WO2021143447A1 - 支架、感光组件、摄像模组和支架制备方法 - Google Patents

支架、感光组件、摄像模组和支架制备方法 Download PDF

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Publication number
WO2021143447A1
WO2021143447A1 PCT/CN2020/137182 CN2020137182W WO2021143447A1 WO 2021143447 A1 WO2021143447 A1 WO 2021143447A1 CN 2020137182 W CN2020137182 W CN 2020137182W WO 2021143447 A1 WO2021143447 A1 WO 2021143447A1
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WO
WIPO (PCT)
Prior art keywords
photosensitive
filter element
bracket
suspension
circuit board
Prior art date
Application number
PCT/CN2020/137182
Other languages
English (en)
French (fr)
Inventor
赵波杰
俞丝丝
陈烈烽
何林锋
梅哲文
干狄威
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202010061827.9A external-priority patent/CN113141445A/zh
Priority claimed from CN202010059538.5A external-priority patent/CN113141443A/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to CN202080093161.3A priority Critical patent/CN115336244A/zh
Publication of WO2021143447A1 publication Critical patent/WO2021143447A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • This application relates to the field of camera modules, in particular to a bracket, a photosensitive component, a camera module, and a method for preparing the bracket.
  • the filter element is a sensitive and fragile element, and as the size increases, its sensitivity and fragility will further increase. In actual industrial applications, there has been a phenomenon of filter element cracking. The damage of the filter element will affect the imaging performance of the camera module and is difficult to repair once it is damaged.
  • the main purpose of the present application is to provide a camera module and its photosensitive component.
  • the bracket for supporting the filter element in the camera module is partially thinned to reduce the stress acting on the filter element and prevent it. Damaged due to improper stress.
  • Another object of the present application is to provide a camera module and its photosensitive component.
  • the bracket for supporting the filter element is partially thinned to enhance the flexibility of the bracket so that the bracket itself can absorb Relatively more stress, so as to relatively reduce the stress acting on the filter element.
  • Another object of the present application is to provide a camera module and its photosensitive component.
  • the thinned part of the bracket is arranged on the suspension part, so that the flexibility of the suspension part is enhanced, that is to say, When the stress is transmitted through the suspension part and acts on the filter element, the suspension part can absorb relatively more stress, thereby relatively reducing the stress acting on the filter element to prevent The filter element is damaged.
  • Another object of the present application is to provide a camera module and its photosensitive component.
  • Another object of the present application is to provide a camera module and its photosensitive component.
  • the thinned part of the bracket includes the corner area of the suspension, and the position is set to reduce (or even eliminate) the The bracket body transmits the stress of the corner of the filter element.
  • Another object of the present application is to provide a camera module and its photosensitive component.
  • the bracket itself has an asymmetric structure. By making parts of the bracket thinner, the asymmetry of the bracket due to its own structure can be reduced. The asymmetrical stress acting on the filter element prevents damage to the filter element.
  • the main purpose of this application is to provide a bracket, a photosensitive component, a camera module, and a method for preparing the bracket.
  • the bracket for supporting the filter element in the camera module is integrated with the metal insert through the packaging material, so that the The bracket can achieve better comprehensive performance in terms of overall support strength, installation flatness and stress reduction.
  • the bracket includes a metal insert and a packaging part covering at least a part of the metal insert.
  • the part of the inlay exposed to the outside extends inwardly and laterally from the encapsulation part to form a suspension part, and the suspension part is configured to support the filter element thereon. That is, in the embodiment of the present application, the filter element is mounted on the metal insert.
  • Another object of the present application is to provide a bracket, a photosensitive component, a camera module, and a method for preparing the bracket.
  • the suspension formed by the metal insert has a relatively higher flatness to improve the filter.
  • the installation flatness of the optical element is provided.
  • Another object of the present application is to provide a bracket, a photosensitive component, a camera module, and a method for preparing the bracket. Since the thermal expansion coefficient of the metal insert is smaller than the thermal expansion coefficient of the packaging material, when the same temperature change occurs, the The suspension formed by the metal insert has a relatively smaller amount of deformation, so as to reduce the stress applied to the filter element by the bracket, so as to prevent the filter element from being damaged.
  • Another object of the present application is to provide a bracket, a photosensitive component, a camera module, and a method for preparing the bracket.
