TW201112500A - Board having connection terminal - Google Patents

Board having connection terminal Download PDF

Info

Publication number
TW201112500A
TW201112500A TW099121640A TW99121640A TW201112500A TW 201112500 A TW201112500 A TW 201112500A TW 099121640 A TW099121640 A TW 099121640A TW 99121640 A TW99121640 A TW 99121640A TW 201112500 A TW201112500 A TW 201112500A
Authority
TW
Taiwan
Prior art keywords
substrate
connection terminal
connection
terminal
substrate body
Prior art date
Application number
TW099121640A
Other languages
English (en)
Chinese (zh)
Inventor
Yoshihiro Ihara
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW201112500A publication Critical patent/TW201112500A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Connection Of Batteries Or Terminals (AREA)
TW099121640A 2009-07-03 2010-07-01 Board having connection terminal TW201112500A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009158994A JP5606695B2 (ja) 2009-07-03 2009-07-03 接続端子付き基板

Publications (1)

Publication Number Publication Date
TW201112500A true TW201112500A (en) 2011-04-01

Family

ID=43412923

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099121640A TW201112500A (en) 2009-07-03 2010-07-01 Board having connection terminal

Country Status (4)

Country Link
US (1) US8179692B2 (https=)
JP (1) JP5606695B2 (https=)
CN (1) CN101944523B (https=)
TW (1) TW201112500A (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5500870B2 (ja) * 2009-05-28 2014-05-21 新光電気工業株式会社 接続端子付き基板及び電子部品のソケット等
JP5009972B2 (ja) * 2009-12-21 2012-08-29 日立オートモティブシステムズ株式会社 コネクタの製造方法
JP5394309B2 (ja) * 2010-04-19 2014-01-22 富士通コンポーネント株式会社 プローブ及びプローブの製造方法
US8294042B2 (en) * 2010-07-27 2012-10-23 Unimicron Technology Corp. Connector and manufacturing method thereof
JP5663379B2 (ja) * 2011-04-11 2015-02-04 新光電気工業株式会社 接続端子構造及びソケット並びに電子部品パッケージ
CN103477501A (zh) * 2011-04-20 2013-12-25 泰科电子日本合同会社 连接器以及连接器的制造方法
JP5794833B2 (ja) * 2011-06-10 2015-10-14 新光電気工業株式会社 接続端子及びその製造方法、並びにソケット
JP2013089313A (ja) * 2011-10-13 2013-05-13 Tyco Electronics Japan Kk コネクタ
US8641428B2 (en) * 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US9119320B2 (en) * 2012-04-13 2015-08-25 Quanta Computer Inc. System in package assembly
JP6046392B2 (ja) 2012-06-22 2016-12-14 新光電気工業株式会社 接続端子構造、インターポーザ、及びソケット
US8614514B1 (en) * 2013-03-13 2013-12-24 Palo Alto Research Center Incorporated Micro-spring chip attachment using ribbon bonds
CN104064895A (zh) * 2013-03-22 2014-09-24 富士康(昆山)电脑接插件有限公司 端子模组及其制造方法
US20140374912A1 (en) * 2013-06-24 2014-12-25 Palo Alto Research Center Incorporated Micro-Spring Chip Attachment Using Solder-Based Interconnect Structures
FR3009445B1 (fr) * 2013-07-31 2017-03-31 Hypertac Sa Organe de contact entre un support et un dispositif et connecteur electrique comprenant un tel organe de contact
JP6500258B2 (ja) * 2015-06-12 2019-04-17 北川工業株式会社 接触部材
US9692147B1 (en) * 2015-12-22 2017-06-27 Intel Corporation Small form factor sockets and connectors
KR101947425B1 (ko) 2016-05-12 2019-02-13 주식회사 아모텍 기능성 컨택터
WO2017196116A1 (ko) * 2016-05-12 2017-11-16 주식회사 아모텍 기능성 컨택터
JP6358569B2 (ja) * 2016-06-22 2018-07-18 カシオ計算機株式会社 接続装置および時計
TWI669511B (zh) * 2018-09-19 2019-08-21 中華精測科技股份有限公司 探針卡測試裝置及測試裝置
CN110927416B (zh) * 2018-09-19 2022-01-28 台湾中华精测科技股份有限公司 探针卡测试装置及测试装置
CN111880067B (zh) * 2019-04-15 2023-05-05 台湾中华精测科技股份有限公司 晶片测试组件及其电性连接模块
CN113130432B (zh) * 2019-12-30 2022-12-27 华为机器有限公司 一种电子模块及电子设备
WO2021200642A1 (ja) * 2020-03-31 2021-10-07 積水ポリマテック株式会社 導電部材
KR102702979B1 (ko) * 2021-12-28 2024-09-04 주식회사 아이에스시 검사용 소켓
KR102823557B1 (ko) * 2023-07-31 2025-06-20 (주)마이크로컨텍솔루션 프로브 핀

