CN101621011B - 基板间的连接方法、倒装片组件以及基板间连接结构 - Google Patents
基板间的连接方法、倒装片组件以及基板间连接结构 Download PDFInfo
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- CN101621011B CN101621011B CN2009101503435A CN200910150343A CN101621011B CN 101621011 B CN101621011 B CN 101621011B CN 2009101503435 A CN2009101503435 A CN 2009101503435A CN 200910150343 A CN200910150343 A CN 200910150343A CN 101621011 B CN101621011 B CN 101621011B
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Abstract
本发明公开了一种基板间的连接方法、倒装片组件以及基板间连接结构。在该基板间的连接方法中,将含有导电性粒子和气泡产生剂的树脂供向第一基板和第二基板之间,然后加热树脂,使含在树脂中的气泡产生剂产生气泡,让树脂自行聚合在电极之间,然后进一步加热树脂,使含在树脂中的导电性粒子熔化,由此在电极间形成连接体。在树脂的边缘部附近,设置有将基板间封闭起来的隔壁部件,树脂中的气泡从没有设置隔壁部件的树脂的边缘部向外部排出。
Description
技术领域
本发明,涉及一种形成有多个电极的基板间的连接方法以及用该连接方法形成的倒装片组件(flip chip assembly)和基板间连接结构。
背景技术
近年来,伴随着电子设备中所使用的半导体集成电路(LSI)及电路基板、电子元件的高密度化,电极的多销(pin)、窄间距化正在迅速地发展。对安装这些电子元件的方法,提出了对应窄间距、缩短生产时间、统一形成连接体等要求。
针对所述要求,本申请发明人在文献WO 2006/103948A1(US 2008/0284046 A1)中,作为下一代组装方法提出了使用含有导电性粒子及气泡产生剂的树脂进行组装的倒装片组装方法。
图11(a)至图11(d)是表示在所述文献中所公开的倒装片组装方法的基本工序的剖视图。
如图11(a)所示,向具有多个连接端子131的电路基板130上供给了含有导电性粒子111和气泡产生剂(未图示)的树脂110后,如图11(b)所示,与电路基板130相向地设置具有多个电极端子133的半导体芯片132。然后,如图11(c)所示,加热树脂110,使树脂110中的气泡产生剂产生气泡114。此时,树脂110由于增大的气泡114而被该气泡向外推出,由此该树脂110自行聚合在连接端子131和电极端子133之间。其后,如图11(d)所示,进一步加热树脂110,使已自行聚合在连接端子131和电极端子133之间(下面,简称为“端子间”)的树脂110中的导电性粒子111熔化,在端子间形成连接体113。由此,能够获得端子间通过连接体113电连接起来的倒装片组件。此外,该方法也能够适用于安装有电子元件的基板间的连接等。
-发明所要解决的技术问题-
所述方法,利用气泡产生剂所产生的气泡114的增大,来提供使树脂110向端子间移动的促进力,因此适合窄间距的端子间的连接。还有,已被引导到端子间的树脂110,由于表面张力而能够稳定地停留在端子间,还有已在端子间自行聚合的树脂110中的导电性粒子111由于熔化而能够湿扩展到端子间,所以能够在端子间形成稳定的连接体113。
在所述方法中,虽然优选的是树脂110中所产生的气泡114在使树脂110自行聚合到端子间以后从电路基板130及半导体芯片132(以下简称为“基板”)的周边部(树脂110的边缘部)向外部排出,但是该气泡114也有时残留在端子间以外的基板之间。此时,例如将倒装片组件二次安装到其它电路基板等上时,由于再次加热,使得积存在气泡114中的湿气引起蒸汽爆发等,而有可能产生连接不良。
发明内容
本发明是鉴于所述技术问题而研究开发出来的,其主要目的在于提供一种下述的基板间的连接方法,即:在利用树脂中所产生的气泡的增大使树脂自行聚合在端子间以后,再使树脂中的导电性粒子熔化,在端子间形成连接体,以使基板间电连接起来的方法中,由于控制树脂中所产生的气泡的移动,使该气泡移动到基板周边部(树脂的边缘部)后再有效地向外部排出,由此能够实现可靠性高的组件。
-用以解决技术问题的技术方案-
本发明所涉及的基板间的连接方法是与具有多个第一电极的第一基板相向地设置具有多个第二电极的第二基板,通过连接体使第一电极和第二电极电连接的基板间的连接方法。该基板间的连接方法包括:将含有导电性粒子和气泡产生剂的树脂供向第一基板和第二基板之间的至少覆盖多个第一电极及第二电极的区域的工序a、加热树脂使包含在树脂中的气泡产生剂产生气泡的工序b以及加热树脂使包含在树脂中的导电性粒子熔化的工序c。在工序a中,在树脂的边缘部附近,设置有将第一基板和第二基板之间封闭起来的隔壁部件,并且没有设置隔壁部件的树脂的边缘部朝外部开放;在工序b中,树脂由于气泡产生剂所产生的气泡的增大被该气泡向外推出,而被引导到第一电极和第二电极之间,并且气泡从朝外部开放的树脂的边缘部向外部排出;在工序c中,已被引导到电极间的树脂中所含有的导电性粒子熔化,在电极间形成所述连接体。