  • the suspension formed by the metal insert has higher structural strength, so that external stress can pass through the When the suspension part acts on the filter element, the suspension part is almost not deformed, so as to reduce the stress transmitted and applied to the filter element.
  • Another object of the present application is to provide a bracket, a photosensitive component, a camera module, and a method for preparing a bracket.
  • the bracket has the embedded metal inserts so that the overall structural strength can be enhanced, so that the The size (especially the thickness size) can be reduced. In other words, the bracket can be more miniaturized.
  • Another object of the present application is to provide a bracket, a photosensitive component, a camera module, and a method for preparing the bracket.
  • the metal insert includes a reinforcing member extending inside the package, so as to reinforce the The overall structural strength of the bracket, wherein, in some embodiments, the bracket body is used to mount a motor or an optical lens.
  • the application provides a photosensitive component, which includes:
  • the photosensitive chip is electrically connected to the circuit board
  • the filter element is held on the photosensitive path of the photosensitive chip.
  • a bracket for mounting the filter element so that the filter element is held on the photosensitive path of the photosensitive chip includes a bracket body and a suspension part extending inward from the bracket body, so The suspension portion mounts the filter element, wherein at least one groove is recessedly formed in the suspension portion, so as to reduce the stress acting on the filter element through the at least one groove.
  • the groove is recessedly formed on the upper surface of the suspension portion, and the filter element is installed in the groove.
  • the groove is recessedly formed on the lower surface of the suspension portion, and the position where the filter element is mounted on the upper surface of the suspension portion corresponds to the groove.
  • the groove is recessedly formed in a corner area of the suspension portion.
  • the groove extends to an outer edge of the suspension portion to form an edge groove.
  • the groove extends between the inner edge and the outer edge of the suspension portion to form a receiving groove.
  • the groove is further recessedly formed on the side of the suspension portion.
  • the grooves are symmetrically arranged with respect to the filter element.
  • the photosensitive component further includes an adhesive applied in the receiving groove, wherein the adhesive has flexibility to be configured to absorb stress acting on the filter element .
  • the photosensitive element further includes an adhesive applied in the edge groove, wherein the adhesive has flexibility to be configured to absorb stress acting on the filter element .
  • the thickness of the corresponding portion of the suspension portion having the groove is 0.05 mm-0.1 mm, and the suspension portion is in a portion other than the corresponding portion of the groove.
  • the thickness is 0.18mm-0.2mm.
  • the bracket is provided on the circuit board.
  • the photosensitive assembly further includes a base provided on the circuit board, wherein the bracket is mounted on the base.
  • a camera module which includes:
  • An optical lens held in the photosensitive path of the photosensitive component is an optical lens held in the photosensitive path of the photosensitive component.
  • the camera module further includes a driving element disposed between the photosensitive component and the optical lens.
  • a photosensitive assembly which includes:
  • the photosensitive chip is electrically connected to the circuit board
  • the filter element is held on the photosensitive path of the photosensitive chip.
  • a bracket for mounting the filter element so that the filter element is held on the photosensitive path of the photosensitive chip includes a metal insert and at least a part of the metal insert
  • the encapsulation part, the part of the metal inlay exposed to the outside extends inwardly and laterally from the encapsulation part to form a suspension part, wherein the filter element is mounted on the suspension part.
  • the metal insert includes an inlay frame body, a part of the inlay frame body is exposed to the outside to form the suspension part, and another part of the inlay frame body is covered by Wrapped and extended in the encapsulation part.
  • the metal insert further includes a reinforcing bar extending laterally outward from the inlay frame, and the reinforcing bar is covered and extends in the packaging portion.
  • the upper surface of the encapsulation part is higher than the upper surface of the suspension part.
  • the distance between the upper surface of the packaging portion and the upper surface of the suspension portion is greater than or equal to the thickness dimension of the filter element.
  • the packaging part has a groove recessedly formed on its upper surface and communicating with the suspension part.
  • the thickness dimension of the suspension part in the metal insert is 0.08-0.15 mm.
  • the range of the difference between the coefficient of thermal expansion of the suspension in the metal insert and the coefficient of thermal expansion of the filter element is less than or equal to 15 ppm.
  • the bracket is provided on the circuit board.
  • the photosensitive assembly further includes a base provided on the circuit board, wherein the bracket is mounted on the base.
