JP5631910B2 - 銀被覆銅粉 - Google Patents
銀被覆銅粉 Download PDFInfo
- Publication number
- JP5631910B2 JP5631910B2 JP2012036029A JP2012036029A JP5631910B2 JP 5631910 B2 JP5631910 B2 JP 5631910B2 JP 2012036029 A JP2012036029 A JP 2012036029A JP 2012036029 A JP2012036029 A JP 2012036029A JP 5631910 B2 JP5631910 B2 JP 5631910B2
- Authority
- JP
- Japan
- Prior art keywords
- silver
- copper powder
- coated copper
- coated
- branches
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 189
- 229910052709 silver Inorganic materials 0.000 title claims description 144
- 239000004332 silver Substances 0.000 title claims description 144
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims description 132
- 239000002245 particle Substances 0.000 claims description 81
- 239000010949 copper Substances 0.000 claims description 37
- 229910052802 copper Inorganic materials 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 25
- 239000000843 powder Substances 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 18
- 210000001787 dendrite Anatomy 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 5
- 230000001747 exhibiting effect Effects 0.000 claims description 4
- 239000008151 electrolyte solution Substances 0.000 description 31
- 239000000243 solution Substances 0.000 description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 23
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 22
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 22
- 229910001431 copper ion Inorganic materials 0.000 description 21
- 238000005868 electrolysis reaction Methods 0.000 description 20
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical class OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 12
- 210000004027 cell Anatomy 0.000 description 11
- 239000011162 core material Substances 0.000 description 11
- 150000003378 silver Chemical class 0.000 description 11
- 229910001961 silver nitrate Inorganic materials 0.000 description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000007747 plating Methods 0.000 description 9
- 239000002002 slurry Substances 0.000 description 9
- 239000002738 chelating agent Substances 0.000 description 8
- 229920000159 gelatin Polymers 0.000 description 8
- 230000002349 favourable effect Effects 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 108010010803 Gelatin Proteins 0.000 description 6
- 239000008273 gelatin Substances 0.000 description 6
- 235000019322 gelatine Nutrition 0.000 description 6
- 235000011852 gelatine desserts Nutrition 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- -1 silver ions Chemical class 0.000 description 6
- 238000006467 substitution reaction Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 5
- 239000003638 chemical reducing agent Substances 0.000 description 4
- 229910000365 copper sulfate Inorganic materials 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229940100890 silver compound Drugs 0.000 description 4
- 150000003379 silver compounds Chemical class 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000003828 vacuum filtration Methods 0.000 description 3