根据所述方法,已在树脂中产生的气泡,由于位于隔壁部件附近的封闭空间中的树脂的压力与开放侧的压力(气压)之间的压力差,而被引导到朝外部开放的树脂的边缘部后向外部排出,因而能够防止气泡残留在基板间,由此能够实现可靠性高的组件。
在一个优选的实施方式中,所述隔壁部件设置为与树脂的边缘部相邻。
在一个优选的实施方式中,所述多个第一电极及多个第二电极分别在第一基板及第二基板上形成为阵列状,隔壁部件沿着阵列状电极区域的周边的至少一条边设置。
在一个优选的实施方式中,所述多个第一电极及多个第二电极分别形成在第一基板及第二基板的周边,隔壁部件设置在位于基板周边的电极区域的内侧。
在一个优选的实施方式中,所述多个第一电极及多个第二电极分别彼此平行地形成为线状,隔壁部件设置在与形成为线状的电极正交的方向上。还有,隔壁部件还可以在形成为线状的电极区域的周边,设置在与形成为线状的电极平行的方向上。
在一个优选的实施方式中,在所述工序b或工序c之后,还包括除去隔壁部件的工序。
在一个优选的实施方式中,在第一基板及第二基板中的至少一个基板上设有产生气泡的气泡产生源,以取代使所述树脂含有气泡产生剂,在工序b中,气泡由气泡产生源产生。
在一个优选的实施方式中,所述第一基板及第二基板由电路基板或半导体芯片形成。
本发明所涉及的倒装片组件是在电路基板上装有半导体芯片的倒装片组件。在电路基板及半导体芯片之间,利用上述本发明所涉及的基板间的连接方法,通过连接体使形成在电路基板及半导体芯片上的电极彼此电连接。
本发明所涉及的基板间连接结构是使具有多个电极的电路基板彼此电连接起来的基板间连接结构。在电路基板间,利用上述本发明所涉及的基板间的连接方法,通过形成在电极间的连接体而使电路基板彼此电连接。
-发明的效果-
根据本发明,通过在树脂的边缘部附近设置将基板间封闭起来的隔壁部件,能够有效地将树脂中所产生的气泡从没有设置隔壁部件的树脂的边缘部向外部排出,由此能够实现在基板间没有残留气泡的可靠性高的基板间的连接。
而且,在使树脂中所产生的气泡移往朝外部开放的树脂的边缘部的过程中,残留在电极间以外的区域的导电性粒子的残渣被从气泡的移动通路上推开,而聚集到相向的电极间,所以能够减少导电性粒子的残渣。由此,能够实现不存在导电性粒子残渣的绝缘性佳的基板间的连接。
附图说明
图1(a)及图1(b)是对本发明中树脂自行聚合在电极间的现象的原理(mechanism)进行说明的剖视图。
图2(a)至图2(d)是表示本发明的第一实施方式中的基板间的连接方法的剖视图。
图3是表示本发明的第一实施方式中的基板间的连接方法的俯视图。
图4(a)至图4(c)是对本发明中气泡从隔壁部件向开放侧移动的原理进行说明的图。
图5(a)及图5(b)是对本发明中气泡从隔壁部件向开放侧移动的原理进行说明的图。
图6(a)至图6(e)是表示第一实施方式的变形例中的隔壁部件的设置方法的俯视图。
图7(a)至图7(e)是表示第一实施方式的变形例中的隔壁部件的形成方法的剖视图。
图8(a)及图8(b)是表示本发明的第二实施方式中的基板间的连接方法的俯视图。
图9(a)及图9(b)是表示本发明的第二实施方式中的基板间的连接方法的剖视图。
图10(a)至图10(d)是表示第二实施方式的变形例中的隔壁部件的设置方法的俯视图。
图11(a)至图11(d)是表示以往的倒装片组装方法的基本工序的剖视图。
-符号说明-
10 树脂
11 导电性粒子
13 连接体
14 气泡
20~23 隔壁部件
30 第一基板
31 第一电极
32 第二基板
33 第二电极
具体实施方式
本发明所涉及的基板间的连接方法的基本工序与图11(a)至图11(d)中所示的方法相同。
此方法的特征在于:通过加热已被供到电路基板(第一基板)和半导体芯片(第二基板)之间间隙中的树脂,使气泡产生剂产生气泡,并由于气泡增大,将树脂向气泡外侧推出,从而使树脂在电极间自行聚合起来。
在此,一边参照图1(a)及图1(b),一边对树脂在电极间自行聚合起来的现象的原理进行说明。
图1(a)是表示树脂10由于增大的气泡(未图示)而被推到第一基板30的第一电极31和第二基板32的第二电极33之间的状态的剖视图。与第一电极31及第二电极33接触的树脂10,由于其界面的界面张力(所谓起因于树脂湿扩展(wet-spreading)的力)Fs比树脂粘度η产生的应力Fη大,因而在第一电极31及第二电极33的整个面上扩展开,最终形成了以第一电极31及第二电极33的端部为边界的柱状树脂10。为此,即便第一电极31和第二电极33的相对位置稍有错开,也能够确实地利用界面张力使树脂10自行聚合在第一电极31和第二电极33之间(下面,简称为“电极间”)。
此外,如图1(b)所示,虽然由于气泡14的增大(或移动)所产生的应力Fb施加在自行聚合于电极间而形成的柱状树脂10上,不过利用树脂10的粘度η所产生的应力Fη的作用,能够维持该树脂10的形状,因而一旦自行聚合起来的树脂10将不会消失。还有,在树脂10和气体(例如气泡14)之间的界面上,作用着表面张力(或者气-液界面张力),该表面张力也能起到维持柱状树脂的形状的作用。