  • the bracket is provided in a non-photosensitive area of the photosensitive chip.
  • a camera module which includes:
  • An optical lens held in the photosensitive path of the photosensitive component is an optical lens held in the photosensitive path of the photosensitive component.
  • the camera module further includes a driving element disposed between the photosensitive component and the optical lens, and the driving element includes a series of pins that extend to and are electrically connected to the
  • the circuit board is used to electrically connect the driving element to the circuit board.
  • At least one side of the bracket is retracted inward to form an escape space between the bracket and the circuit board, and the escape space is configured to allow the pins of the driving element Passing through and electrically connected to the circuit board.
  • a stent which includes:
  • the metal inlay includes an inlay frame body, a part of the inlay frame body is exposed to the outside to form the suspension part, and another part of the inlay frame body is wrapped Covering and extending in the encapsulation part.
  • the metal insert further includes a reinforcing bar extending laterally outward from the inlay frame, and the reinforcing bar is covered and extends in the encapsulation part.
  • the range of the difference between the coefficient of thermal expansion of the suspension part in the metal insert and the coefficient of thermal expansion of the filter element is less than or equal to 15 ppm.
  • the stent has a symmetrical structure.
  • the stent has an asymmetric structure, wherein at least one side of the stent shrinks inwardly.
  • a method for preparing a stent which includes:
  • the molding material is cured, wherein the molding material is cured to form an encapsulation part covering at least a part of the metal insert, and the part of the metal insert that is exposed to the outside is directed from the encapsulation part to the outside. Extend inwardly and laterally to form a suspension portion configured to mount the filter element thereon.
  • Fig. 1 illustrates a schematic diagram of a camera module according to an embodiment of the present application.
  • Fig. 2 illustrates a schematic diagram of a bracket in the camera module implemented according to the present application.
  • Fig. 3 illustrates a schematic top view of the bracket according to an embodiment of the present application.
  • Fig. 4 illustrates a schematic top view of the bracket and the filter element according to an embodiment of the present application.
  • Fig. 5 illustrates a schematic diagram of a modified implementation of the stent according to an embodiment of the present application.
  • Fig. 6 illustrates a schematic diagram of another modified implementation of the stent according to an embodiment of the present application.
  • Fig. 7 illustrates a schematic diagram of another modified implementation of the stent according to an embodiment of the present application.
  • Fig. 8 illustrates a schematic diagram of another modified implementation of the stent according to an embodiment of the present application.
  • Fig. 9 illustrates a schematic diagram of another modified implementation of the stent according to an embodiment of the present application.
  • FIG. 10 illustrates a schematic diagram of a modified implementation of the camera module according to an embodiment of the present application.
  • FIG. 11 illustrates a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application.
  • FIG. 12 illustrates a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application.
  • FIG. 13 illustrates a schematic diagram of the camera module being an array camera module according to an embodiment of the present application.
  • FIG. 14 illustrates a schematic diagram of a camera module according to an embodiment of the present application.
  • Fig. 15 illustrates a schematic diagram of a bracket in the camera module implemented according to the present application.
  • Fig. 16 illustrates a schematic top view of the bracket according to an embodiment of the present application.
  • Fig. 17 illustrates a perspective schematic view of the bracket according to an embodiment of the present application.
  • Fig. 18 illustrates an exploded schematic diagram of the bracket according to an embodiment of the present application.
  • Fig. 19 illustrates a schematic bottom view of the bracket according to an embodiment of the present application.
  • FIG. 20 illustrates a schematic diagram of a modified implementation of the camera module according to an embodiment of the present application.
  • FIG. 21 illustrates a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application.
  • FIG. 22 illustrates a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application.
  • FIG. 23 illustrates a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application.
  • FIG. 24 illustrates a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application.
  • FIG. 25 illustrates a schematic diagram of the camera module being an array camera module according to an embodiment of the present application
  • the size of the filter element matching the photosensitive chip As described above, as the size of the photosensitive chip gradually increases, the size of the filter element matching the photosensitive chip also needs to increase accordingly.
  • the filter element is a sensitive and fragile component. As the size increases, its sensitivity and fragility will further increase. In actual industrial applications, there has been a phenomenon of filter element cracking. The inventor of the present application has carefully studied the mechanism of the filter element cracking and found that the cracking is mainly caused by the following reasons.
  • the filter element is usually mounted on a bracket.
