JP5626856B2 - 硬化性樹脂組成物およびその硬化物 - Google Patents

硬化性樹脂組成物およびその硬化物 Download PDF

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Publication number
JP5626856B2
JP5626856B2 JP2010133745A JP2010133745A JP5626856B2 JP 5626856 B2 JP5626856 B2 JP 5626856B2 JP 2010133745 A JP2010133745 A JP 2010133745A JP 2010133745 A JP2010133745 A JP 2010133745A JP 5626856 B2 JP5626856 B2 JP 5626856B2
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JP
Japan
Prior art keywords
group
resin composition
curable resin
acid
structural formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010133745A
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English (en)
Japanese (ja)
Other versions
JP2011256326A (ja
Inventor
静 青木
静 青木
義浩 川田
義浩 川田
智江 佐々木
智江 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP2010133745A priority Critical patent/JP5626856B2/ja
Priority to CN201180028816.XA priority patent/CN102939313B/zh
Priority to PCT/JP2011/063312 priority patent/WO2011155583A1/ja
Priority to SG2012090551A priority patent/SG186252A1/en
Priority to KR1020127031434A priority patent/KR101699773B1/ko
Priority to TW100120617A priority patent/TWI494376B/zh
Publication of JP2011256326A publication Critical patent/JP2011256326A/ja
Application granted granted Critical
Publication of JP5626856B2 publication Critical patent/JP5626856B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C08G59/3263—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/092—Polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3435—Piperidines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP2010133745A 2010-06-11 2010-06-11 硬化性樹脂組成物およびその硬化物 Expired - Fee Related JP5626856B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2010133745A JP5626856B2 (ja) 2010-06-11 2010-06-11 硬化性樹脂組成物およびその硬化物
CN201180028816.XA CN102939313B (zh) 2010-06-11 2011-06-10 可固化树脂组合物及其固化物
PCT/JP2011/063312 WO2011155583A1 (ja) 2010-06-11 2011-06-10 硬化性樹脂組成物およびその硬化物
SG2012090551A SG186252A1 (en) 2010-06-11 2011-06-10 Curable resin composition and cured product thereof
KR1020127031434A KR101699773B1 (ko) 2010-06-11 2011-06-10 경화성 수지 조성물 및 그 경화물
TW100120617A TWI494376B (zh) 2010-06-11 2011-06-10 A hardened resin composition for light semiconductors and a hardened product thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010133745A JP5626856B2 (ja) 2010-06-11 2010-06-11 硬化性樹脂組成物およびその硬化物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014146822A Division JP5832601B2 (ja) 2014-07-17 2014-07-17 硬化性樹脂組成物およびその硬化物

Publications (2)

Publication Number Publication Date
JP2011256326A JP2011256326A (ja) 2011-12-22
JP5626856B2 true JP5626856B2 (ja) 2014-11-19

Family

ID=45098186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010133745A Expired - Fee Related JP5626856B2 (ja) 2010-06-11 2010-06-11 硬化性樹脂組成物およびその硬化物

Country Status (6)

Country Link
JP (1) JP5626856B2 (zh)
KR (1) KR101699773B1 (zh)
CN (1) CN102939313B (zh)
SG (1) SG186252A1 (zh)
TW (1) TWI494376B (zh)
WO (1) WO2011155583A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5472924B2 (ja) * 2010-10-21 2014-04-16 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
CN103781815A (zh) * 2011-09-09 2014-05-07 日本化药株式会社 光半导体元件密封用固化性树脂组合物及其固化物
JP6064606B2 (ja) 2012-01-31 2017-01-25 日亜化学工業株式会社 発光装置
DE102013201363A1 (de) 2012-01-31 2013-08-01 Nichia Corp. Lichtemittierendes Bauelement
EP2825589B1 (en) * 2012-03-16 2020-05-06 Basf Se Nor-hals compounds as flame retardants
JP6143359B2 (ja) * 2013-11-19 2017-06-07 日本化薬株式会社 シリコーン変性エポキシ樹脂およびその組成物
KR102616534B1 (ko) * 2015-06-17 2023-12-26 주식회사 다이셀 경화성 조성물, 접착 시트, 경화물, 적층물, 접착 시트의 제조 방법, 및 장치
JP2018188626A (ja) * 2017-05-11 2018-11-29 信越化学工業株式会社 シリコーン変性ポリイミド樹脂組成物
CN116162325A (zh) * 2017-12-27 2023-05-26 3M创新有限公司 适用于电子器件外罩的固化环氧树脂组合物、制品和方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09213997A (ja) 1996-01-30 1997-08-15 Matsushita Electron Corp 発光ダイオード
JP3618238B2 (ja) 1998-12-25 2005-02-09 日亜化学工業株式会社 発光ダイオード
CN1926107B (zh) * 2004-03-02 2012-01-04 株式会社艾迪科 具有碳酸酯骨架的弱碱性受阻胺类化合物、合成树脂组合物和涂料组合物
US20070225465A1 (en) * 2004-04-16 2007-09-27 Toshiyuki Akiike Composition for Sealing Optical Semiconductor, Optical Semiconductor Sealing Material, and Method for Producing Composition for Sealing Optical Semiconductor
WO2006083025A1 (ja) * 2005-02-04 2006-08-10 Jsr Corporation 光半導体、その封止材および封止用組成物
JP4935972B2 (ja) * 2005-12-21 2012-05-23 Ｊｓｒ株式会社 光半導体封止用組成物、その製造法および光半導体封止材
US20080154735A1 (en) * 2006-12-26 2008-06-26 Mark Carlson Mobile vending purchasing
TWI433875B (zh) 2008-01-28 2014-04-11 Shinetsu Chemical Co 二縮水甘油基異氰尿酸基改性有機聚矽氧烷以及含有該有機聚矽氧烷的組成物
KR101602750B1 (ko) * 2008-03-10 2016-03-11 가부시키가이샤 아데카 합성 수지 조성물 및 그것을 사용한 자동차 내외장재
WO2011020760A1 (en) * 2009-08-18 2011-02-24 Basf Se Photovoltaic module with stabilized polymeric encapsulant
CN102648244B (zh) * 2009-10-06 2014-05-07 日本化药株式会社 多元羧酸组合物及其制造方法以及含有该多元羧酸组合物的可固化树脂组合物
KR20120114237A (ko) * 2009-11-30 2012-10-16 닛뽄 가야쿠 가부시키가이샤 경화성 수지 조성물 및 그 경화물
CN102791760A (zh) * 2010-03-02 2012-11-21 日本化药株式会社 可固化树脂组合物及其固化物

Also Published As

Publication number Publication date
KR101699773B1 (ko) 2017-01-25
CN102939313B (zh) 2016-03-16
JP2011256326A (ja) 2011-12-22
TWI494376B (zh) 2015-08-01
TW201207043A (en) 2012-02-16
WO2011155583A1 (ja) 2011-12-15
CN102939313A (zh) 2013-02-20
KR20130112694A (ko) 2013-10-14
SG186252A1 (en) 2013-01-30

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