cross-sectional view showing an embodiment of a conventional light emitting device, in which (1) is an optical semiconductor element, (2) is a conductive wire, (3) is silver plated lead frame, (5) represents a mold package substrate, and (6) represents a silica filler.

Japanese Patent No. 3241338 Japanese Patent Application Laid-Open No. 7-25987 Japanese Patent Application Laid-Open No. 2002-327126 Japanese Patent Application Laid-Open No. 2002-338833

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-described problems, and has an object of providing an optical fiber having a refractive index of 1.45 or more after curing, excellent in sulfidization resistance and capable of securing a long term reliability that can withstand moisture stress test such as moisture absorption reflow, A resin composition for sealing a semiconductor element, and a light emitting device sealed by a cured product of the resin composition for sealing an optical semiconductor element.

As a result of intensive investigations to solve the above problems, the present inventors have found that (A) an organopolysiloxane having an aliphatic unsaturated bond-containing monovalent hydrocarbon group, (B) an organopolysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule (C) a platinum-based catalyst, and (D) a glass filler having an anisotropic shape with an aspect ratio of 1.1 to 50, the light-emitting device sealed with the cured product of the resin composition for optical- It is possible to secure long-term reliability that is excellent in sulfidization resistance and can withstand a thermal stress test such as moisture absorption reflow or thermal impact test. Thus, the present invention has been accomplished.

Accordingly, the present invention provides a resin composition for sealing optical semiconductor elements described below and a light emitting device.

Claim 1:

(A) an organopolysiloxane having an aliphatic unsaturated bond-containing monovalent hydrocarbon group,

(B) an organohydrogenpolysiloxane containing two or more hydrogen atoms bonded to silicon atoms in one molecule,

(C) a platinum-based catalyst, and

(D) glass filler having an anisotropic shape with an aspect ratio of 1.1 to 50

And the refractive index of the cured product is 1.45 or more.

Claim 2:

The resin composition for sealing an optical semiconductor element according to claim 1, wherein the component (A) is an organopolysiloxane selected from the following formulas.

(Wherein k and m are integers satisfying 0? K + m? 500 and 0? M / (k + m)? 0.5)

[Claim 3]

The resin composition for sealing an optical semiconductor device according to claim 1 or 2, wherein the (D) glass filler having an anisotropic shape is a scaly glass or a glass cut fiber having an aspect ratio of 1.1 to 50.

Claim 4:

The resin composition for sealing an optical semiconductor element according to any one of claims 1 to 3, wherein the glass filler (D) has an anisotropic shape in an amount of 5 to 60 mass% of the entire resin composition.

[Claim 5]

The glass fiber according to any one of claims 1 to 4, wherein the refractive index of the glass filler (D) is 1.45 to 1.55, and the refractive index of the cured product of the curable silicone resin composition is 1.45 to 1.55. Resin composition for sealing optical semiconductor devices.

[Claim 6]

A light emitting device sealed with a cured product of the resin composition for sealing an optical semiconductor element according to any one of claims 1 to 5.

[Claim 7]

A light emitting diode device comprising a light emitting element mounted on a lead frame by using a preformed package having a lead frame on which a light emitting element is mounted and sealing the light emitting element with a cured product of the encapsulating resin composition, Wherein the resin composition is a resin composition according to any one of claims 1 to 6. [

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a resin composition for optical semiconductor device encapsulation which is excellent in sulfidization resistance and can ensure long-term reliability that can withstand a thermal stress test such as moisture absorption reflow or thermal impact test, A light emitting device sealed by a cured product can be obtained.

1 is a cross-sectional view showing an embodiment of a conventional light emitting device.
2 is a cross-sectional view showing an embodiment of a light emitting device of the present invention.

Hereinafter, the present invention will be described in detail.