在此,已自行聚合的树脂10能否维持一定的形状,除了取决于所述界面张力Fs以外,还取决于电极31、33的面积S及电极间的距离L以及树脂10的粘度η。当将使树脂10维持一定形状的目标值设为T时,可以认为从定性理论来说下面的关系式成立。
T=K·(S/L)·η·Fs(K是常数)
如上述说明所示,该方法是一种利用树脂10由于界面张力所产生的自行聚合,使树脂10自对准地形成在电极间的方法。由于分别在第一基板30及第二基板32的表面形成的第一电极31及第二电极33中的至少一个电极形成为凸状,因此由于施加的界面张力所产生的自行聚合可以说是利用了一种在形成于基板间的间隙(gap)中间隙进一步变窄的电极之间产生的现象。
当利用本申请发明人提出的上述方法时,能够使分散在树脂10中的导电性粒子高效地自行聚合在电极间,因此能够实现均一性佳且生产率高的基板间的连接。
下面,一边参照附图,一边对本发明的实施方式进行说明。在下面的附图中,为了简化说明,用同一参照符号来表示实质上具有同一功能的构成要素。此外,本发明并没有被下记实施方式所限定。
(第一实施方式)
图2(a)至图2(d)是表示本发明的第一实施方式中的基板间的连接方法的工序剖视图,图3是图2(a)所示的工序时的俯视图。此外,图2(a)至图2(d)所示的各个工序的剖视图是沿着图3的虚线IIa-IIa剖开后所看到的剖视图。
首先,如图2(a)所示,将含有导电性粒子(例如,焊锡粉)11的树脂10供到具有第一电极31的第一基板30上。此时,在树脂10的边缘部附近,设置有将第一基板30和第二基板32之间封闭起来的隔壁部件20。例如图3所示,隔壁部件20围绕着树脂10的边缘部的三面而设,没有设置隔壁部件20的树脂10的边缘部朝外部开放。在此,在图3中,虽然隔壁部件20是紧挨着树脂10的边缘部设置的,但是只要隔壁部件20是将基板30、32之间封闭起来的状态,则也可以使该隔壁部件20与树脂10的边缘部分离开。此外,在下文中将对隔壁部件20的设置方法进行说明。
接着,如图2(b)所示,在树脂10的表面,与第一基板30相向地设置具有第二电极33的第二基板32。
在该状态下,若加热树脂10,则如图2(c)所示,树脂10中的气泡产生剂(未图示)产生气泡14,树脂10由于所产生的气泡14的增大而被该气泡14向外推出。被推出的树脂10在电极间自行聚合为柱状。
然后,如图2(d)所示,若进一步加热树脂10,则已被引导到电极间的导电性粒子11熔化,在相对于导电性粒子11来说可湿性高的电极间形成由熔化的导电性粒子构成的连接体13。由此,能够形成使第一电极31和第二电极33之间通过连接体13电连接并且用树脂10将第一基板30和第二基板32之间填充起来的状态。
在上述方法中,因为在树脂10的边缘部附近,设置有将第一基板30和第二基板32之间封闭起来的隔壁部件20,所以由于所产生的气泡14增大,使得被隔壁部件20封闭住的那一侧的封闭空间中所存在的树脂的压力上升。其结果是,所产生的气泡14由于隔壁部件20侧与开放侧的压力差,而从隔壁部件20侧向朝着外部开放的树脂10的边缘部方向移动,同时形成气泡流。此时,边增大边移动的气泡14从相邻的电极间穿过。为此,残存在电极间以外的区域的包含导电性粒子11的树脂10被推到相向的电极间并自行聚合起来,同时进行移动的气泡14从朝外部开放的树脂10的边缘部被排到外部。
也就是说,因为进行移动的气泡14形成了气泡流,将气泡14从隔壁部件20侧引导到开放侧,由此能够控制在树脂10中产生的气泡14的移动方向,所以能够有效地将树脂10中产生的气泡14排到隔壁部件20所围绕的区域之外,从而能够除去残存在第一基板30和第二基板32之间的气泡。
还有,在气泡14从隔壁部件20侧朝开放侧移动的过程中,残存在相邻的电极间的导电性粒子11的残渣从气泡14的移动通路上被推到相向的电极间,并在电极间聚集起来,所以能够减少导电性粒子11的残渣。
由此,能够减少导电性粒子11的残渣及气泡的残渣(void)。导电性粒子11的残渣会成为短路的原因,而气泡的残渣会成为由于吸湿而引起的离子迁移等不良现象产生的原因以及在后面的工序中进行再加热时可能产生的电极间剥离的原因。其结果是,使得均一性提高,并且能够确保高绝缘性和高连接强度,从而能够实现高可靠性的基板间的连接。
在此,可以在电极间形成连接体13以后,紧接着使残存在基板30、32间的树脂10固化,从而将第一基板30和第二基板32固定起来。
由此,能够提高第一基板30和第二基板32的牢固的机械固定性和相邻电极间的绝缘可靠性。而且,例如像倒装片组装那样,在布线基板上安装了半导体芯片以后,不再需要为了将半导体芯片固定在布线基板上而向半导体芯片和布线基板之间注入底部填充材料的工序,通过一连串的工序能够同时进行电极间的电连接和基板30、32间的固定,所以能够实现生产性更高的基板间的连接。
此外,隔壁部件20是为了有效地将树脂10中产生的气泡14排到外部而设的,因此还可以在使树脂10自行聚合在电极间以后、或者在电极间形成了由已熔化的导电性粒子构成的连接体13后,再将隔壁部件20除去。
