JP5584512B2 - パッケージされた集積回路装置及びその動作方法とこれを有するメモリ保存装置及び電子システム - Google Patents
パッケージされた集積回路装置及びその動作方法とこれを有するメモリ保存装置及び電子システム Download PDFInfo
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- JP5584512B2 JP5584512B2 JP2010093897A JP2010093897A JP5584512B2 JP 5584512 B2 JP5584512 B2 JP 5584512B2 JP 2010093897 A JP2010093897 A JP 2010093897A JP 2010093897 A JP2010093897 A JP 2010093897A JP 5584512 B2 JP5584512 B2 JP 5584512B2
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Description
一実施形態において、前記1次導電性ラインは、前記基板上の前記導電性パッドから、前記チップスタックの複数のチップのうちの前記一つの上に設けられた前記導電性パッドに信号を伝送するように構成され、前記2次導電性ラインは、前記複数のチップのうちの一つで信号を受信することに反応し、前記複数のチップのうちの前記一つから出てくる信号を、前記チップスタック内の前記複数のチップのうちの前記一つの上側にある複数のチップのうちの一つ、及び下側にある複数のチップのうちの一つに同時に伝送するように構成されうる。
一実施形態において、前記複数のチップのうちの前記一つで前記信号を受信した後、前記複数のチップのうちの前記一つの両側にそれぞれ類似して位置する複数のチップでの前記信号の受信における時間遅延が実質的に類似してなされるように、第1の2次導電性ラインが、前記複数のチップのうちの前記一つと、それより上側にある前記複数のチップとを直列に連結でき、第2の2次導電性ラインが、前記複数のチップのうちの前記一つと、それより下にある前記複数のチップと、を直列に連結できる。
一実施形態において、前記パッケージされた集積回路装置は、前記2次導電性ラインのうちの一本に連結された複数のチップのうちの最後のチップ上に設けられた各導電性パッドのうちの一つを、前記最後のチップの直接上に位置しない前記複数のチップのうちの他の一つの上に設けられた導電性パッドに連結する3次導電性ラインを更に含むことができる。前記3次導電性ラインは、前記複数のチップのうちの最後のチップから、前記複数のチップのうちの他の一つに信号を伝送するように構成されうる。4次導電性ラインは、前記複数のチップのうちの前記他の一つの上に設けられた前記導電性パッドを、前記複数のチップのうちの前記他の一つより上側にあるチップ上に設けられた導電性パッド、及び前記複数のチップのうちの前記他の一つより下側にあるチップ上に設けられた導電性パッドにそれぞれ連結する。前記4次導電性ラインは、前記複数のチップのうちの前記他の一つから、前記複数のチップのうちの前記他の一つより上側にあるチップ上に設けられた導電性パッド、及び前記複数のチップのうちの前記他の一つより下側にあるチップ上に設けられた導電性パッドにそれぞれ前記信号を同時に伝送するように構成されうる。
一実施形態において、前記1次導電性ライン及び前記2次導電性ラインを介して伝送される前記信号は、アドレス信号、データ信号、及び命令信号のうちの少なくともいずれか一つでありうる。
一実施形態において、前記複数のチップのうちの前記一つは、前記チップスタック内で、前記複数のチップの中央位置近くに位置されうる。
一実施形態において、前記複数のチップのうちの前記一つと、それより下側に位置するチップとが第1マルチチップ・パッケージの第1チップスタックを定義し、前記複数のチップのうちの前記一つより上側にある複数のチップが第2マルチチップ・パッケージの第2チップスタックを定義してパッケージ・オン・パッケージ(PoP:package−on−package)構造を提供できる。前記第2マルチチップ・パッケージは、前記第2チップスタックを上に有する第2基板を含むことができる。前記第2基板は、導電性パッドを自体の上に含んで前記第1チップスタックの複数のチップのうちの前記一つの上に設けられた導電性パッドに電気的に連結される外部端子を含むことができる。前記2次導電性ラインのうちの一本は、前記第2基板上の前記導電性パッドを、前記第2チップスタックの複数のチップに連結できる。