The resin composition for sealing an optical semiconductor device of the present invention,

(A) an organopolysiloxane having an aliphatic unsaturated bond-containing monovalent hydrocarbon group,

(B) an organohydrogenpolysiloxane containing two or more hydrogen atoms bonded to silicon atoms in one molecule,

(C) a platinum-based catalyst, and

(D) glass filler having an anisotropic shape

.

(A) Component

The component (A) of the present invention is an organopolysiloxane having an aliphatic unsaturated bond-containing hydrocarbon group and preferably represented by the following formula (1).

(Wherein R ¹ is an aliphatic unsaturated bond-containing monovalent hydrocarbon group, and R ² to R ⁷ are the same or different monovalent hydrocarbon groups, and R ⁴ to R ^{7 each} preferably have an aliphatic unsaturated bond A is a monovalent hydrocarbon group, R ⁶ and / or R ⁷ is an aromatic monovalent hydrocarbon group, a is an integer of 0? A? 500, preferably 10 a? 500, b is 0 b 250, Preferably 0? B? 150, 0? A + b? 500, and preferably 10? A + b?

In this case, R ¹ is preferably a monovalent hydrocarbon group having 2 to 8 carbon atoms, more preferably 2 to 6 carbon atoms, having an aliphatic unsaturated bond, particularly an aliphatic unsaturated double bond. As the aliphatic unsaturated bond-containing monovalent hydrocarbon group represented by R ¹ , specifically, an alkenyl group such as a vinyl group, an allyl group, a propenyl group, and a butenyl group is preferable, and a vinyl group or an allyl group is particularly preferable.

R ² to R ⁷ are monovalent hydrocarbon groups and preferably have a carbon number of 1 to 20, especially 1 to 10. Specific examples of the monovalent hydrocarbon groups represented by R ² to R ⁷ include alkyl groups such as a methyl group, an ethyl group, a propyl group, and a butyl group; Alkenyl groups such as vinyl group, allyl group, propenyl group and butenyl group; Aryl groups such as phenyl, tolyl, and xylyl groups; And benzyl group. Of these groups, R ⁴ to R ⁷ are preferably groups having no aliphatic unsaturated bond such as an alkenyl group, and specifically, an alkyl group, an aryl group, an aralkyl group and the like are preferable. R ⁶ and / or R ⁷ is preferably an aromatic monovalent hydrocarbon group such as an aryl group having 6 to 12 carbon atoms such as a phenyl group or a tolyl group.

The organopolysiloxane represented by the above-mentioned formula (1) can be produced, for example, by reacting a cyclic diorganopolysiloxane such as cyclic diphenylpolysiloxane or cyclic methylphenylpolysiloxane with a cyclic diorganopolysiloxane such as diphenyltetravinyldisiloxane or divinyltetraphenyldisiloxane Can be obtained by an alkali equilibration reaction of a siloxane, but in this case usually silanol groups and chlorine atoms are not contained.

Specific examples of the organopolysiloxane represented by the above formula (1) include those represented by the following structural formulas.

(Wherein k and m are integers satisfying 0? K + m? 500, preferably 5? K + m? 250 and 0? M / (k + m)? 0.5)

As the component (A), an organopolysiloxane having a three-dimensional network structure including a trifunctional siloxane unit and a tetrafunctional siloxane unit may be used in combination with the organopolysiloxane having a straight chain structure represented by the formula (1) have.

The content of the aliphatic unsaturated bond-containing monovalent hydrocarbon group in the component (A) is preferably 1 to 50 mol%, more preferably 2 to 40 mol%, still more preferably 5 to 30 mol% %to be. If the content of the aliphatic unsaturated bond-containing monovalent hydrocarbon group is less than 1 mol%, a cured product may not be obtained. If the content is more than 50 mol%, the mechanical properties may deteriorate.

The content of the aromatic group in the component (A) is preferably 0 to 95 mol%, more preferably 10 to 90 mol%, and still more preferably 20 to 80 mol% of the total monovalent hydrocarbon group. The aromatic group contains an appropriate amount in the resin, which has an advantage that the mechanical properties are good and the production is easy to perform. It is also an advantage that the refractive index can be controlled by introduction of an aromatic group.

