JP5596874B1 - 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 - Google Patents

感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 Download PDF

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Publication number
JP5596874B1
JP5596874B1 JP2014001838A JP2014001838A JP5596874B1 JP 5596874 B1 JP5596874 B1 JP 5596874B1 JP 2014001838 A JP2014001838 A JP 2014001838A JP 2014001838 A JP2014001838 A JP 2014001838A JP 5596874 B1 JP5596874 B1 JP 5596874B1
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carboxyl group
skeleton
type
resin composition
containing resin
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JP2014001838A
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Japanese (ja)
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JP2015064545A (ja
Inventor
英司 播磨
毅 三谷
忍 近藤
晋一朗 福田
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Taiyo Ink Manufacturing Co Ltd
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Taiyo Ink Manufacturing Co Ltd
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Priority to JP2014001838A priority Critical patent/JP5596874B1/ja
Priority to TW103127906A priority patent/TWI566049B/zh
Priority to KR20140112194A priority patent/KR101488138B1/ko
Priority to CN201410432215.0A priority patent/CN104423152B/zh
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Publication of JP5596874B1 publication Critical patent/JP5596874B1/ja
Publication of JP2015064545A publication Critical patent/JP2015064545A/ja
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0042Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2014001838A 2013-08-28 2014-01-08 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 Active JP5596874B1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014001838A JP5596874B1 (ja) 2013-08-28 2014-01-08 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
TW103127906A TWI566049B (zh) 2013-08-28 2014-08-14 A photosensitive resin composition, a dry film, a hardened product, and a printed wiring board
KR20140112194A KR101488138B1 (ko) 2013-08-28 2014-08-27 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
CN201410432215.0A CN104423152B (zh) 2013-08-28 2014-08-28 感光性树脂组合物、干膜、固化物以及印刷电路板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013176302 2013-08-28
JP2013176302 2013-08-28
JP2014001838A JP5596874B1 (ja) 2013-08-28 2014-01-08 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

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JP5596874B1 true JP5596874B1 (ja) 2014-09-24
JP2015064545A JP2015064545A (ja) 2015-04-09

Family

ID=51702133

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JP2014001838A Active JP5596874B1 (ja) 2013-08-28 2014-01-08 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Country Status (4)

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JP (1) JP5596874B1 (zh)
KR (1) KR101488138B1 (zh)
CN (1) CN104423152B (zh)
TW (1) TWI566049B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104570606A (zh) * 2014-12-24 2015-04-29 欧利生东邦涂料(东莞)有限公司 光固化热固化性组合物及其制备方法以及印刷线路板用油墨

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6096944B1 (ja) * 2016-01-22 2017-03-15 互応化学工業株式会社 ドライフィルム積層体
KR102397093B1 (ko) * 2016-03-31 2022-05-12 동우 화인켐 주식회사 착색 감광성 수지 조성물, 이를 포함하는 컬러필터 및 표시장치
JP6829863B2 (ja) * 2016-09-13 2021-02-17 互応化学工業株式会社 感光性樹脂組成物、及び被覆プリント配線板
JP2019178305A (ja) * 2018-03-30 2019-10-17 太陽インキ製造株式会社 硬化性樹脂組成物、該組成物からなるドライフィルム、硬化物および該硬化物を有するプリント配線板
JP7133594B2 (ja) * 2019-09-19 2022-09-08 株式会社タムラ製作所 感光性樹脂組成物
CN112526823A (zh) * 2019-09-19 2021-03-19 株式会社田村制作所 感光性树脂组合物
JP7450318B2 (ja) 2021-09-16 2024-03-15 株式会社タムラ製作所 はんだ組成物およびフレキシブル回路基板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4785882B2 (ja) * 2007-03-05 2011-10-05 株式会社日本触媒 画像形成用感光性樹脂組成物
JP5261242B2 (ja) * 2009-03-23 2013-08-14 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5661293B2 (ja) 2010-02-08 2015-01-28 太陽ホールディングス株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
JP5461259B2 (ja) 2010-03-18 2014-04-02 太陽ホールディングス株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
JP5814691B2 (ja) * 2011-08-11 2015-11-17 互応化学工業株式会社 レジスト用樹脂組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104570606A (zh) * 2014-12-24 2015-04-29 欧利生东邦涂料(东莞)有限公司 光固化热固化性组合物及其制备方法以及印刷线路板用油墨
CN104570606B (zh) * 2014-12-24 2019-05-31 欧利生东邦涂料(东莞)有限公司 光固化热固化性组合物及其制备方法以及印刷线路板用油墨

Also Published As

Publication number Publication date
KR101488138B1 (ko) 2015-01-29
CN104423152B (zh) 2016-07-06
JP2015064545A (ja) 2015-04-09
TW201512783A (zh) 2015-04-01
CN104423152A (zh) 2015-03-18
TWI566049B (zh) 2017-01-11

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