在此,图2(a)至图2(d)以及图3中所示的各个结构的大小以及相对的位置关系(例如,导电性粒子11的大小、第一基板30和第二基板32之间的间隙的距离等)是为了便于说明而简单标示的,并不表示实际的尺寸等。
还有,虽然在图2(d)中所示的是连接体13中的导电性粒子11全部熔化后再固化起来的状态,但是没有必要一定是熔融·固化起来的状态。例如,还包括导电性粒子11的一部分没有熔化的状态以及下述状态,即:导电性粒子11的表面熔化后再固化起来,而在导电性粒子11之间、或者导电性粒子11与第一电极31或第二电极33的表面之间的界面形成金属键的状态。
还有,虽然在图2(a)至图2(d)中,在第一电极31及第二电极33的所有电极间都形成了连接体13,但是也可以使连接体13形成在基板上的一部分电极间。
在此,在本发明的实施方式中所使用的树脂10、导电性粒子11、气泡产生剂以及隔壁部件20并没有被特别限定,分别能够使用以下所示的材料。
树脂10只要是粘度在下述程度的树脂即可,即:在从室温到导电性粒子11的熔化温度的范围内,该树脂能够流动。还包括通过加热使粘度下降到能流动的程度的树脂。作为能够使用的代表性示例,能够列举出环氧树脂、酚醛树脂、硅树脂、邻苯二甲酸二烯丙酯树脂(diallyl phthalate resin)、呋喃树脂或三聚氰胺甲醛树脂等热固性树脂、聚酯弹性体(polyesterelastomer)、氟树脂、聚酰亚氨树脂、聚酰胺树脂或芳族聚酰胺树脂(aramidresin)等热塑树脂、光(紫外线)固化树脂等、或者将这些组合起来的材料。除了树脂以外,还能够使用高沸点溶剂、油(oil)等。还能不使树脂10中含有气泡产生剂,而通过在加热时使树脂10沸腾并分解,从而在树脂10中产生气泡。还有,也可以在第一基板30及第二基板32中的至少一个基板上设置产生气泡的气泡产生源。
导电性粒子11是包含金属粒子、焊锡粒子、被镀焊锡或镀金属的金属粒子以及被镀焊锡或镀金属的树脂粒子中的至少之一的物质,能够列举的示例有例如锡铋(Sn-Bi)系列、锡银(Sn-Ag)系列等焊锡合金或者铜(Cu)、银(Ag)、银铜合金(AgCu)等金属。在本发明中,因为是利用导电性粒子的熔化实现电极间的电连接的,所以优选在导电性粒子的表面尽可能地不生长氧化膜。还有,也可以是彼此相接触的导电性粒子的表面熔化,而在彼此之间的界面上形成金属键的状态。
气泡产生剂只要是在加热时由于沸腾而产生气泡的材料即可,作为能够使用的代表性示例,能够列举出己烷、醋酸乙烯酯(vinyl acetate)、异丙醇、水、1,4-二氧六环或乙酸丁酯(butyl acetate)等低沸点材料以及盐酸二甲胺(dimethylamine hydrochloride)、二甲基亚砜、乙二醇、α-松油醇、丁基卡必醇或二甘醇丁醚醋酸酯(butyl carbitol acetate)等沸点比较高的材料。
此外,在使已自行聚合在电极间的树脂10中的导电性粒子11熔化时,导电性粒子11可以当在电极间聚集起来的时候有一部分产生熔化,也可以在完成电极间聚集时才开始熔化。能够通过选定所使用的导电性粒子11的熔点、所使用的树脂10的粘度及所使用的气泡产生剂的沸点的组合以及进行加热的温度曲线(temperature profile),来适当地设定这些导电性粒子11开始熔化的时间、开始产生气泡14的时间以及气泡14朝开放的方向移动后从树脂10的边缘部被排出的时间。
形成在第一基板30上的隔壁部件20能够用各种方法形成。例如,能够利用在规定位置涂布树脂的方法形成隔壁部件20。此时,隔壁部件20的树脂的组成可以与树脂10相同,但是因为使用隔壁部件20的目的在于将第一基板30和第二基板32之间封闭起来,所以优选的并不是像树脂10那样含有导电性粒子11及气泡产生剂的树脂,而是在加热工序中导电性粒子11没有熔化及没有气泡14产生的树脂。
还有,为了将第一基板30和第二基板32之间封闭起来,隔壁部件20优选使用至少在树脂10的加热工序中粘度比树脂10高的树脂。还有,当使用固化型树脂时,优选使用固化速度比树脂10快的树脂。
还有,由于用树脂形成隔壁部件20,所以如图2(a)所示,能够与含有导电性粒子11的树脂10同时形成隔壁部件20,从而能够减少工序数量,并且就连第一基板30及第二基板32之间微小的间隙也能够封闭住。
还有,用于隔壁部件20的树脂除了膏状树脂组成物之外,还可以是例如片状、胶状那样的树脂组成物。
作为此种树脂,优选例如环氧树脂等热固性树脂。该环氧树脂并没有被特别加以限定,能够列举出例如双酚A型环氧树脂、双酚F型环氧树脂、联苯型环氧树脂、酚醛型环氧树脂(phenol novolac epoxy resin)、甲酚酚醛(cresol novolac)型环氧树脂、双环戊二烯型环氧树脂、萘基型环氧树脂(naphthalene epoxy resin)、脂环族环氧树脂等。还能够使用作为高分子量环氧树脂的苯氧基树脂。所述这些树脂可以单独使用,也可以同时使用两种以上的所述树脂。
能够列举出的所述热塑性树脂有例如聚乙烯醇缩丁醛树脂等醋酸乙烯树脂、苯氧基树脂、丙烯酸酯树脂、甲基丙烯酸树脂、聚酰胺、聚缩醛、聚苯硫醚、聚酰亚胺、聚四氟乙烯、聚醚醚酮、聚醚砜、氨基甲酸乙酯、聚酯、聚乙烯、聚丙烯、聚苯乙烯等。