Component (B)

The component (B) is an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule. The organohydrogenpolysiloxane serves as a crosslinking agent. The SiH group in the organohydrogenpolysiloxane and the aliphatic unsaturated bond-containing monovalent hydrocarbon group (typically an alkenyl group) of the component (A) Lt; / RTI >

Further, since the organohydrogenpolysiloxane has an aromatic hydrocarbon group, when the organosilicon compound having an aliphatic unsaturated bond-containing monovalent hydrocarbon group as the component (A) has a high refractive index, the organohydrogenpolysiloxane increases compatibility and provides a transparent cured product . Therefore, in the organohydrogenpolysiloxane of the component (B), an organohydrogenpolysiloxane having an aromatic monovalent hydrocarbon group such as a phenyl group can be included as part or all of the component (B).

In the organohydrogenpolysiloxane of the component (B), an organohydrogenpolysiloxane having a glycidyl structure may be included as a part or all of the component (B), and the organohydrogenpolysiloxane may contain a glycidyl structure Containing group, it is possible to provide a cured product of a resin composition for sealing an optical semiconductor element having high adhesiveness to a substrate.

Examples of the organohydrogenpolysiloxane include, but are not limited to, 1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, tris (dimethylhydrogensiloxane, Methylsilane, tris (dimethylhydrogensiloxy) phenylsilane, 1-glycidoxypropyl-1,3,5,7-tetramethylcyclotetrasiloxane, 1,5-glycidoxypropyl-1,3, 5,7-tetramethylcyclotetrasiloxane, 1-glycidoxypropyl-5-trimethoxysilylethyl-1,3,5,7-tetramethylcyclotetrasiloxane, both-end trimethylsiloxy-terminated methylhydrogenpolysiloxane, End trimethylsiloxane-blocked dimethylsiloxane-methylhydrogensiloxane copolymer, double-terminal dimethylhydrogensiloxy-blocked dimethylpolysiloxane, double-terminal dimethylhydrogensiloxy-blocked dimethylsiloxane-methylhydrogensiloxane copolymer, (Trimethylsiloxy) -diphenylsiloxane-dimethylsiloxane copolymer, trimethoxysilane polymer, (CH ₃ ) ₂ HSiO ₁ (trimethylsiloxane-terminated trimethylsiloxane-terminated methylhydrogensiloxane-diphenylsiloxane copolymer, _{/ 2} units and SiO _4/2 units, copolymers containing (CH ₃ ) ₂ HSiO _1/2 units, SiO _4/2 units and (C ₆ H ₅ ) SiO _3/2 units, and the like .

An organohydrogenpolysiloxane obtained by using a unit represented by the following structural formula can also be used.

Examples of the organohydrogenpolysiloxane obtained by using the unit represented by the above structural formula include the following.

The molecular structure of such an organohydrogenpolysiloxane may be any of straight chain, cyclic, branched, and three-dimensional network structures, and the number (or degree of polymerization) of silicon atoms in one molecule may be 2 or more, preferably 2 To 1,000, and more preferably from about 2 to 300, can be used.

The amount of such an organohydrogenpolysiloxane is preferably in the range of 0.75 to 2.0 (SiH groups) in the component (B) per one aliphatic unsaturated bond-containing monovalent hydrocarbon group (typically an alkenyl group) Of the total amount of the composition. If the amount is less than 0.75, the hardness may be lowered. If the amount is more than 2.0, the SiH group may remain and the road hardness may be changed with time.

(C) Component

(C) is a platinum catalyst. Examples of the platinum-based catalysts include chloroplatinic acid, alcohol-modified chloroplatinic acid, and platinum complexes having a chelate structure. These may be used alone or in combination of two or more.