  • the bracket includes a bracket body and a cantilever beam extending inward from the bracket body, and the filter element is mounted on the cantilever beam.
  • the stress acting on the filter element mainly has two parts: the first part comes from the stress generated by the holder itself, and the second part comes from the stress transferred from other components to the filter element through the holder.
  • bracket is usually made of plastic material. In the case of poor temperature changes, the bracket will expand and contract to generate stress acting on the filter element.
  • the bracket used to support the filter element may also have a structural relationship with other components.
  • a metal cover for covering the camera module is attached to the outside of the bracket.
  • These components will be subjected to external force to transfer stress to the bracket through the bracket.
  • the stent is usually made of plastic material and has a certain thickness, its deformability is relatively weak. Therefore, in the process of transferring the stress, the stress cannot be released by the deformation of the stent. In other words, the existing bracket cannot reduce the stress transmitted to the filter element.
  • the inventor of the present application found that the four corner areas of the filter element are the areas most prone to cracking. The reason is not difficult to find: the corner area of the filter element corresponds to the four corner areas of the cantilever beam, that is, the intersection of two adjacent cantilevers, where stress concentration is more likely to occur, resulting in four corners of the filter element. The corner area was damaged under the action of stress concentration.
  • the basic idea of the present application is to reduce the stress acting on the filter element by thinning the support part used to support the filter element, and prevent it from being damaged due to improper stress.
  • the mechanism for reducing the stress acting on the filter element includes two levels: first, thinning the bracket is beneficial to reduce the stress on the filter element due to its own deformation; second, thinning the bracket is beneficial to strengthen the stent Flexibility, so that more stress can be absorbed in the process of transferring stress, so as to relatively reduce the stress acting on the filter element.
  • the present application proposes a photosensitive component, including a circuit board, a photosensitive chip electrically connected to the circuit board, a filter element held on the photosensitive path of the photosensitive chip, and a light-sensitive component for mounting the filter
  • a holder for holding an optical element on the photosensitive path of the photosensitive chip the holder including a holder body and a suspension portion extending inward from the holder body, and the suspension portion mounts the filter element
  • at least one groove is recessedly formed in the suspension portion, so as to reduce the stress acting on the filter element through the at least one groove.
  • the camera module based on the embodiment of the present application is illustrated.
  • the camera module includes a photosensitive component 710 and an optical lens 720 held on the photosensitive path thereof.
  • the photosensitive component 710 includes a circuit board 711, a photosensitive chip 712 electrically connected to the circuit board 711, and at least one electronic component electrically connected to the circuit board 711 713.
  • a bracket 714 disposed on the circuit board 711, and a filter element 715 installed on the bracket 714 and corresponding to the photosensitive path of the photosensitive chip 712.
  • the type of the circuit board 711 is not limited by this application, and it includes, but is not limited to, a flexible board, a rigid board, a rigid-flex board, a ceramic substrate, and the like.
  • the at least one electronic component 713 provided on the circuit board 711 includes, but is not limited to, a resistor, a capacitor, an inductor, and the like.
  • the electronic components 713 can be mounted and electrically connected to the upper surface of the circuit board 711 through an SMT process (Surface Mounted Technology).
  • SMT process Surface Mounted Technology
  • the photosensitive chip 712 is electrically connected to the circuit board 711 through a lead 716
  • the type of the lead 716 is not limited by this application, for example, the lead 716 Can be gold wire, silver wire, copper wire.
  • the lead wire 716 can be installed between the circuit board 711 and the photosensitive chip 712 through a process of "golding wire” to achieve electrical connection between the two.
  • the "golden thread” process is generally divided into two types: the "positive gold line” process and the "reverse gold line” process.
  • the "positive gold wire” process means that in the process of laying out the leads 716, first one end of the lead 716 is formed on the conductive end of the circuit board 711, and then the lead 716 is bent and extended, and finally The other end of the lead 716 is formed on the conductive end of the photosensitive chip 712. In this way, the lead 716 is formed between the photosensitive chip 712 and the circuit board 711.
  • the "reverse gold wire” process means that in the process of laying out the leads 716, first one end of the lead 716 is formed on the conductive end of the photosensitive chip 712, and then the lead 716 is bent and extended, and finally The other end of the lead 716 is formed on the conductive end of the circuit board 711.