一実施形態において、前記1次導電性ラインは、第1の1次導電性ライン及び第2の1次導電性ラインを含むことができ、前記第1の1次導電性ラインは、前記基板上の前記導電性パッドを、前記チップスタックの複数のチップの動作を制御するように構成されたコントローラチップに連結でき、前記第2の1次導電性ラインは、前記コントローラチップを、前記チップスタックの複数のチップのうちの一つに連結できる。
一実施形態において、前記1次導電性ラインは、前記基板上の前記導電性パッドを、前記複数のチップのうちの前記一つの上に設けられた前記導電性パッドに直接連結するワイヤボンドでありうる。前記2次導電性ラインは、前記複数のチップのうちの前記一つの上に設けられた前記導電性パッドを、前記複数のチップのうちの前記一つより上側にある複数のチップのうちの一つと連結する第1ワイヤボンド、及び前記複数のチップのうちの前記一つの上に設けられた前記導電性パッドを、前記複数のチップのうちの前記一つより下側にある複数のチップのうちの一つと連結する第2ワイヤボンドを含むことができる。
一実施形態において、前記1次導電性ラインは、前記基板上の前記導電性パッドと、前記複数のチップのうちの前記一つとを直接連結するスルーモールド・ビア(TMV:through molded via)、及びワイヤボンドのうちの少なくともいずれか一つでありうる。前記2次導電性ラインは、それぞれ前記複数のチップのうちの前記1つの上側にある複数のチップのうちの一つと、下側にある複数のチップのうちの一つとを貫通して延びる導電性ビアでありうる。
一実施形態において、前記チップスタックの複数のチップは、フラッシュメモリ、DRAM(dynamic random access memory)、SRAM(static random access memory)、RRAM(resistive random access memory)、及びMRAM(magnetic random access memory)のチップのうちの一つでありうる。
一実施形態において、前記チップスタックの前記複数のチップは、8個以上のメモリチップを含むことができる。
一実施形態において、前記信号は、前記複数のチップのうちの前記一つの上側にある複数のチップに、前記複数のチップのうちの前記一つと、その上側にある複数のチップとを連結する第1の2次導電性ラインを介して直列に伝送され、また前記複数のチップのうちの前記一つの下側にある複数のチップに、前記複数のチップのうちの前記一つと、その下側にある複数のチップとを連結する第2の2次導電性ラインを介して直列に伝送されうる。前記複数のチップのうちの前記一つで前記信号を受信した後、前記複数のチップのうちの前記1つの両側にそれぞれ類似して位置する複数のチップにおいて、前記信号を受信する際の時間遅延は、実質的に類似している。
一実施形態において、前記信号は、前記2次導電性ラインのうちの一本に連結された複数のチップのうちの最後のチップ上に設けられた各導電性パッドのうちの一つから、前記複数のチップのうちの前記最後のチップの直接上に位置しない他の一つの上に設けられた導電性パッドに3次導電性ラインを介して伝送され、また同時に、前記複数のチップのうちの前記他の一つの上に設けられた前記導電性パッドから、前記チップスタック内の前記複数のチップの前記他の一つの上側にある複数のチップ上に設けられた導電性パッドと、下側にある複数のチップ上に設けられた導電性パッドと、にそれぞれ4次導電性ラインを介して伝送されうる。
一実施形態において、前記1次導電性ラインは、前記基板上の前記導電性パッドを、前記チップスタック内の前記複数のチップの動作を制御するように構成されたコントローラチップに連結する第1の1次導電性ライン、及び前記コントローラチップを、前記チップスタック内の前記複数のチップのうちの前記一つに連結する第2の1次導電性ラインを含むことができる。前記信号は、前記基板から出てくる制御信号を、前記第1の1次導電性ラインを介して前記コントローラチップに伝送する段階、及びその後、前記コントローラチップから出てくる前記信号を、前記2次導電性ラインを介して前記チップスタック内の前記複数のチップのうちの前記一つに伝送する段階によって、前記基板上の前記導電性パッドから前記チップスタックの複数のチップのうちの前記一つに伝送されうる。
120、120’、130 ボンディング・フィンガ(導電性パッド)
122、122’、122a 2次導電性ライン
122b 4次導電性ライン122b
125、125a、125c、125d、125e、125f 1次導電性ライン
125b 3次導電性ライン