The blending amount of these catalyst components may be a so-called catalytic amount, and is preferably 0.1 to 500 ppm in terms of mass of platinum group metal per 100 parts by mass of the total amount of the components (A) and (B), more preferably 0.5 to 100 ppm Is preferably used.

(D) Component

(D) is a glass filler having an anisotropic shape with an aspect ratio of 1.1 to 50. The aspect ratio of the glass filler having an anisotropic shape is preferably 1.5 to 30, more preferably 2 to 20. If the aspect ratio exceeds 50, there is a case that the discharge accuracy at the time of sealing the resin is not stabilized. As such a glass filler, scaly glass, glass cut fiber and the like are preferably used. The length or the average particle size of the glass filler having an anisotropic shape is preferably 1 mm or less, and more preferably 0.005 to 0.5 mm. If it exceeds 1 mm, the ejection accuracy when sealing the resin may not be stabilized. The average particle diameter is preferably 1 to 50 占 퐉, particularly preferably 10 to 20 占 퐉. In addition, the length or the average particle size can be obtained by microscopic observation and is an average value of 50 samples.

The glass filler having an anisotropic shape preferably has a refractive index of 1.45 to 1.55. Outside of the above range, the refractive index difference with the silicone resin becomes large, and the transparency of the mixture may be impaired.

As the glass filler having an anisotropic shape, a commercially available product can be used. For example, glass flakes (REF-600, REF-160, REF-015) manufactured by Nippon Itagaras Co., Etc.) can be preferably used. As the glass cutting fiber, a milled fiber (product number: PFE-001, PFE-301, etc.) manufactured by Nitto Boseki Co., Ltd. and the like can also be preferably used.

In the case of a filler having an isotropic shape, the coefficient of linear expansion of the resin does not differ in the in-plane direction and the vertical direction. However, when a filler having an anisotropic shape is filled, the coefficient of linear expansion in the in-plane direction and the perpendicular direction of the resin are different from each other, and the coefficient of linear expansion in the in-plane direction becomes smaller than the vertical direction. Further, in the case of the pre-molded package, the linear expansion of the metal frame and the linear expansion of the mold material are complicated in the in-plane direction, so that the stress to the sealing material becomes larger than that in the vertical direction. Therefore, when the curable silicone in which the filler having the above-described anisotropic shape is dispersed is used as the encapsulating resin, the stress in the in-plane direction can be relaxed. Therefore, the thermal stress test such as moisture absorption reflow or thermal impact test It is considered that the effect is obtained.

(E) Other ingredients

The resin composition for sealing optical semiconductor devices used in the present invention contains the above-mentioned components (A) to (D) as essential components, but various silane coupling agents may be added as needed for improving the adhesion.

Examples of the silane coupling agent include vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3- Glycidoxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, (Aminoethyl) 3-aminopropyltrimethoxysilane, N-2 (aminoethyl) aminopropyltrimethoxysilane, N-2 Aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, Trimethoxysilane, tetramethoxysilane and oligomers thereof, and the like. All. These silane coupling agents may be used singly or in combination of two or more.

The blending amount of the silane coupling agent is preferably 10 mass% or less (0 to 10 mass%), particularly 5 mass% or less (0 to 5 mass%) of the entire composition.

The addition curing type silicone resin composition for use in the present invention may contain antioxidants such as BHT and vitamin B, an antistaining agent such as an organic phosphorus discoloration inhibitor, and the like, as needed within a range not deteriorating the performance of the optical semiconductor device, An epoxy resin, an oxetane, an allyl phthalate, a reactive diluent such as vinyl adipate, a reinforcing filler such as a fumed silica or a precipitated silica, a flame retardancy improving agent , A fluorescent substance, an organic solvent or the like may be added. It may be colored by a coloring component.

The cured product of the resin composition for sealing an optical semiconductor device of the present invention is used for sealing an optical semiconductor element, and the optical semiconductor is not limited to these. For example, a light emitting diode, a phototransistor, a photodiode, a CCD, , An EPROM, a photocoupler, and the like, and is particularly effective for sealing a light emitting diode. In this case, as a sealing method, a usual method depending on the type of the optical semiconductor element is used.