  • the lead 716 is formed between the photosensitive chip 712 and the circuit board 711. It is worth mentioning that the height of the upward protrusion of the lead 716 formed by the "reverse gold wire” process is relative to the height of the upward protrusion of the lead 716 formed by the "positive gold wire” process. Therefore, preferably, In this specific implementation, the wire 716 is formed by the "reversed gold wire” process.
  • the photosensitive chip 712 and the circuit board 711 can be connected in other ways (the lead wire 716 may not be used), for example,
  • the electrical conduction scheme with the back conduction is not limited by this application.
  • the bracket 714 is a prefabricated bracket 714, which can be attached to the corresponding position of the circuit board 711 through a COB (Chip on Board) process.
  • the optical lens 720 is also installed on the bracket 714. That is, in the embodiment of the present application, the supporting structure for supporting the optical lens 720 and the supporting structure for supporting the filter element 715 are both the bracket 714, that is, the bracket 714 is integrated ⁇ Type bracket.
  • the size of the filter element 715 matching the photosensitive chip 712 also needs to be increased accordingly.
  • the filter element 715 is a sensitive and fragile element. As the size increases, its sensitivity and fragility will further increase. In actual industrial applications, the filter element 715 has been cracked.
  • the part of the bracket 714 used to support the filter element 715 is made thin to reduce the stress acting on the filter element 715 and prevent it from being improperly stressed. damage.
  • the bracket 714 includes a bracket body 7141 and a suspension portion 7142 extending inward from the bracket body 7141, wherein the suspension portion 7142 A light window 7140 corresponding to the photosensitive chip 712 is formed on the outer periphery.
  • the filter element 715 is mounted on the suspension 7142 of the bracket 714, the imaging light collected by the optical lens 720 is After being filtered by the filter element 715, it can pass through the light window 7140 and reach the photosensitive chip 712.
  • the suspension portion 7142 extends outwardly from the inner surface of the bracket body 7141 in a suspended manner, wherein the upper surface of the suspension portion 7142 and the upper surface of the bracket body 7141 There is a certain distance between them. Preferably, the distance is greater than or almost equal to the thickness of the filter element 715. In this way, when the filter element 715 is mounted on the suspension portion 7142 of the bracket 714, The upper surface of the filter element 715 is lower than the upper surface of the support body 7141 or almost flush with the upper surface of the support body 7141 to protect the filter element 715 from unnecessary collision.
  • the suspension portion 7142 of the bracket 714 is partially thinned to reduce the stress acting on the filter element 715 and prevent it from being damaged due to improper stress.
  • the bracket 714 has at least one groove 71420 formed in the suspension portion 7142, so as to pass the at least one groove 71420.
  • the corresponding portion of the suspension portion 7142 is thinned. In this way, the stress acting on the filter element 715 is reduced. That is to say, in the embodiment of the present application, the thinned portion of the bracket 714 is provided on the suspension portion 7142.
  • the suspension portion 7142 is made thin by arranging the at least one groove 71420 on the suspension portion 7142.
  • the suspension portion 7142 is The amount of shrinkage under the same temperature change can be reduced. In this way, the stress on the filter element 715 due to the deformation of the suspension portion 7142 can be reduced; The flexibility of the suspension portion 7142 is relatively enhanced, so that when external stress is transmitted through the suspension portion 7142 and acts on the filter element 715, the suspension portion 7142 can absorb relatively more through its own deformation. More stress, thereby relatively reducing the stress acting on the filter element 715, so as to prevent the filter element 715 from being damaged.
  • the groove 71420 is recessedly formed on the lower surface of the suspension portion 7142, and the filter element 715 is mounted on the suspension portion
  • the position of the upper surface of 7142 corresponds to the groove 71420. It should be understood that by setting the position of the groove 71420, the part of the suspension portion 7142 for supporting the filter element 715 is thinned, so that when the same temperature occurs, the The portion of the suspension portion 7142 for supporting the filter element 715 has a relatively small shrinkage, so that the stress on the filter element 715 due to the deformation of the suspension portion 7142 can be reduced.
  • the bracket body 7141 and the suspension portion 7142 are transmitted and acted on the filter element 715, the thinned suspension portion 7142 can generate a relatively larger amount of deformation to absorb the stress more. Therefore, the stress energy transferred and acting on the filter element 715 is relatively small.