还有,除了固化剂以外,还可以在树脂10或隔壁部件20中添加固化促进剂、阻聚剂、敏化剂、硅烷偶联剂、触变剂、阻燃剂等添加剂。还有,可以通过在其中添加触变剂等添加剂来进行粘度调整,从而事先在树脂10及隔壁部件20之间设置粘度差。还有,也可以根据需要添加二氧化硅粒子、氧化铝粒子等填充剂。
还能通过事先在第一基板30或第二基板32的表面、或者在第一基板30及第二基板32这两个基板的表面的规定位置,用与树脂10不同的材料(例如,阻焊膜、盖膜(coverlay)等)形成隔壁部件20,来封闭住第一基板30和第二基板32之间的间隙。此时,当与第一电极31相向地设置了第二电极33时,可以事先设定好隔壁部件20的高度,使得第一电极31和第二电极33之间的间隙成为规定的间隔(例如,1~100μm)。能够根据第一电极31和第二电极33之间的间隙相对于第一基板30和第二基板32间的间隙的比率及树脂的粘度,来决定该间隔的适当高度。还有,隔壁部件20可以是按照第一基板30或第二基板32的外形加工而成的夹具(例如,特氟纶(teflon)加工产品),此时当基板间的连接工序结束后,还能够将该隔壁部件20拆下来。
还有,第一基板30及第二基板32只要是形成有能够形成由导电性材料构成的连接体13的第一电极31及第二电极33的基板即可,例如,除了刚性基板(例如,FR4基板)以外,还可以是柔性基板或刚柔结合基板。也可以是电路基板、单面布线基板、双面布线板或多层布线板,还可以是内藏有电子元件的元件内藏基板。还有,并没有局限于由树脂形成的基板(例如,FR4基板),也可以是陶瓷基板。而且,还可以是半导体芯片。该半导体芯片还包括下述情况,即:向半导体芯片的电极上供给了金凸块等导电性粒子、或者以半导体裸芯片装于具有多个电极端子(连接盘(land))的内插板(interposer)上的形态倒装片组装在基板上。
还有,只要第一电极31及第二电极33中的至少任意一方为凸状即可,另一方可以为凹状或者可以位于与基板表面相同的平面上。还有,可以在第一电极31及第二电极33上形成布线图案。
此外,消除气泡14这一意义上的消泡包括物理消泡和化学消泡。物理消泡包括改变压力(例如,减压)、加热、外加频率等,化学消泡包括马拉高尼(Marangoni)效应、气泡物质的分离、pH变化·脱水·盐析、添加消泡剂等。在本实施方式中,由于在基板间在隔壁部件附近与开放侧之间存在压力差,因而使所产生的气泡的移动方向成为一定方向,并容易将气泡排到树脂外部,由此进行了消泡(气泡的除去)。
在此,一边参照图4(a)至图4(c)以及图5(a)、图5(b),一边对在本发明的基板间的连接方法中成为关键的部分即在树脂10内产生的气泡14从隔壁部件20向开放侧移动、排出的原理进行简单地说明。此外,为了简化说明,省略了树脂10、导电性粒子11、第一电极31及第二电极33。
图4(a)是当假设树脂10无限远地展开时,对由于加热而产生的气泡14进行扩大的状态进行表示的图。由于气泡14的周围为全方位开放状态,所以气泡14朝全方位扩展。
图4(b)是处于树脂10被夹在第一基板30和第二基板32之间的状态时的剖视图。由于进行扩大的气泡14的周围成为该气泡14的上下方向被第一基板30及第二基板32封闭的状态,所以气泡14朝着图中箭头所示的开放方位扩大。
图4(c)是下述状态时的剖视图,即:树脂10被夹在第一基板30和第二基板32之间,并且还用隔壁部件20将第一基板30和第二基板32间的一侧间隙封闭起来。由于进行扩大的气泡14处于该气泡14的上下方向被第一基板30及第二基板32封闭的状态,而且在其水平方向上,形成有隔壁部件20的一侧被封闭起来,因此存在于隔壁部件20附近的封闭空间中的树脂10的压力P1上升。为此,与开放侧的压力(大气压)P0之间将产生压力差。其结果是气泡14朝着图中箭头所示的开放方位扩大。
图5(a)、图5(b)与图4(c)的状态相同,是下述状态时的剖视图,即:树脂10被夹在第一基板30和第二基板32之间,并且还用隔壁部件20将第一基板30和第二基板32间的一侧间隙封闭起来。
如图5(a)所示,在树脂10中,假设有两处产生了气泡14。气泡14随着时间的推移而扩大。但是,当考虑气泡14在隔壁部件20附近的封闭空间内扩大和在开放侧的开放空间扩大的情况时,由于扩大成长的气泡14的挤压,存在于隔壁部件20附近的封闭空间中的树脂的压力P1上升,所以在隔壁部件20附近的压力P1与存在于开放侧空间中的树脂的压力P2之间会产生压力差(P1-P2)。而且,存在于开放侧空间中的树脂的压力P2与开放侧的压力(大气压)P0之间也会产生压力差(P2-P0)。因此,如图5(b)所示,增大的气泡14从压力高的一侧向压力低的一侧、也就是说从隔壁部件20向开放的方向移动。还有,如图4(c)所示,在隔壁部件20附近产生的气泡朝开放的方向扩大,因而将在开放侧产生的气泡推出。
利用上述原理,通过设置隔壁部件20,将第一基板30和第二基板32之间的间隙封闭起来,而能够使产生并扩大的气泡14从隔壁部件20向开放的方向移动。此外,当在第一基板30和第二基板32之间存在第一电极31及第二电极33时,树脂10及气泡14保持图1(a)、图1(b)所示的关系,所以气泡14仅在相邻的电极间进行移动,树脂10则被推到相向的电极间。
下面,对本实施方式中的具体的实施例进行说明。
