CN102194840B - 固态图像拾取装置和图像拾取装置 - Google Patents

固态图像拾取装置和图像拾取装置 Download PDF

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Publication number
CN102194840B
CN102194840B CN201110045964.4A CN201110045964A CN102194840B CN 102194840 B CN102194840 B CN 102194840B CN 201110045964 A CN201110045964 A CN 201110045964A CN 102194840 B CN102194840 B CN 102194840B
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China
Prior art keywords
image pickup
pickup device
protruding portion
solid
state image
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CN201110045964.4A
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Chinese (zh)
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CN102194840A (zh
Inventor
望月克寿
铃木隆典
伊藤富士雄
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Canon Inc
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Canon Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN201110045964.4A 2010-02-25 2011-02-25 固态图像拾取装置和图像拾取装置 Active CN102194840B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010040600A JP5550380B2 (ja) 2010-02-25 2010-02-25 固体撮像装置及び撮像装置
JP2010-040600 2010-02-25

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CN102194840A CN102194840A (zh) 2011-09-21
CN102194840B true CN102194840B (zh) 2014-01-01

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US (1) US8792031B2 (enExample)
JP (1) JP5550380B2 (enExample)
CN (1) CN102194840B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI670804B (zh) 2018-04-12 2019-09-01 日商三菱電機股份有限公司 半導體裝置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013222772A (ja) * 2012-04-13 2013-10-28 Sony Corp 撮像素子パッケージおよび撮像装置
JP5885690B2 (ja) * 2012-04-27 2016-03-15 キヤノン株式会社 電子部品および電子機器
JP2014138119A (ja) * 2013-01-17 2014-07-28 Sony Corp 半導体装置および半導体装置の製造方法
JP5904957B2 (ja) * 2013-02-28 2016-04-20 キヤノン株式会社 電子部品および電子機器。
JP6214337B2 (ja) 2013-10-25 2017-10-18 キヤノン株式会社 電子部品、電子機器および電子部品の製造方法。
JP6703029B2 (ja) * 2018-03-26 2020-06-03 キヤノン株式会社 電子モジュールおよび撮像システム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4594613A (en) * 1982-02-16 1986-06-10 Canon Kabushiki Kaisha Solid-state imaging device assembly
CN101197383A (zh) * 2006-12-06 2008-06-11 台湾沛晶股份有限公司 定位精确的影像芯片封装结构

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60250667A (ja) * 1984-05-25 1985-12-11 Toshiba Corp 固体撮像装置
JP4185236B2 (ja) 2000-06-19 2008-11-26 イーストマン コダック カンパニー 固体撮像素子および撮像装置
TWM264648U (en) * 2004-10-21 2005-05-11 Chipmos Technologies Inc Image sensor package
JP2006134998A (ja) 2004-11-04 2006-05-25 Japan Aviation Electronics Industry Ltd 半導体封止パッケージ
CN1873992A (zh) * 2005-06-03 2006-12-06 鸿富锦精密工业（深圳）有限公司 影像感测器封装和封装制程
JP4839150B2 (ja) * 2005-08-08 2011-12-21 住友化学株式会社 固体撮像素子収納用ケース、その製造方法、及び、固体撮像装置
JP4881597B2 (ja) * 2005-09-22 2012-02-22 富士フイルム株式会社 固体撮像装置の切断方法
JP2008047878A (ja) * 2006-07-21 2008-02-28 Sumitomo Chemical Co Ltd 固体撮像素子収容用ケース、その製造方法及び固体撮像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4594613A (en) * 1982-02-16 1986-06-10 Canon Kabushiki Kaisha Solid-state imaging device assembly
CN101197383A (zh) * 2006-12-06 2008-06-11 台湾沛晶股份有限公司 定位精确的影像芯片封装结构

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP昭60-250667A 1985.12.11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI670804B (zh) 2018-04-12 2019-09-01 日商三菱電機股份有限公司 半導體裝置

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US20110205414A1 (en) 2011-08-25
JP5550380B2 (ja) 2014-07-16
US8792031B2 (en) 2014-07-29
JP2011176224A (ja) 2011-09-08
CN102194840A (zh) 2011-09-21

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