  • the thickness of the suspension portion 7142 at the groove 71420 is 0.05 mm-0.1 mm, and other parts of the suspension portion 7142 except for the groove 71420
  • the thickness is 0.18mm-0.2mm, that is, the thickness of the corresponding part of the suspension portion 7142 with the groove 71420 is 0.05mm-0.1mm, and the suspension portion 7142 is in addition to the groove
  • the thickness of parts other than the corresponding part of 71420 is 0.18mm-0.2mm.
  • the groove 71420 is recessedly formed in the corner area 71424 of the suspension portion 7142, that is, in the embodiment of the present application, The thinned portion of the suspension portion 7142 is disposed in the corner area 71424 thereof.
  • the bracket 714 generally has a symmetrical structure. Therefore, the bracket 714 acts on the filter element 715 and the stress transmitted by the bracket 714 and acts on the filter element 715. The stress is symmetrical, and stress concentration is likely to occur in the corner area 71424 of the filter element 715.
  • the groove 71420 in the corner area 71424 of the suspension portion 7142, the stress generated by the deformation of the bracket 714 and the stress transmitted by the bracket 714 and acting on the filter element 715 can be The corner area 71424 of the suspension portion 7142 is released to avoid stress concentration in the corner area 71424 of the filter element 715 and can relatively reduce the stress acting on the filter element 715 to reduce the filter Risk of breakage of optical element 715.
  • the groove 71420 extends to the inner edge 71422 of the suspension portion 7142 to form an edge groove.
  • the inner edge 71422 of the suspension portion 7142 indicates that the suspension portion 7142 is adjacent to the edge of the bracket body 7141, and the outer edge 71421 of the suspension portion 7142 indicates the suspension The holding portion 7142 is away from the edge of the bracket body 7141.
  • FIG. 5 illustrates a schematic diagram of a modified example of the bracket 714 according to the embodiment of the present application.
  • the groove 71420 is also recessedly formed on the lower surface of the suspension portion 7142, but the difference from the embodiment shown in FIGS. 2 to 4 is:
  • the groove 71420 extends between the inner edge 71422 and the outer edge 71421 of the suspension portion 7142 to form a receiving groove.
  • FIG. 6 illustrates a schematic diagram of another modified implementation of the bracket 714 according to an embodiment of the present application.
  • the groove 71420 is recessedly formed on the upper surface of the suspension portion 7142, and the groove 71420 extends to the outer edge 71421 of the suspension portion 7142, To form an edge groove.
  • the filter element 715 is installed in the edge groove, that is, in this modified implementation, the filter element 715 is installed at the position where the suspension portion 7142 is installed.
  • the upper surface of the filter element 715 is lower than the upper surface of the support body 7141 to protect the filter element 715.
  • the light element 715 collides unnecessarily.
  • FIG. 7 illustrates a schematic diagram of another modified embodiment of the bracket 714 according to the embodiment of the present application, wherein the bracket 714 shown in FIG. 7 is a modification of the bracket 714 shown in FIG. 6 Implement.
  • the groove 71420 is also recessedly formed on the upper surface of the suspension portion 7142, but it is different from the bracket 714 shown in FIG. 6 in that: The groove 71420 extends between the inner edge 71422 and the outer edge 71421 of the suspension portion 7142 to form a receiving groove.
  • the filter element 715 is attached to the suspension portion 7142 of the bracket 714 through an adhesive 717.
  • the existence of the receiving groove provides space and convenience for applying the adhesive 717.
  • the adhesive 717 is applied to the receiving groove and a part of the adhesive 717 overflows the receiving groove to attach the filter element 715 to the receiving groove.
  • the adhesive 717 has a certain degree of flexibility, so as to be configured to absorb the stress acting on the filter element 715.
  • the adhesive 717 has a certain degree of flexibility means that the adhesive 717 has a certain degree of flexibility and deformability, so as to be able to absorb stress and play a role of cushioning and shock absorption.
  • the adhesive 717 preferably has a certain degree of flexibility. This technical feature is also a preferred solution in other embodiments. Those of ordinary skill in the art should understand.
  • FIG. 8 illustrates a schematic diagram of another modified implementation of the bracket 714 according to an embodiment of the present application.
  • the groove 71420 is further recessed and formed on the side 71423 of the suspension portion 7142.
