JP5638588B2 - 基板間の接続方法 - Google Patents
基板間の接続方法 Download PDFInfo
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- JP5638588B2 JP5638588B2 JP2012252830A JP2012252830A JP5638588B2 JP 5638588 B2 JP5638588 B2 JP 5638588B2 JP 2012252830 A JP2012252830 A JP 2012252830A JP 2012252830 A JP2012252830 A JP 2012252830A JP 5638588 B2 JP5638588 B2 JP 5638588B2
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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Description
T=K・(S/L)・η・Fs (Kは定数)
上記の説明のように、この方法は、樹脂10の界面張力による自己集合を利用して、電極間に樹脂10を自己整合的に形成するものであるが、かかる界面張力による自己集合は、第1の基板30及び第2の基板32の表面に形成された第1の電極31及び第2の電極33のうち少なくとも一方が凸状に形成されているが故に、基板間に形成されたギャップの中でさらに狭くなっている電極間において起きる現象を利用したものと言える。
図2(a)〜(d)は、本発明の第1の実施形態における基板間の接続方法を示す工程断面図で、図3は、図2(a)の工程における平面図である。なお、図2(a)〜(d)に示した各工程の断面図は、図3の一点鎖線IIa−IIaに沿った断面図である。
図6(a)〜(e)を参照しながら、第1の実施形態における変形例を説明する。ここで、図6(a)〜(e)は、図3に対応した平面図で、隔壁部材20の配設方法を示したものである。なお、説明を簡明にするために、第2の基板32及び第2の電極33、導電性粒子11や接続体13、第1の電極31上の樹脂10等は省略している。
第1の実施形態では、第1の電極31及び第2の電極33は、図3及び図6に示したように、基板30、32上にアレイ状又はペリフェラル状に配列されていたのに対し、第2の実施形態では、第1の電極31及び第2の電極33が互いに平行にライン状に形成されていることを特徴とする。
図10(a)〜(d)を参照しながら、第2の実施形態における変形例を説明する。ここで、図10(a)〜(d)は、図8(a)に対応した平面図で、隔壁部材20の配設方法を示したものである。なお、説明を簡明にするために、第2の基板32及び第2の電極33、導電性粒子11や接続体13、第1の電極31上の樹脂10等は省略している。
11 導電性粒子
13 接続体
14 気泡
20〜23 隔壁部材
30 第1の基板
31 第1の電極
32 第2の基板
33 第2の電極
Claims (11)
- 複数の第1の電極を有する第1の基板に対向させて、複数の第2の電極を有する第2の基板を配置し、前記第1の電極と前記第2の電極とを接続体を介して電気的に接続する基板間の接続方法であって、
前記第1の基板と前記第2の基板との間であって、少なくとも前記複数の第1の電極及び第2の電極を覆う領域に、導電性粒子及び気泡発生剤が含有された樹脂を供給し、かつ、前記樹脂の周縁部近傍であって、前記樹脂の周縁部の少なくとも1辺に沿って、前記第1の基板と前記第2の基板との間を塞ぐ隔壁部材を設ける工程(a)と、
前記工程(a)の後に、前記樹脂を加熱して、前記樹脂中に含有する気泡発生剤から気泡を発生させる工程(b)と、
前記樹脂を加熱して、前記樹脂中に含有する前記導電性粒子を溶融する工程(c)とを含み、
前記隔壁部材は、前記導電性粒子及び前記気泡発生剤を含まない樹脂であり、
前記工程(a)において、前記隔壁部材の設けられていない前記樹脂の周縁部は外部に開放されており、
前記工程(b)において、前記樹脂は、前記気泡発生剤から発生した気泡が成長することで該気泡外に押し出されることによって、前記第1の電極と前記第2の電極との間に誘導されるとともに、前記樹脂中に発生した前記気泡は、前記隔壁部近傍と外部との圧力差により、前記外部に開放された前記樹脂の周縁部に導かれて外部に排出され、
前記工程(c)において、前記第1及び第2の電極間に誘導された前記樹脂中に含有する導電性粒子が溶融することによって、前記第1及び前記第2の電極間に前記接続体が形成される、基板間の接続方法。 - 前記隔壁部材は、前記工程(b)及び前記工程(c)において、前記樹脂よりも高い粘度を有する樹脂、または、前記樹脂よりも速い硬化速度を有する樹脂である、請求項1に記載の基板間の接続方法。
- 前記工程(a)において、前記隔壁部材は、前記樹脂の周縁部に隣接して設けられている、請求項1に記載の基板間の接続方法。
- 前記複数の第1の電極及び前記複数の第2の電極は、前記第1の基板及び前記第2の基板上にアレイ状に形成されており、
前記隔壁部材は、前記アレイ状の電極領域の周辺の少なくとも1辺に沿って設けられている、請求項1に記載の基板間の接続方法。 - 前記複数の第1の電極及び前記複数の第2の電極は、前記第1の基板及び前記第2の基板の周辺に形成されており、
前記隔壁部材は、前記基板周辺に形成された電極領域の内側に設けられている、請求項1に記載の基板間の接続方法。 - 前記複数の第1の電極及び前記複数の第2の電極は、互いに平行にライン状に形成されており、
前記隔壁部材は、前記ライン状に形成された電極に対して直交する方向に設けられている、請求項1に記載の基板間の接続方法。 - 前記複数の第1の電極及び前記複数の第2の電極は、互いに平行にライン状に形成されており、
前記隔壁部材は、前記ライン状に形成された電極領域の周辺であって、前記ライン状に形成された電極に平行な方向に設けられている、請求項1に記載の基板間の接続方法。 - 前記工程(b)または前記工程(c)の後、前記隔壁部材を除去する工程をさらに含む、請求項1に記載の基板間の接続方法。
- 前記樹脂に前記気泡発生剤を含有させる代わりに、前記第1の基板及び前記第2の基板の少なくとも一方の基板に、気泡を発生させる気泡発生源が備えられ、
前記工程(b)において、前記気泡は、前記気泡発生源から発生される、請求項1に記載の基板間の接続方法。 - 前記第1の基板及び前記第2の基板は、回路基板または半導体チップからなる、請求項1に記載の基板間の接続方法。
- 複数の第1の電極を有する第1の基板に対向させて、複数の第2の電極を有する第2の基板を配置し、前記第1の電極と前記第2の電極とを接続体を介して電気的に接続する基板間の接続方法であって、
前記第1の基板と前記第2の基板との間であって、少なくとも前記複数の第1の電極及び第2の電極を覆う領域に、導電性粒子及び気泡発生剤が含有された樹脂を供給し、かつ、前記樹脂の周縁部近傍に、前記第1の基板と前記第2の基板との間を塞ぐ隔壁部材を設ける工程(a)と、
前記工程(a)の後に、前記樹脂を加熱して、前記樹脂中に含有する気泡発生剤から気泡を発生させる工程(b)と、
前記樹脂を加熱して、前記樹脂中に含有する前記導電性粒子を溶融する工程(c)とを含み、
前記隔壁部材は、前記第1の基板または前記第2の基板の外形に合わせて加工された治具であり、
前記工程(a)において、前記隔壁部材の設けられていない前記樹脂の周縁部は外部に開放されており、