The curing condition of the resin composition for sealing an optical semiconductor device of the present invention may be a time range of about several tens seconds to several days in a temperature range from room temperature to about 200 DEG C, Min to about 10 hours.

The refractive index of the cured product of the resin composition for optical semiconductor device encapsulation of the present invention is preferably 1.45 or more and 1.45 to 1.55. If it is less than 1.45, the gas permeability is lowered and the sulfidization resistance is lowered in some cases. If it exceeds 1.55, the heat resistance is lowered and the reliability for a long period of time is lowered. The refractive index of the cured product can be adjusted to a desired value by adjusting the content of the component (A), and in some cases, the content of the aromatic monovalent hydrocarbon group such as the phenyl group in the component (B). Generally, the refractive index also increases when the amount of aromatic monovalent hydrocarbon groups is increased. The difference between the refractive index of the cured product and the refractive index of the component (D) is preferably 0 to 0.1, more preferably 0 to 0.05.

2 is a cross-sectional view schematically showing an embodiment of the light emitting device of the present invention. The optical semiconductor element 1 is provided in the concave portion of the mold package substrate 5 and the silver plating lead frame 3 and the optical semiconductor element 1 are connected through the conductive wire 2. [ A resin composition 4 for optical semiconductor element encapsulation in which a glass filler 7 having an anisotropic shape is mixed in a concave portion of a mold package substrate 5 provided with an optical semiconductor element 1 is introduced and cured, A light emitting device is manufactured.

The optical semiconductor device covered with the cured product of the resin composition for optical semiconductor device encapsulation of the present invention is excellent in heat resistance, moisture resistance and light resistance of the device, does not discolor the substrate surface due to the influence of the external environment, It becomes possible to provide an excellent optical semiconductor device, and there are many industrial advantages.

[Example]

EXAMPLES The present invention will be described in more detail with reference to the following examples and comparative examples, but the present invention is not limited to the following examples. In the following examples, parts are parts by weight, Me is methyl and Et is ethyl, and the viscosity is measured by a rotational viscometer.

[Production of base compound]

100 parts of dimethylvinylsilyl group-blocked dimethyldiphenylpolysiloxane (viscosity: 3 Pa.s) represented by the following formula (I) shown below as component (A), 100 parts of both terminal dimethylhydrogensilyl (Viscosity: 15 mPa 占 퐏), 0.03 part of a 2-ethylhexyl alcohol chloride chloroplatinic acid denaturation solution (Pt concentration: 2 mass%) as a component (C), 0.05 part of ethynylcyclohexyl alcohol, And 7 parts of glycidoxypropyltrimethoxysilane were stirred to prepare a base compound having a refractive index of 1.51.

(I)

≪

[Example 1]

10% by mass of glass flake (registered trademark) (product number: REP-015, average particle diameter: 15 탆, aspect ratio: 3 to 10) having a refractive index of 1.51 as a component (D) Concentration was filled in an unsealed light emitting diode (LED), and was cured under the condition of 150 占 폚 for 4 hours to prepare an evaluation light-emitting diode.

[Example 2]

50% by mass of glass flake (registered trademark) (product number: REP-015, average particle size: 15 占 퐉, aspect ratio: 3 to 10) having a refractive index of 1.51 as a component (D) Concentration was filled in an unsealed light emitting diode (LED), and was cured under the condition of 150 占 폚 for 4 hours to prepare an evaluation light-emitting diode.

[Example 3]

10% by mass of a milled fiber (product number: PFE-301 manufactured by Nitto Boseki Co., Ltd.) having a refractive index of 1.51 as a component (D) and having an average particle diameter of 10 m and an aspect ratio of 1.1 to 10 was added to the base compound Concentration was filled in an unsealed light emitting diode (LED), and was cured under the condition of 150 占 폚 for 4 hours to prepare an evaluation light-emitting diode.