  • the suspension portion 7142 has a side 71423 and a corner area 71424 formed at the junction of the side 71423 and the side 71423. That is to say, in this modified embodiment, the setting range of the groove 71420 is expanded.
  • the setting range of the groove 71420 further includes a pair of symmetrical sides 71423 of the suspension portion 7142.
  • FIG. 9 illustrates a schematic diagram of another modified implementation of the bracket 714 according to an embodiment of the present application, wherein the bracket 714 shown in FIG. 9 is a modified implementation of the bracket 714 shown in FIG. 8.
  • the setting range of the groove 71420 is further expanded.
  • the setting range of the groove 71420 further includes all sides 71423 of the suspension portion 7142.
  • FIGS. 8 and 9 illustrate the expansion of the setting range of the groove 71420.
  • the expansion range and area can be adjusted, for example, only including the three sides of the suspension portion 7142 71423, this is not limited by this application.
  • FIG. 10 illustrates a schematic diagram of a modified implementation of the camera module according to an embodiment of the present application.
  • the photosensitive component 710 further includes a base 718 disposed on the circuit board 711, wherein the bracket 714 is installed on the base 718. That is to say, compared with the camera module shown in FIGS. 1 to 9, in this modified implementation, the setting position of the bracket 714 has been adjusted. Specifically, as shown in FIG.
  • the base 718 is formed on the circuit board 711 by a MOB (Molding on Board) process, and covers at least a part of the circuit board 711 and all At least a part of the electronic component 713, the bracket 714 is installed on the upper surface of the base 718, wherein the bracket body 7141 of the bracket 714 is used to carry the optical lens 720, and the bracket 714 The suspension portion 7142 is used for mounting the filter element 715.
  • the position and manner in which the base 718 is formed on the circuit board 711 is not limited by this application. For example, in the example shown in FIG.
  • the base 718 is formed on the circuit board 711 through the MOC (Molding on Chip) process, and covers at least a part of the circuit board 711, at least a part of the electronic components 713, and the non-sensitivity of the photosensitive chip 712 At least a part of the area (in the case where the photosensitive chip 712 is connected to the circuit board 711 through the lead 716, the base 718 may further cover the lead 716). This is not the case. Limitations of the application.
  • the bracket 714 has a symmetrical structure as an example, those of ordinary skill in the art should know that due to the electronic design space of the circuit board 711 Is limited, which will result in uneven distribution of the electronic components 713 on the circuit board 711 (for example, resistance and capacitance are concentrated on one side of the circuit board 711), which will cause the bracket 714 to not have Symmetrical structure.
  • the bracket in the camera module does not have a symmetrical structure.
  • the bracket 714 does not have a symmetrical structure
  • the stress on the filter element 715 caused by the deformation of the bracket 714 itself is transmitted to the filter element 715 through the bracket 714.
  • the stress will appear asymmetry, which is more likely to cause damage to the filter element 715.
  • the asymmetrical stress on the filter element 715 caused by the asymmetry of the bracket 714 can also be reduced, so as to prevent the asymmetrical stress of the filter element 715.
  • the filter element 715 is damaged.
  • the camera module based on the embodiment of the present application is clarified, wherein the bracket 714 used to support the filter element 715 in the camera module is partially thinned to reduce the stress on the filter element 715 and prevent It was damaged due to undue stress.
  • the camera module is implemented as a fixed-focus camera module as an example above, a person of ordinary skill in the art should understand that, in other examples of this application, the camera module may also include moving Focus camera module or optical image stabilization camera module.
  • the camera module when the camera module is implemented as a dynamic focus camera module, the camera module further includes a driving element, wherein the driving element is mounted on the upper surface of the bracket 714 or the base 718 On the upper surface of the optical lens 720, the optical lens 720 is mounted on the driving element, so that the optical lens 720 is held in the photosensitive path of the photosensitive component 710.
  • the camera module when the camera module is implemented as an optical anti-shake camera module, the camera module further includes an anti-shake motor, wherein the anti-shake motor is installed on the upper surface of the bracket 714 or the On the upper surface of the base 718, the optical lens 720 is mounted on the anti-shake motor, so that the optical lens 720 is held in the photosensitive path of the photosensitive component 710.
  • the above-mentioned camera module is implemented as a single-camera camera module as an example, a person of ordinary skill in the art should understand that the technical solution and spirit of partially thinning the bracket 714 disclosed in this application can also be used. It is applied to an array camera module, for example, it is implemented as a dual-camera camera module 7100 shown in FIG. 13.