前記工程(b)において、前記樹脂は、前記気泡発生剤から発生した気泡が成長することで該気泡外に押し出されることによって、前記第1の電極と前記第2の電極との間に誘導されるとともに、前記樹脂中に発生した前記気泡は、前記隔壁部近傍と外部との圧力差により、前記外部に開放された前記樹脂の周縁部に導かれて外部に排出され、
前記工程(c)において、前記第1及び第2の電極間に誘導された前記樹脂中に含有する導電性粒子が溶融することによって、前記第1及び前記第2の電極間に前記接続体が形成され、
前記隔壁部材は、前記工程(b)または前記工程(c)の後、前記基板から除去される、基板間の接続方法。
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101234597B1 (ko) * | 2009-10-15 | 2013-02-22 | 한국전자통신연구원 | 플립 칩 본딩 방법 및 그의 구조 |
US20120178219A1 (en) * | 2011-01-11 | 2012-07-12 | Nordson Corporation | Methods for vacuum assisted underfilling |
CN103843469B (zh) * | 2011-09-30 | 2017-05-03 | 株式会社村田制作所 | 电子装置、接合材料以及电子装置的制造方法 |
JP6222909B2 (ja) * | 2011-10-07 | 2017-11-01 | キヤノン株式会社 | 積層型半導体装置、プリント回路板、及びプリント配線板の接合構造 |
US8952529B2 (en) | 2011-11-22 | 2015-02-10 | Stats Chippac, Ltd. | Semiconductor device with conductive layer over substrate with vents to channel bump material and reduce interconnect voids |
US9230832B2 (en) * | 2014-03-03 | 2016-01-05 | International Business Machines Corporation | Method for manufacturing a filled cavity between a first and a second surface |
US9653425B2 (en) | 2015-08-26 | 2017-05-16 | Apple Inc. | Anisotropic conductive film structures |
KR20180024099A (ko) * | 2016-08-26 | 2018-03-08 | 삼성디스플레이 주식회사 | 접합 조립체 및 이를 포함하는 표시 장치 |
JP6747200B2 (ja) * | 2016-09-09 | 2020-08-26 | コニカミノルタ株式会社 | 画像処理システムおよび画像処理プログラム |
US10629557B2 (en) * | 2016-12-30 | 2020-04-21 | Intel Corporation | Improving mechanical and thermal reliability in varying form factors |
US20190157222A1 (en) * | 2017-11-20 | 2019-05-23 | Nxp Usa, Inc. | Package with isolation structure |
JP7046351B2 (ja) | 2018-01-31 | 2022-04-04 | 三国電子有限会社 | 接続構造体の作製方法 |
JP7185252B2 (ja) | 2018-01-31 | 2022-12-07 | 三国電子有限会社 | 接続構造体の作製方法 |
JP7160302B2 (ja) * | 2018-01-31 | 2022-10-25 | 三国電子有限会社 | 接続構造体および接続構造体の作製方法 |
US11121089B2 (en) | 2018-11-30 | 2021-09-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit package and method |
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CN111385969A (zh) * | 2018-12-29 | 2020-07-07 | 余姚舜宇智能光学技术有限公司 | 一种线路板间的压合连接结构、压合连接方法 |
US11311746B2 (en) | 2019-03-08 | 2022-04-26 | Mevion Medical Systems, Inc. | Collimator and energy degrader for a particle therapy system |
CN114170925A (zh) * | 2021-12-07 | 2022-03-11 | Tcl华星光电技术有限公司 | 显示模组及其制作方法 |
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US6537482B1 (en) * | 2000-08-08 | 2003-03-25 | Micron Technology, Inc. | Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography |
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US7524748B2 (en) * | 2003-02-05 | 2009-04-28 | Senju Metal Industry Co., Ltd. | Method of interconnecting terminals and method of mounting semiconductor devices |
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US7531387B1 (en) | 2005-03-29 | 2009-05-12 | Panasonic Corporation | Flip chip mounting method and bump forming method |
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TW200740320A (en) * | 2006-04-04 | 2007-10-16 | Chicony Electronic Co Ltd | Method of adhering electronic element and apparatus using the method |
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JP2010034504A (ja) | 2010-02-12 |
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US7919357B2 (en) | 2011-04-05 |
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