用FR-4基板作为第一基板30,在该第一基板30的表层布线图案的一部分形成有成为第一电极31的布线层(间距为200μm、电极直径为100μm、厚度为18μm、排列为10×10个区域阵列),并且用半导体芯片(硅存储半导体、厚度为0.3mm、尺寸为10mm×10mm、在与第一电极31相向的位置具有第二电极33)作为第二基板32,使该第二基板32与该第一基板30相向。还有,用镀上镍、金等金属的电极作为第一电极31及第二电极33。
用单组分固化型环氧树脂形成隔壁部件20,如图3所示,隔壁部件20以从三个方向围绕存在第一电极31及第二电极33的区域的形态将第一基板30和第二基板32之间封闭起来。
在树脂10中,包含作为主要成分的双酚A型环氧树脂和作为固化剂的酸酐。还包含作为导电性粒子11的焊锡粒子SnBi、以及进一步包含作为焊锡粒子的氧化膜除去剂的硬脂酸和作为气泡产生剂的二甘醇正己醚(diethylene glycol-n-hexyl ether)(沸点:140至141℃)。此时,树脂10、导电性粒子11和焊锡粒子的氧化膜除去剂的比例(wt%)为45∶50∶5,利用搅拌机进行搅拌,从而将所述材料混合在一起。
如图2(c)所示,为了通过加热使树脂10中产生气泡14,将第一基板30置于200℃的加热板上对树脂10进行加热,加热时间大约为30秒(不包括大约10秒钟的预热时间)。然后,以120℃进行加热,加热时间为30分钟,以使树脂10固化。
利用所述方法,制作出倒装片组件后,再对相向的电极间的电连接进行检测,其结果是能够判明为良好的初期连接。
(第一实施方式的变形例)
一边参照图6(a)至图6(e),一边对第一实施方式的变形例进行说明。在此,图6(a)至图6(e)是与图3相对应的俯视图,表示了隔壁部件20的设置方法。此外,为了简化说明,省略了第二基板32、第二电极33、导电性粒子11、连接体13以及第一电极31上的树脂10等。
图6(a)中所示的隔壁部件20设置为至少从正交的两个方向围绕着存在第一电极31及第二电极33的区域,并且将第一基板30和第二基板32之间封闭起来。
通过这样设置隔壁部件20,能够控制在树脂10中所产生的气泡14的移动方向,使该气泡14朝着从两个方向上的隔壁部件20正交的交点展开的方向移动,因此能够根据组件的结构,将气泡14的排出方向引导到任意的方向。
图6(b)中所示的隔壁部件20设置为至少从平行的两个方向围绕着存在第一电极31及第二电极33的区域,并且将第一基板30和第二基板32之间封闭起来。
通过这样设置隔壁部件20,能够控制在树脂10中所产生的气泡14的移动方向,使该气泡14沿着直线朝彼此相反的方向移动,因此能够根据组件的结构,将气泡14的排出方向引导到任意的方向。
图6(c)及图6(d)中所示的隔壁部件20设置为至少从三个方向围绕着存在第一电极31及第二电极33的区域,并且将第一基板30和第二基板32之间封闭起来。还有,如图6(d)所示,能够通过设置隔壁部件20来任意地改变开放口,从而还能够对所排出的气泡量进行控制。
通过这样设置隔壁部件20,能够对在树脂10中所产生的气泡14的移动方向进行控制,使树脂10中所产生的气泡14从隔壁部件20朝着开放侧会聚起来,从而形成引导气泡14的整体流,因此能够有效地将树脂10中所产生的气泡14排到被隔壁部件20所围绕的区域之外,所以能够除去残存在第一基板30和第二基板32之间的气泡14。
图6(e)是表示在第一电极31及第二基板32被布置为外围(peripheral)状时的隔壁部件20的设置图,隔壁部件20设置为将第一基板30和第二基板32之间的不存在第一电极31及第二电极33的中央部填满并封闭起来。
通过这样设置隔壁部件20,能够对在树脂10中所产生的气泡14的移动方向进行控制,形成将树脂10中所产生的气泡14从隔壁部件20引导到开放着的第一基板30或第二基板32的外侧的整体流,因此能够有效地将树脂10中所产生的气泡14排到区域外,所以能够除去残存在第一基板30和第二基板32之间的气泡14。还有,由于用隔壁部件20来填充基板间的不存在第一电极31及第二电极33的中央部,因而与在基板间整面地涂敷包含导电性粒子11的树脂10的情况相比,能够大幅度地抑制导电性粒子11的残渣,所以能够使连接可靠性提高。
此外,将第一基板30和第二基板32之间封闭起来的隔壁部件20的设置并没有被图6(a)至图6(e)所示的变形例限定,只要存在用来排放气泡14的开放口即可。
下面,一边参照图7(a)至图7(e),一边说明第一实施方式的其它变形例。在此,图7(a)至图7(e)是与图2(d)相对应的剖视图,表示的是隔壁部件20的形成方法。
图7(a)中所示的隔壁部件20在第二基板32的端面形成为倒角(fillet)形状。
还有,图7(b)中所示的隔壁部件20像填充树脂那样覆盖住第二基板32。
还有,图7(c)中所示的隔壁部件21由在第一基板30和第二基板32的表面形成的阻焊膜或盖膜构成。
还有,图7(d)中所示的隔壁部件22的结构与形成在电极间的连接体13相同,是由形成在假电极间的连接体构成的。
还有,图7(e)中所示的隔壁部件23由在基板间的连接工序中按照第一基板30或第二基板32的外形加工而成的夹具构成。此时,在完成了基板间的连接后,还能将隔壁部件23拆下来。