135 チップ選択ライン
140、140’ パンプパッド
145、145’ モールディング・コンパウンド
150、150a、150b 外部端子
200、500、800、1000 パッケージされた集積回路装置
200a 第1半導体パッケージ
200b 第2半導体パッケージ
205、205’、405 接着層
210、210’、410 チップスタック
210a〜210h、210a’〜210h’、410a〜410f (半導体)チップ
220、230、420 導電性パッド
255 再配線層
350 コントローラチップ
460 (2次)導電性ビア
600 メモリ保存装置
610 コントローラ
620、720 メモリユニット
630 印刷回路基板
700 電子システム
710 プロセッサ
730 入力/出力ユニット
740 バス
900 パッケージ・オン・パーケージ集積回路
Claims (20)
- 導電性パッドを上に含む基板と、
前記基板上に複数のチップを含むチップスタックと、
前記基板上の前記導電性パッドと、前記チップスタックの複数のチップのうちの一つの上に設けられた導電性パッドとを電気的に連結する1次導電性ラインと、
前記チップスタック内の前記複数のチップのうちの一つの上に設けられた前記導電性パッドを、その上側にある複数のチップのうちの一つ、及び下側にある複数のチップのうちの一つの上に設けられた対応する導電性パッドに電気的に連結する2次導電性ラインと、を備え、
前記1次導電性ラインは、前記基板上の前記導電性パッドから、前記チップスタックの複数のチップのうちの一つの上に設けられた前記導電性パッドに信号を伝送するように構成され、
前記2次導電性ラインは、前記複数のチップのうちの一つで信号を受信することに反応し、前記複数のチップのうちの前記一つから出てくる信号を、前記チップスタック内の前記複数のチップのうちの前記一つの上側にある複数のチップのうちの一つ、及び下側にある複数のチップのうちの一つに同時に伝送するように構成されることを特徴とするパッケージされた集積回路装置。 - 前記複数のチップのうちの前記一つで前記信号を受信した後、前記複数のチップのうちの前記一つの両側にそれぞれ類似して位置する複数のチップでの前記信号の受信における時間遅延が実質的に類似してなされるように、第1の2次導電性ラインが、前記複数のチップのうちの前記一つと、それより上側にある前記複数のチップとを直列に連結し、第2の2次導電性ラインが、前記複数のチップのうちの前記一つと、それより下側にある前記複数のチップと、を直列に連結することを特徴とする請求項1に記載のパッケージされた集積回路装置。
- 前記2次導電性ラインのうちの一本に連結された複数のチップのうちの最後のチップ上に設けられた各導電性パッドのうちの一つを、前記最後のチップの直接上に位置しない前記複数のチップのうちの他の一つの上に設けられた導電性パッドに連結して信号を伝送するように構成された3次導電性ラインと、
前記複数のチップのうちの前記他の一つの上に設けられた前記導電性パッドを、前記複数のチップのうちの前記他の一つより上側にあるチップ上に設けられた導電性パッド、及び前記複数のチップのうちの前記他の一つより下側にあるチップ上に設けられた導電性パッドにそれぞれ連結し、信号を同時に伝送するように構成された4次導電性ラインと、を更に含むことを特徴とする請求項1に記載のパッケージされた集積回路装置。 - 前記1次導電性ライン及び前記2次導電性ラインを介して伝送される前記信号は、アドレス信号、データ信号、及び命令信号のうちの少なくともいずれか一つを含むことを特徴とする請求項1に記載のパッケージされた集積回路装置。
- 前記2次導電性ラインのそれぞれが類似した電気的長さを含むように、前記複数のチップのうちの前記一つは、前記チップスタック内で前記複数のチップの中央位置近くに位置することを特徴とする請求項1に記載のパッケージされた集積回路装置。
- パッケージ・オン・パッケージ(PoP)構造を提供するために、前記複数のチップのうちの前記一つと、それより下側に位置するチップとが第1マルチチップ・パッケージの第1チップスタックを定義し、前記複数のチップのうちの前記一つより上側にある複数のチップが第2マルチチップ・パッケージの第2チップスタックを定義し、
前記第2マルチチップ・パッケージは、前記第2チップスタックを上に有する第2基板を含み、前記第2基板は、導電性パッドを自体の上に含んで前記第1チップスタックの複数のチップのうちの一つの上に設けられた導電性パッドに電気的に連結される外部端子を含み、