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3842189A (en) * 1973-01-08 1974-10-15 Rca Corp Contact array and method of making the same
US4553192A (en) * 1983-08-25 1985-11-12 International Business Machines Corporation High density planar interconnected integrated circuit package
US4677458A (en) * 1983-11-04 1987-06-30 Control Data Corporation Ceramic IC package attachment apparatus
JPH03100364U (https=) * 1990-01-30 1991-10-21
JPH076840A (ja) * 1993-06-18 1995-01-10 Fujitsu Ltd Ｉｃ試験用コンタクト
US6482013B2 (en) * 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US7073254B2 (en) * 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US6117694A (en) * 1994-07-07 2000-09-12 Tessera, Inc. Flexible lead structures and methods of making same
JPH08250243A (ja) * 1995-03-15 1996-09-27 Matsushita Electric Works Ltd プリント基板接続構造
US5612520A (en) * 1995-06-07 1997-03-18 Ast Research, Inc. Suspend switch for portable electronic equipment
US5763941A (en) * 1995-10-24 1998-06-09 Tessera, Inc. Connection component with releasable leads
US7714235B1 (en) * 1997-05-06 2010-05-11 Formfactor, Inc. Lithographically defined microelectronic contact structures
US6807734B2 (en) * 1998-02-13 2004-10-26 Formfactor, Inc. Microelectronic contact structures, and methods of making same
CA2266158C (en) 1999-03-18 2003-05-20 Ibm Canada Limited-Ibm Canada Limitee Connecting devices and method for interconnecting circuit components
US7126220B2 (en) * 2002-03-18 2006-10-24 Nanonexus, Inc. Miniaturized contact spring
US7435108B1 (en) * 1999-07-30 2008-10-14 Formfactor, Inc. Variable width resilient conductive contact structures
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6827584B2 (en) * 1999-12-28 2004-12-07 Formfactor, Inc. Interconnect for microelectronic structures with enhanced spring characteristics
US7458816B1 (en) * 2000-04-12 2008-12-02 Formfactor, Inc. Shaped spring
JP2002033171A (ja) * 2000-05-09 2002-01-31 Sony Corp 接続端子及びこれを有する電子部品コネクタ
JP2002164104A (ja) * 2000-11-22 2002-06-07 Ando Electric Co Ltd プローブカード
US6532654B2 (en) * 2001-01-12 2003-03-18 International Business Machines Corporation Method of forming an electrical connector
US6528350B2 (en) * 2001-05-21 2003-03-04 Xerox Corporation Method for fabricating a metal plated spring structure
US6777319B2 (en) * 2001-12-19 2004-08-17 Formfactor, Inc. Microelectronic spring contact repair
US6684499B2 (en) * 2002-01-07 2004-02-03 Xerox Corporation Method for fabricating a spring structure
US7047638B2 (en) * 2002-07-24 2006-05-23 Formfactor, Inc Method of making microelectronic spring contact array
JP2004259530A (ja) * 2003-02-25 2004-09-16 Shinko Electric Ind Co Ltd 外部接触端子を有する半導体装置及びその使用方法
KR100443999B1 (ko) * 2003-02-28 2004-08-21 주식회사 파이컴 인쇄회로기판용 상호 접속체, 이의 제조방법 및 이를구비한 상호 접속 조립체
US20070020960A1 (en) * 2003-04-11 2007-01-25 Williams John D Contact grid array system
US6965245B2 (en) * 2003-05-01 2005-11-15 K&S Interconnect, Inc. Prefabricated and attached interconnect structure
US7015584B2 (en) * 2003-07-08 2006-03-21 Xerox Corporation High force metal plated spring structure
JP4170278B2 (ja) * 2004-03-19 2008-10-22 タイコエレクトロニクスアンプ株式会社 コンタクト及び電気コネクタ
US7057295B2 (en) * 2004-04-22 2006-06-06 Ted Ju IC module assembly
US7541219B2 (en) * 2004-07-02 2009-06-02 Seagate Technology Llc Integrated metallic contact probe storage device
US20060030179A1 (en) * 2004-08-05 2006-02-09 Palo Alto Research Center, Incorporated Transmission-line spring structure
US7782072B2 (en) * 2006-09-27 2010-08-24 Formfactor, Inc. Single support structure probe group with staggered mounting pattern
US7674112B2 (en) * 2006-12-28 2010-03-09 Formfactor, Inc. Resilient contact element and methods of fabrication
US8179693B2 (en) * 2007-03-30 2012-05-15 International Business Machines Corporation Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements

Also Published As

Publication number Publication date
JP2011014451A (ja) 2011-01-20
CN101944523A (zh) 2011-01-12
US8179692B2 (en) 2012-05-15
CN101944523B (zh) 2015-02-04
JP5606695B2 (ja) 2014-10-15
US20110003492A1 (en) 2011-01-06

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