JP5550380B2 - 固体撮像装置及び撮像装置 - Google Patents

固体撮像装置及び撮像装置 Download PDF

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Publication number
JP5550380B2
JP5550380B2 JP2010040600A JP2010040600A JP5550380B2 JP 5550380 B2 JP5550380 B2 JP 5550380B2 JP 2010040600 A JP2010040600 A JP 2010040600A JP 2010040600 A JP2010040600 A JP 2010040600A JP 5550380 B2 JP5550380 B2 JP 5550380B2
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Japan
Prior art keywords
solid
state imaging
imaging device
protrusion
package
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JP2010040600A
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English (en)
Japanese (ja)
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JP2011176224A (ja
JP2011176224A5 (enExample
Inventor
克寿 望月
隆典 鈴木
富士雄 伊藤
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2010040600A priority Critical patent/JP5550380B2/ja
Priority to US13/033,376 priority patent/US8792031B2/en
Priority to CN201110045964.4A priority patent/CN102194840B/zh
Publication of JP2011176224A publication Critical patent/JP2011176224A/ja
Publication of JP2011176224A5 publication Critical patent/JP2011176224A5/ja
Application granted granted Critical
Publication of JP5550380B2 publication Critical patent/JP5550380B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2010040600A 2010-02-25 2010-02-25 固体撮像装置及び撮像装置 Active JP5550380B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010040600A JP5550380B2 (ja) 2010-02-25 2010-02-25 固体撮像装置及び撮像装置
US13/033,376 US8792031B2 (en) 2010-02-25 2011-02-23 Solid-state image pickup device and camera
CN201110045964.4A CN102194840B (zh) 2010-02-25 2011-02-25 固态图像拾取装置和图像拾取装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010040600A JP5550380B2 (ja) 2010-02-25 2010-02-25 固体撮像装置及び撮像装置

Publications (3)

Publication Number Publication Date
JP2011176224A JP2011176224A (ja) 2011-09-08
JP2011176224A5 JP2011176224A5 (enExample) 2013-04-11
JP5550380B2 true JP5550380B2 (ja) 2014-07-16

Family

ID=44476207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010040600A Active JP5550380B2 (ja) 2010-02-25 2010-02-25 固体撮像装置及び撮像装置

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US (1) US8792031B2 (enExample)
JP (1) JP5550380B2 (enExample)
CN (1) CN102194840B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013222772A (ja) * 2012-04-13 2013-10-28 Sony Corp 撮像素子パッケージおよび撮像装置
JP5885690B2 (ja) * 2012-04-27 2016-03-15 キヤノン株式会社 電子部品および電子機器
JP2014138119A (ja) * 2013-01-17 2014-07-28 Sony Corp 半導体装置および半導体装置の製造方法
JP5904957B2 (ja) * 2013-02-28 2016-04-20 キヤノン株式会社 電子部品および電子機器。
JP6214337B2 (ja) 2013-10-25 2017-10-18 キヤノン株式会社 電子部品、電子機器および電子部品の製造方法。
JP6703029B2 (ja) * 2018-03-26 2020-06-03 キヤノン株式会社 電子モジュールおよび撮像システム
JP6440917B1 (ja) * 2018-04-12 2018-12-19 三菱電機株式会社 半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58140156A (ja) * 1982-02-16 1983-08-19 Canon Inc 固体撮像装置
JPS60250667A (ja) * 1984-05-25 1985-12-11 Toshiba Corp 固体撮像装置
JP4185236B2 (ja) 2000-06-19 2008-11-26 イーストマン コダック カンパニー 固体撮像素子および撮像装置
TWM264648U (en) * 2004-10-21 2005-05-11 Chipmos Technologies Inc Image sensor package
JP2006134998A (ja) 2004-11-04 2006-05-25 Japan Aviation Electronics Industry Ltd 半導体封止パッケージ
CN1873992A (zh) * 2005-06-03 2006-12-06 鸿富锦精密工业（深圳）有限公司 影像感测器封装和封装制程
JP4839150B2 (ja) * 2005-08-08 2011-12-21 住友化学株式会社 固体撮像素子収納用ケース、その製造方法、及び、固体撮像装置
JP4881597B2 (ja) * 2005-09-22 2012-02-22 富士フイルム株式会社 固体撮像装置の切断方法
JP2008047878A (ja) * 2006-07-21 2008-02-28 Sumitomo Chemical Co Ltd 固体撮像素子収容用ケース、その製造方法及び固体撮像装置
CN100544009C (zh) 2006-12-06 2009-09-23 台湾沛晶股份有限公司 定位精确的影像芯片封装结构

Also Published As

Publication number Publication date
US20110205414A1 (en) 2011-08-25
CN102194840B (zh) 2014-01-01
US8792031B2 (en) 2014-07-29
JP2011176224A (ja) 2011-09-08
CN102194840A (zh) 2011-09-21

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