JP5606695B2 - 接続端子付き基板 - Google Patents

接続端子付き基板 Download PDF

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Publication number
JP5606695B2
JP5606695B2 JP2009158994A JP2009158994A JP5606695B2 JP 5606695 B2 JP5606695 B2 JP 5606695B2 JP 2009158994 A JP2009158994 A JP 2009158994A JP 2009158994 A JP2009158994 A JP 2009158994A JP 5606695 B2 JP5606695 B2 JP 5606695B2
Authority
JP
Japan
Prior art keywords
substrate
connection
connection terminal
board
end portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009158994A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011014451A (ja
JP2011014451A5 (https=
Inventor
義博 井原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009158994A priority Critical patent/JP5606695B2/ja
Priority to US12/824,456 priority patent/US8179692B2/en
Priority to TW099121640A priority patent/TW201112500A/zh
Priority to CN201010223392.XA priority patent/CN101944523B/zh
Publication of JP2011014451A publication Critical patent/JP2011014451A/ja
Publication of JP2011014451A5 publication Critical patent/JP2011014451A5/ja
Application granted granted Critical
Publication of JP5606695B2 publication Critical patent/JP5606695B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Connection Of Batteries Or Terminals (AREA)
JP2009158994A 2009-07-03 2009-07-03 接続端子付き基板 Expired - Fee Related JP5606695B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009158994A JP5606695B2 (ja) 2009-07-03 2009-07-03 接続端子付き基板
US12/824,456 US8179692B2 (en) 2009-07-03 2010-06-28 Board having connection terminal
TW099121640A TW201112500A (en) 2009-07-03 2010-07-01 Board having connection terminal
CN201010223392.XA CN101944523B (zh) 2009-07-03 2010-07-02 具有连接端子的基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009158994A JP5606695B2 (ja) 2009-07-03 2009-07-03 接続端子付き基板

Publications (3)

Publication Number Publication Date
JP2011014451A JP2011014451A (ja) 2011-01-20
JP2011014451A5 JP2011014451A5 (https=) 2012-08-16
JP5606695B2 true JP5606695B2 (ja) 2014-10-15

Family

ID=43412923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009158994A Expired - Fee Related JP5606695B2 (ja) 2009-07-03 2009-07-03 接続端子付き基板

Country Status (4)

Country Link
US (1) US8179692B2 (https=)
JP (1) JP5606695B2 (https=)
CN (1) CN101944523B (https=)
TW (1) TW201112500A (https=)

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JP5794833B2 (ja) * 2011-06-10 2015-10-14 新光電気工業株式会社 接続端子及びその製造方法、並びにソケット
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KR101947425B1 (ko) 2016-05-12 2019-02-13 주식회사 아모텍 기능성 컨택터
WO2017196116A1 (ko) * 2016-05-12 2017-11-16 주식회사 아모텍 기능성 컨택터
JP6358569B2 (ja) * 2016-06-22 2018-07-18 カシオ計算機株式会社 接続装置および時計
TWI669511B (zh) * 2018-09-19 2019-08-21 中華精測科技股份有限公司 探針卡測試裝置及測試裝置
CN110927416B (zh) * 2018-09-19 2022-01-28 台湾中华精测科技股份有限公司 探针卡测试装置及测试装置
CN111880067B (zh) * 2019-04-15 2023-05-05 台湾中华精测科技股份有限公司 晶片测试组件及其电性连接模块
CN113130432B (zh) * 2019-12-30 2022-12-27 华为机器有限公司 一种电子模块及电子设备
WO2021200642A1 (ja) * 2020-03-31 2021-10-07 積水ポリマテック株式会社 導電部材
KR102702979B1 (ko) * 2021-12-28 2024-09-04 주식회사 아이에스시 검사용 소켓
KR102823557B1 (ko) * 2023-07-31 2025-06-20 (주)마이크로컨텍솔루션 프로브 핀

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Also Published As

Publication number Publication date
JP2011014451A (ja) 2011-01-20
TW201112500A (en) 2011-04-01
CN101944523A (zh) 2011-01-12
US8179692B2 (en) 2012-05-15
CN101944523B (zh) 2015-02-04
US20110003492A1 (en) 2011-01-06

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