[Example 4]

(PFE-301 manufactured by Nitobosse K.K.) having a refractive index of 1.51 as a component (D) and a 50% by mass aqueous solution of a fine powder glass fiber having an average particle size of 10 μm and an aspect ratio of 1.1 to 10 Concentration was filled in an unsealed light emitting diode (LED), and was cured under the condition of 150 占 폚 for 4 hours to prepare an evaluation light-emitting diode.

[Comparative Example 1]

Only the base compound was filled in an unsealed light emitting diode (LED), and was cured under the conditions of 150 占 폚 for 4 hours to prepare a light emitting diode for evaluation.

[Comparative Example 2]

An unsealed light emitting diode (LED) was filled with a spherical silica filler (trade name: high-purity FF-L, average particle diameter: 3 占 퐉) dispersed in a concentration of 10 mass% 150 ° C for 4 hours to prepare a light emitting diode for evaluation.

[Comparative Example 3]

An unsealed light emitting diode (LED) was filled with a spherical silica filler (trade name: high-purity FF-L, average particle size: 3 m) dispersed in the base compound to a concentration of 50 mass% C for 4 hours to prepare a light emitting diode for evaluation.

The light emitting diode for evaluation prepared in the above Examples and Comparative Examples was allowed to stand for 168 hours under high temperature and high humidity of 85 占 폚 / 60% RH and then passed through IR reflow three times at 260 占 폚 to cause peeling of resin and defective crack Were observed by a stereomicroscope. Subsequently, a thermal impact test was carried out at -40 DEG C / 30 minutes to 120 DEG C / 30 minutes, and occurrence of defects such as peeling and cracking of the resin was observed by a stereomicroscope. Further, a lighting test was conducted by the energization test. The results are shown in Table 1.

In Examples 1 to 4, there were no defects such as peeling and cracking of the resin in the moisture absorption reflow test and the thermal impact test, and no defective lighting of the LEDs occurred. However, in Comparative Example 1, cracking of the resin occurred in the moisture absorption reflow test. In Comparative Example 2, cracking of the resin and peeling of the resin occurred at the same time. In Comparative Example 3, no crack occurred in the resin, but peeling of the resin occurred. As a result, some of the LEDs failed to emit light.

1: optical semiconductor element
2: conductive wire
3: silver plated lead frame
4: Resin for optical semiconductor device sealing
5: Mold package substrate
6: silica filler
7: Glass filler with anisotropic shape

Claims (5)

(A) an organopolysiloxane having an aliphatic unsaturated bond-containing monovalent hydrocarbon group,
(B) an organohydrogenpolysiloxane containing two or more hydrogen atoms bonded to silicon atoms in one molecule,
(C) a platinum-based catalyst, and
(D) glass cutting fibers having an anisotropic shape having a length of 0.005 to 0.5 mm, an average particle diameter of 1 to 50 占 퐉, a refractive index of 1.51 to 1.55, and an aspect ratio of 1.1 to 10
And the refractive index of the cured product is from 1.51 to 1.55. The resin composition for sealing an optical semiconductor element according to claim 1, wherein the component (A) is an organopolysiloxane selected from the following formulas.

(Wherein k and m are integers satisfying 0? K + m? 500 and 0? M / (k + m)? 0.5) The resin composition for sealing an optical semiconductor device according to claim 1 or 2, wherein the glass-cutting fiber (D) has an anisotropic shape in an amount of 5 to 60 mass% of the entire resin composition. A light emitting device sealed with a cured product of the resin composition for optical semiconductor element encapsulation according to any one of claims 1 to 3. A light emitting diode device comprising a light emitting element mounted on a lead frame using a preformed package having a lead frame on which a light emitting element is mounted and sealing the light emitting element with a cured product of the encapsulating resin composition, Wherein the resin composition is a resin composition for sealing an optical semiconductor device.

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