- DMQQXDPCRUGSQB-UHFFFAOYSA-N 2-[3-[bis(carboxymethyl)amino]propyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)CCCN(CC(O)=O)CC(O)=O DMQQXDPCRUGSQB-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- ZXSQEZNORDWBGZ-UHFFFAOYSA-N 1,3-dihydropyrrolo[2,3-b]pyridin-2-one Chemical compound C1=CN=C2NC(=O)CC2=C1 ZXSQEZNORDWBGZ-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- RBWNDBNSJFCLBZ-UHFFFAOYSA-N 7-methyl-5,6,7,8-tetrahydro-3h-[1]benzothiolo[2,3-d]pyrimidine-4-thione Chemical compound N1=CNC(=S)C2=C1SC1=C2CCC(C)C1 RBWNDBNSJFCLBZ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- YWXYYJSYQOXTPL-SLPGGIOYSA-N isosorbide mononitrate Chemical compound [O-][N+](=O)O[C@@H]1CO[C@@H]2[C@@H](O)CO[C@@H]21 YWXYYJSYQOXTPL-SLPGGIOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229920002113 octoxynol Polymers 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 239000004590 silicone sealant Substances 0.000 description 1
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 1
- 229940071536 silver acetate Drugs 0.000 description 1
- LKZMBDSASOBTPN-UHFFFAOYSA-L silver carbonate Substances [Ag].[O-]C([O-])=O LKZMBDSASOBTPN-UHFFFAOYSA-L 0.000 description 1
- 229910001958 silver carbonate Inorganic materials 0.000 description 1
- SDLBJIZEEMKQKY-UHFFFAOYSA-M silver chlorate Chemical compound [Ag+].[O-]Cl(=O)=O SDLBJIZEEMKQKY-UHFFFAOYSA-M 0.000 description 1
- XNGYKPINNDWGGF-UHFFFAOYSA-L silver oxalate Chemical compound [Ag+].[Ag+].[O-]C(=O)C([O-])=O XNGYKPINNDWGGF-UHFFFAOYSA-L 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- YPNVIBVEFVRZPJ-UHFFFAOYSA-L silver sulfate Chemical compound [Ag+].[Ag+].[O-]S([O-])(=O)=O YPNVIBVEFVRZPJ-UHFFFAOYSA-L 0.000 description 1
- 229910000367 silver sulfate Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
- B22F2301/255—Silver or gold
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Powder Metallurgy (AREA)
- Non-Insulated Conductors (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Electrolytic Production Of Metals (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012036029A JP5631910B2 (ja) | 2011-10-21 | 2012-02-22 | 銀被覆銅粉 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011232196 | 2011-10-21 | ||
JP2011232196 | 2011-10-21 | ||
JP2012036029A JP5631910B2 (ja) | 2011-10-21 | 2012-02-22 | 銀被覆銅粉 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014120721A Division JP2014220244A (ja) | 2011-10-21 | 2014-06-11 | 銀被覆銅粉 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013100592A JP2013100592A (ja) | 2013-05-23 |
JP2013100592A5 JP2013100592A5 (zh) | 2013-12-19 |
JP5631910B2 true JP5631910B2 (ja) | 2014-11-26 |
Family
ID=48099409
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012036029A Active JP5631910B2 (ja) | 2011-10-21 | 2012-02-22 | 銀被覆銅粉 |
JP2014120721A Pending JP2014220244A (ja) | 2011-10-21 | 2014-06-11 | 銀被覆銅粉 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014120721A Pending JP2014220244A (ja) | 2011-10-21 | 2014-06-11 | 銀被覆銅粉 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP5631910B2 (zh) |
KR (1) | KR20130044132A (zh) |
CN (1) | CN103056356B (zh) |
TW (1) | TWI570196B (zh) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5503813B1 (ja) * | 2012-08-02 | 2014-05-28 | 三井金属鉱業株式会社 | 導電性フィルム |
JP6278969B2 (ja) * | 2013-10-24 | 2018-02-14 | 三井金属鉱業株式会社 | 銀被覆銅粉 |
JP5876971B2 (ja) * | 2014-01-29 | 2016-03-02 | 三井金属鉱業株式会社 | 銅粉 |
KR101483905B1 (ko) * | 2014-04-04 | 2015-01-16 | 한동철 | 수분경화형 실리콘을 이용한 emi 차폐용 디스펜싱 가스켓에 적용 가능한 은코팅구리분말의 제조 방법 |
JP2015214742A (ja) * | 2014-05-13 | 2015-12-03 | 有限会社 ナプラ | 多結晶金属粒子、及び、導電性ペースト |
JP6001796B2 (ja) * | 2014-06-16 | 2016-10-05 | 三井金属鉱業株式会社 | 銅粉、その製造方法、及びそれを含む導電性組成物 |
JP6432174B2 (ja) * | 2014-06-18 | 2018-12-05 | セメダイン株式会社 | 導電性接着剤 |