前記2次導電性ラインのうちの一本は、前記第2基板上の前記導電性パッドを、前記第2チップスタックの複数のチップに連結することを特徴とする請求項1に記載のパッケージされた集積回路装置。 - 前記1次導電性ラインは、第1の1次導電性ライン及び第2の1次導電性ラインを含み、前記第1の1次導電性ラインは、前記基板上の前記導電性パッドを、前記チップスタックの複数のチップの動作を制御するように構成されたコントローラチップに連結し、前記第2の1次導電性ラインは、前記コントローラチップを、前記チップスタックの複数のチップのうちの一つに連結することを特徴とする請求項1に記載のパッケージされた集積回路装置。
- 前記1次導電性ラインは、前記基板上の前記導電性パッドと、前記複数のチップのうちの前記一つとを直接連結するスルーモールド・ビア(TMV)、及びワイヤボンドのうちの少なくともいずれか一つを含み、前記2次導電性ラインは、前記複数のチップのうちの前記一つの上側にある複数のチップのうちの一つと、下側にある複数のチップのうちの一つとを貫通して延びる導電性ビアをそれぞれ含むことを特徴とする請求項1に記載のパッケージされた集積回路装置。
- 前記チップスタックの複数のチップは、フラッシュメモリ、DRAM、SRAM、RRAM、及びMRAMのチップのうちのいずれか一つを含むことを特徴とする請求項1に記載のパッケージされた集積回路装置。
- 前記チップスタックの前記複数のチップは8個以上のメモリチップを含むことを特徴とする請求項9に記載のパッケージされた集積回路装置。
- コントローラと、
メモリユニットと、
前記コントローラ及び前記メモリユニットを自体の上に含んでそれらの間の通信を提供するように構成された印刷回路基板と、を備え、
前記メモリユニットは、請求項1乃至10のいずれか1項に記載の少なくとも1つのパッケージされた集積回路装置を有することを特徴とするメモリ保存装置。 - プロセッサと、
メモリユニットと、
入力/出力ユニットと、
前記プロセッサ、前記メモリユニット、及び前記入力/出力ユニットを通信させるように結合するバスと、を備え、
前記プロセッサ及び前記メモリユニットのうちの少なくともいずれか一つは、請求項1乃至10のいずれか1項に記載のパッケージされた集積回路装置を有することを特徴とする電子システム。 - 基板と、該基板上に複数のチップを含むチップスタックとを備える集積回路装置の動作方法であって、
信号を、前記基板上の導電性パッドから、前記チップスタックの複数のチップのうちの一つに、前記基板上の前記導電性パッドと、前記複数のチップのうちの前記一つの上に設けられた導電性パッドとを連結する1次導電性ラインを介して伝送する段階と、
その後、前記信号を、前記複数のチップのうちの前記一つから、前記チップスタックの前記複数のチップの前記一つより上側にある複数のチップ、及び下側にある複数のチップに、2次導電性ラインを介して同時に伝送する段階と、を有し、
前記2次導電性ラインは、前記複数のチップのうちの前記一つの上に設けられた導電性パッドと、前記チップスタックの前記複数のチップのうちの前記一つの上側にある複数のチップ上に設けられた導電性パッドと、下側にある複数のチップ上に設けられた導電性パッドとをそれぞれ連結することを特徴とする集積回路装置の動作方法。 - 前記2次導電性ラインを介して前記信号を同時に伝送する段階は、
前記信号を、前記複数のチップのうちの前記一つの上側にある複数のチップに、前記複数のチップのうちの前記一つと、その上側にある複数のチップとを連結する第1の2次導電性ラインを介して直列に伝送する段階と、
前記信号を、前記複数のチップのうちの前記一つの下側にある複数のチップに、前記複数のチップのうちの前記一つと、その下側にある複数のチップとを連結する第2の2次導電性ラインを介して直列に伝送する段階と、を含み、
前記複数のチップのうちの前記一つで前記信号を受信した後、前記複数のチップのうちの前記一つの両側にそれぞれ類似して位置する複数のチップにおいて、前記信号を受信する際の時間遅延は実質的に類似していることを特徴とする請求項13に記載の集積回路装置の動作方法。 - 前記信号を、前記2次導電性ラインのうちの一本に連結された複数のチップのうちの最後のチップ上に設けられた各導電性パッドのうちの一つから、前記複数のチップのうちの前記最後のチップの直接上に位置しない他の一つの上に設けられた導電性パッドに3次導電性ラインを介して伝送する段階と、