下面,对第一实施方式的变形例中的具体实施例进行说明。
所使用的第一基板30、第二基板32、树脂10、导电性粒子11、气泡产生剂以及隔壁部件20与所述第一实施方式的实施例相同。此外,如图6(a)所示,隔壁部件20设置成从正交的两个方向围绕着存在有第一电极31及第二电极33的区域,并且将第一基板30和第二基板32之间封闭起来。
还有,用来使树脂10中产生气泡14的热处理、使导电性粒子11熔化的热处理以及使环氧树脂固化的热处理采用了与所述第一实施方式中的实施例相同条件的加热温度及加热时间。
利用所述方法,制作出倒装片组件后,再对相向的电极间的电连接进行检测,其结果是能够判明为良好的初期连接。
(第二实施方式)
在第一实施方式中,如图3及图6所示,第一电极31及第二电极33在基板30、32上排列成阵列状或外围状,而与此相对,第二实施方式的特征在于:第一电极31及第二电极33分别形成为彼此平行的线状。
下面,一边参照图8(a)、图8(b)以及图9(a)、图9(b),一边对本实施方式的基板间的连接方法进行说明。此外,由于除电极31、33以外的结构以及基板间的连接工序与第一实施方式中所说明的内容基本相同,所以不再进行详细的说明。还有,本实施方式也能够发挥与第一实施方式相同的作用效果。
如图8(a)、图9(a)及图9(b)所示,在第一基板30及第二基板32上,分别彼此平行地形成有线状的第一电极31及第二电极33。并且,隔壁部件20设置为在与形成为线状的电极31、33正交的方向上围绕着存在第一电极31及第二电极33的区域,并将第一基板30和第二基板32之间封闭起来。
如图8(b)所示,通过加热树脂10,在树脂10中产生气泡14,并且将该气泡14从隔壁部件20排向开放侧。由此,如图9(a)、图9(b)所示,在除去了残存在第一基板30和第二基板32之间的气泡14的状态下,进行基板间连接,使线状的第一电极31及第二电极33通过连接体13电连接起来。
根据本实施方式,通过像第一实施方式那样在树脂10的边缘部附近,设置将基板30、32间封闭起来的隔壁部件20,从而能够有效地将树脂10中产生的气泡14从没有设置隔壁部件20的树脂10的边缘部向外部排出,因此能够实现在基板30、32之间没有残留气泡的可靠性高的基板间的连接。
还有,在使树脂10中产生的气泡14移往朝外部开放的树脂10的边缘部的过程中,残留在除电极间以外的区域的导电性粒子的残渣被从气泡14的移动通路上推开,而聚集到相向的电极间,所以能够减少导电性粒子的残渣。由此,能够实现不存在导电性粒子残渣的绝缘性佳的基板间的连接。
下面,对本实施方式的具体实施例进行说明。
用基材由聚酰亚胺形成的柔性基板作第一基板30及第二基板32,在表层的布线图案的一部分上分别布置成为第一电极31及第二电极33的布线层(间距为200μm、线宽为100μm、厚度为12μm、布线数为30条),并且使成为该第一电极及第二电极的布线层彼此相向。
还有,所使用的树脂10、导电性粒子11、气泡产生剂以及隔壁部件20与第一实施方式的实施例相同。如图8(a)、图8(b)所示,隔壁部件20设置为在与形成为线状的电极31、33正交的方向上围绕着存在有第一电极31及第二电极33的区域,并且将第一基板30和第二基板32之间封闭起来。
还有,用来使树脂10中产生气泡14的热处理、使导电性粒子11熔化的热处理以及使环氧树脂固化的热处理采用了与所述第一实施方式中的实施例相同条件的加热温度及加热时间。
利用所述方法,制作出基板间连接结构以后,再对相向的电极间(布线层间)的电连接进行检测,其结果是能够判明为良好的初期连接。
(第二实施方式的变形例)
一边参照图10(a)至图10(d),一边对第二实施方式的变形例进行说明。在此,图10(a)至图10(d)是与图8(a)相对应的俯视图,表示的是隔壁部件20的设置方法。此外,为了简化说明,省略了第二基板32、第二电极33、导电性粒子11、连接体13以及第一电极31上的树脂10等。
图10(a)中所示的隔壁部件20设置为:在与形成为线状的第一电极31及第二电极33正交的方向上形成有一个隔壁部件20,并且在与该第一电极31及第二电极33平行的方向上且在电极31、33的两端部的外侧形成有两个隔壁部件20,由此从三个方向围绕着存在电极31、电极33的区域,并且将第一基板30和第二基板32之间封闭起来。
通过这样设置隔壁部件20,从而在线状的第一电极31及第二电极33的两端部的外侧,也存在与线状的第一电极31及第二电极33平行的隔壁部件20,因此能够有效地将在线状的第一电极31及第二电极33的两端部的外侧产生的气泡14排到外部。
图10(b)中所示的隔壁部件20是在图10(a)所示的隔壁部件20的基础上去掉了在与形成为线状的第一电极31及第二电极33正交的方向上设置的隔壁部件20。也就是说,隔壁部件20设置为:在与形成为线状的第一电极31及第二电极33平行的方向上且在电极31、33的两端部的外侧形成有两个隔壁部件20,由此从两个方向围绕着存在电极31、电极33的区域,并且将第一基板30和第二基板32之间封闭起来。
通过这样设置隔壁部件20,能够有效地将在形成为线状的第一电极31及第二电极33的两端部的外侧产生的气泡14排到外部。