JP5858201B1 (ja) * | 2014-06-25 | 2016-02-10 | 住友金属鉱山株式会社 | 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート |
JP5858200B1 (ja) * | 2014-07-07 | 2016-02-10 | 住友金属鉱山株式会社 | 銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート、帯電防止塗料 |
JP5858202B1 (ja) * | 2014-08-26 | 2016-02-10 | 住友金属鉱山株式会社 | 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート |
EP3187279A4 (en) | 2014-08-26 | 2018-04-18 | Sumitomo Metal Mining Co., Ltd. | Silver-coated copper powder, and conductive paste, conductive coating material and conductive sheet each of which uses same |
JP5790900B1 (ja) * | 2014-09-12 | 2015-10-07 | 住友金属鉱山株式会社 | 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート |
KR20170031215A (ko) | 2014-09-12 | 2017-03-20 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 은코팅 동분 및 그것을 이용한 도전성 페이스트, 도전성 도료, 도전성 시트 |
US20180079000A1 (en) * | 2015-03-26 | 2018-03-22 | Sumitomo Metal Mining Co., Ltd. | Silver-coated copper powder and conductive paste, conductive material, and conductive sheet using same |
WO2016151858A1 (ja) * | 2015-03-26 | 2016-09-29 | 住友金属鉱山株式会社 | 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート |
TWI553661B (zh) * | 2015-03-27 | 2016-10-11 | Sumitomo Metal Mining Co | Silver powder and its use of conductive paste, conductive paint, conductive film |
JP6056901B2 (ja) * | 2015-04-30 | 2017-01-11 | 住友金属鉱山株式会社 | 樹枝状銀コート銅粉の製造方法、及びその樹枝状銀コート銅粉を用いた銅ペースト、導電性塗料、導電性シート |
JP5907301B1 (ja) | 2015-05-15 | 2016-04-26 | 住友金属鉱山株式会社 | 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法 |
JP5907302B1 (ja) | 2015-05-15 | 2016-04-26 | 住友金属鉱山株式会社 | 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銅粉の製造方法 |
US10486231B2 (en) | 2015-08-31 | 2019-11-26 | Mitsui Mining & Smelting Co., Ltd. | Silver-coated copper powder |
CN108140450B (zh) * | 2016-03-15 | 2021-08-03 | 积水化学工业株式会社 | 含金属的粒子、连接材料、连接结构体及连接结构体的制造方法 |
KR101940772B1 (ko) | 2018-07-13 | 2019-01-21 | 서재원 | 식판 자동 투입장치 |
CN109598039B (zh) * | 2018-11-21 | 2022-07-08 | 中国电建集团成都勘测设计研究院有限公司 | 对称三岔形梁式岔管及其设计方法 |
WO2023074580A1 (ja) * | 2021-10-25 | 2023-05-04 | トッパン・フォームズ株式会社 | 焼結材、金属焼結体、焼結材の製造方法、接合体の製造方法、及び接合体 |
Family Cites Families (16)
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---|---|---|---|---|
JPS60226570A (ja) * | 1984-04-25 | 1985-11-11 | Fukuda Kinzoku Hakufun Kogyo Kk | 導電塗料用銅粉およびその製造方法 |
JPS6381706A (ja) * | 1986-09-26 | 1988-04-12 | 三井金属鉱業株式会社 | 銅系厚膜用組成物 |
JPS63286477A (ja) * | 1987-05-19 | 1988-11-24 | Mitsui Mining & Smelting Co Ltd | 導電性塗料 |
JPH01119602A (ja) * | 1987-11-02 | 1989-05-11 | Mitsui Mining & Smelting Co Ltd | 銀被覆銅粉の製造法 |
JP2706110B2 (ja) * | 1988-11-18 | 1998-01-28 | 福田金属箔粉工業株式会社 | 銅微粉末の製造方法 |
US4944797A (en) * | 1989-01-03 | 1990-07-31 | Gte Products Corporation | Low oxygen content fine spherical copper particles and process for producing same by fluid energy milling and high temperature processing |
JPH10147801A (ja) * | 1996-11-20 | 1998-06-02 | Tokuyama Corp | 樹枝状銅粉の表面処理法 |
US6036839A (en) * | 1998-02-04 | 2000-03-14 | Electrocopper Products Limited | Low density high surface area copper powder and electrodeposition process for making same |
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CN1206064C (zh) * | 2002-10-10 | 2005-06-15 | 武汉大学 | 一种镀银铜粉的制备方法 |
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CN101514486B (zh) * | 2009-02-27 | 2011-09-21 | 华东师范大学 | 一种Cu树枝状单晶纳米材料及其制备方法 |
CN102211186B (zh) * | 2011-06-08 | 2013-10-16 | 北京工业大学 | 一种树枝状铜粉表面镀银的方法 |
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