前記信号を、前記複数のチップのうちの前記他の一つの上に設けられた前記導電性パッドから、前記チップスタック内の前記複数のチップの前記他の一つの上側にある複数のチップ上に設けられた導電性パッドと、下側にある複数のチップ上に設けられた導電性パッドとにそれぞれ4次導電性ラインを介して同時に伝送する段階と、を更に含むことを特徴とする請求項13に記載の集積回路装置の動作方法。 - 前記信号は、アドレス信号、データ信号、及び命令信号のうちの少なくともいずれか一つを含むことを特徴とする請求項13に記載の集積回路装置の動作方法。
- 前記2次導電性ラインのそれぞれが類似した電気的長さを含むように、前記複数のチップのうちの前記一つが、前記チップスタック内で前記複数のチップの中央位置近くに位置することを特徴とする請求項13に記載の集積回路装置の動作方法。
- 前記複数のチップのうちの前記一つと、その下側にある前記チップとが第1マルチチップ・パッケージの第1チップスタックを定義し、前記複数のチップのうちの前記一つより上側にある前記複数のチップが第2マルチチップ・パッケージの第2チップスタックを定義してパッケージ・オン・パッケージ(PoP)構造を提供し、
前記第2マルチチップ・パッケージは、前記第2チップスタックを上に有する第2基板を含み、前記第2基板は、該第2基板上の導電性パッドと、前記第1チップスタックの複数のチップのうちの最後のチップ上に設けられた導電性パッドとを電気的に連結する外部端子を含み、前記2次導電性ラインのうちの一本は、前記第2基板上の前記導電性パッドと、前記第2チップスタックの複数のチップとを連結することを特徴とする請求項13に記載の集積回路装置の動作方法。 - 前記1次導電性ラインは、前記基板上の前記導電性パッドを、前記チップスタック内の前記複数のチップの動作を制御するように構成されたコントローラチップに連結する第1の1次導電性ライン、及び前記コントローラチップを、前記チップスタック内の前記複数のチップのうちの前記一つに連結する第2の1次導電性ラインを含み、
前記信号を、前記基板上の前記導電性パッドから前記チップスタックの複数のチップのうちの前記一つに伝送する段階は、
前記基板から出てくる制御信号を、前記第1の1次導電性ラインを介して前記コントローラチップに伝送する段階と、
その後、前記コントローラチップから出てくる前記信号を、前記2次導電性ラインを介して前記チップスタック内の前記複数のチップのうちの前記一つに伝送する段階と、を含むことを特徴とする請求項13に記載の集積回路装置の動作方法。 - 前記1次導電性ラインは、前記基板上の前記導電性パッドと、前記複数のチップのうちの前記一つとを直接連結するスルーモールド・ビア(TMV)、及びワイヤボンドのうちの少なくともいずれか一つを含み、前記2次導電性ラインは、前記複数のチップのうちの前記一つの上側にある複数のチップのうちの一つと、下側にある複数のチップのうちの一つとを貫通して延びる導電性ビアをそれぞれ含むことを特徴とする請求項13に記載の集積回路装置の動作方法。
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KR20100114421A (ko) * | 2009-04-15 | 2010-10-25 | 삼성전자주식회사 | 적층 패키지 |
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2009
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- 2010-02-23 US US12/710,405 patent/US8331121B2/en active Active
- 2010-04-14 TW TW099111606A patent/TWI527191B/zh active
- 2010-04-15 JP JP2010093897A patent/JP5584512B2/ja active Active
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US20100265751A1 (en) | 2010-10-21 |
JP2010251762A (ja) | 2010-11-04 |
US8611125B2 (en) | 2013-12-17 |
TW201044556A (en) | 2010-12-16 |
US20130062784A1 (en) | 2013-03-14 |
US8331121B2 (en) | 2012-12-11 |
TWI527191B (zh) | 2016-03-21 |
KR20100114421A (ko) | 2010-10-25 |
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