图10(c)中所示的隔壁部件20设置在与形成为线状的第一电极31及第二电极33正交的方向上并位于存在有电极31、33的区域的中心附近的位置,由此从一个方向围绕着存在电极31、33的区域,并且将第一基板30和第二基板32之间封闭起来。
通过这样设置隔壁部件20,能够利用隔壁部件20的设置位置来控制在树脂10中产生的气泡14的移动方向,使该气泡14沿着平行于线状电极31、33的方向从隔壁部件20的设置位置朝两侧方向移动,因此能够根据组件的结构,将气泡的排出方向引导到任意的方向。
图10(d)中所示的隔壁部件20是将图10(b)所示的隔壁部件20和图10(c)所示的隔壁部件20结合起来而成的。也就是说,隔壁部件20设置为:在与形成为线状的第一电极31及第二电极33平行的方向上且在电极31、33的两端部的外侧形成有两个隔壁部件20,并且在与形成为线状的第一电极31及第二电极33正交的方向上且在设有电极31、33的区域的中心附近的位置形成有一个隔壁部件20,由此从三个方向围绕着存在电极31、33的区域,并且将第一基板30和第二基板32之间封闭起来。
通过这样设置隔壁部件20,能够利用隔壁部件20的设置位置来控制在树脂10中产生的气泡14的移动方向,使该气泡14沿着平行于线状电极31、33的方向从隔壁部件20的设置位置向两侧移动,而且由于在线状电极31、33的两端部的外侧,也存在与线状电极31、33平行的隔壁部件20,因此能够有效地将在线状电极31、33的两端部的外侧产生的气泡14排到外部。
以上,用优选的实施方式对本发明进行了说明,但是所述内容并没有对本发明加以限定,当然能够进行各种改变。
-产业实用性-
根据本发明,能够提供一种能适用于下一代LSI的倒装片组装的、生产性及可靠性高的倒装片组装方法以及基板间连接方法。
Claims (12)
1.一种基板间的连接方法,与具有多个第一电极的第一基板相向地设置具有多个第二电极的第二基板,通过连接体使所述第一电极和所述第二电极电连接,其特征在于:
包括:
工序a,将含有导电性粒子和气泡产生剂的树脂,供向所述第一基板和所述第二基板之间的至少覆盖所述多个第一电极及第二电极的区域,
工序b,加热所述树脂,使包含在所述树脂中的所述气泡产生剂产生气泡,以及
工序c,加热所述树脂,使包含在所述树脂中的所述导电性粒子熔化;
在所述工序a中,在所述树脂的边缘部附近,设置有将所述第一基板和所述第二基板之间封闭起来的隔壁部件,并且没有设置所述隔壁部件的所述树脂的边缘部朝外部开放,
在所述工序b中,所述树脂由于所述气泡产生剂所产生的气泡的增大被该气泡向外推出,而被引导到所述第一电极和所述第二电极之间,并且所述气泡从朝所述外部开放的所述树脂的边缘部向外部排出,
在所述工序c中,已被引导到所述电极间的所述树脂中所含有的导电性粒子熔化,在所述电极间形成所述连接体。
2.根据权利要求1所述的基板间的连接方法,其特征在于:
在所述工序b中,在所述树脂中产生的所述气泡,由于所述隔壁部件附近与外部之间的压力差,而被引导到朝所述外部开放的所述树脂的边缘部后向外部排出。
3.根据权利要求1所述的基板间的连接方法,其特征在于:
在所述工序a中,所述隔壁部件设置为与所述树脂的边缘部相邻。
4.根据权利要求1所述的基板间的连接方法,其特征在于:
所述多个第一电极及所述多个第二电极,分别在所述第一基板及所述第二基板上形成为阵列状,
所述隔壁部件,沿着形成为所述阵列状的电极区域的周边的至少一条边设置。
5.根据权利要求1所述的基板间的连接方法,其特征在于:
所述多个第一电极及所述多个第二电极,分别形成在所述第一基板及所述第二基板的周边,
所述隔壁部件,设置在位于所述基板周边的电极区域的内侧。
6.根据权利要求1所述的基板间的连接方法,其特征在于:
所述多个第一电极及所述多个第二电极,分别彼此平行地形成为线状,
所述隔壁部件,设置在与形成为所述线状的电极正交的方向上。
7.根据权利要求1所述的基板间的连接方法,其特征在于:
所述多个第一电极及所述多个第二电极,分别彼此平行地形成为线状,
所述隔壁部件,在形成为所述线状的电极区域的周边,设置在与形成为所述线状的电极平行的方向上。
8.根据权利要求1所述的基板间的连接方法,其特征在于:
在所述工序b或所述工序c之后,还包括除去所述隔壁部件的工序。
9.根据权利要求1所述的基板间的连接方法,其特征在于:
在所述第一基板及所述第二基板中的至少一个基板上设有产生气泡的气泡产生源,以取代使所述树脂含有所述气泡产生剂,
在所述工序b中,所述气泡由所述气泡产生源产生。
10.根据权利要求1所述的基板间的连接方法,其特征在于:
所述第一基板及所述第二基板,由电路基板或半导体芯片形成。
11.一种倒装片组件,在电路基板上装有半导体芯片,其特征在于:
在所述电路基板及所述半导体芯片之间,利用权利要求1所述的基板间的连接方法,通过连接体使形成在所述电路基板及所述半导体芯片上的电极彼此电连接。
12.一种基板间连接结构,使具有多个电极的电路基板彼此电连接,其特征在于:
在所述电路基板间,利用权利要求1所述的基板间的连接方法,通过形成在所述电极间的连接体使所述电路基板彼此电连接。
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