  • the size of the filter element matching the photosensitive chip As described above, as the size of the photosensitive chip gradually increases, the size of the filter element matching the photosensitive chip also needs to increase accordingly.
  • the filter element is a sensitive and fragile component. As the size increases, its sensitivity and fragility will further increase. In actual industrial applications, there has been a phenomenon of filter element cracking. The inventor of the present application has carefully studied the mechanism of the filter element cracking and found that the cracking is mainly caused by the following reasons.
  • the filter element is usually mounted on a bracket.
  • the bracket includes a bracket body and a cantilever beam extending inward from the bracket body, and the filter element is mounted on the cantilever beam.
  • the stress acting on the filter element mainly has two parts: the first part comes from the stress generated by the holder itself, and the second part comes from the stress transferred from other components to the filter element through the holder.
  • the stent is usually made of plastic material. Under the condition of large temperature changes, the stent will expand and contract to generate stress acting on the filter element. Some manufacturers choose to reduce the thickness of the bracket to reduce the impact of the first part of the stress, but reducing the thickness of the bracket will cause the overall support strength of the bracket to be insufficient, especially when the bracket is also used to support an optical lens or a motor. .
  • the inventor of the present application further found that in the existing camera module, the thermal expansion coefficient between the bracket and the filter element is different (usually more than ⁇ 20ppm). In this way, when the temperature changes, the bracket and the filter element support The relative amount of expansion and contraction that occurs is relatively large to generate greater stress and cause damage to the filter element.
  • the bracket used to support the filter element may also have a structural relationship with other components.
  • the Mount the motor or lens on the bracket in some camera modules, the outer side of the bracket is also attached with a metal cover for covering the camera module, etc.
  • These components will be subjected to external force to transfer stress to the filter element through the bracket .
  • the stent since the stent is usually made of plastic material and has a certain thickness, its deformability is relatively weak. Therefore, in the process of transferring the stress, the stress cannot be released by the deformation of the stent. In other words, the existing bracket cannot reduce the stress transmitted to the filter element.
  • the existing brackets are usually made of plastic materials (for example, made of molded materials, where the molded materials include but are not limited to epoxy resin, etc.), and the surface precision after molding is not high.
  • the surface of the holder used to install the filter element has a relatively high roughness, which will affect the flatness of the filter element installation, on the other hand, it will also increase the gap between the filter element and the surface of the holder. The magnitude of the stress causes the filter element to be more easily damaged.
  • the basic idea of the present application is to form a new type of support structure by integrating a metal insert with a packaging material, wherein the part of the metal insert exposed to the outside is used to support the filter element.
  • the bracket can achieve better overall performance in terms of overall support strength, installation flatness, and stress reduction.
  • the mechanism by which the bracket with the above-mentioned structural configuration can reduce the stress acting on the filter element includes the following levels: First, the suspension part of the bracket for mounting the filter element is made of metal material Therefore, under the premise of the same temperature change, the amount of expansion and contraction of the suspension part is relatively small, so as to reduce the effect of the support on the filter element.
  • the suspension part of the bracket used to install the filter element is made of metal material, and the coefficient of thermal expansion between it and the filter element is relatively close, so that under the same temperature change, the The stress between the filter element and the suspension can be relatively reduced;
  • the suspension formed by the metal insert has a relatively higher height The flatness of the filter element, thereby improving the flatness of the installation of the filter element, wherein the increase in the flatness of the installation can make the stress distribution relatively more uniform, reduce the occurrence of stress concentration, thereby reducing the possibility of damage to the filter element sex.
  • the present application proposes a photosensitive component, which includes a circuit board, a photosensitive chip electrically connected to the circuit board, a filter element held on the photosensitive path of the photosensitive chip, and for mounting the A support for a filter element such that it is held on the photosensitive path of the photosensitive chip, the support including a metal insert and a packaging part covering at least a part of the metal insert, the metal insert The part exposed to the outside extends inwardly and laterally from the encapsulation part to form a suspension part, wherein the filter element is mounted on the suspension part.
  • the bracket is integrated with the metal insert through the packaging material, so that the bracket can achieve better overall performance in terms of overall support strength, installation flatness, and stress reduction.
  • the camera module based on the embodiment of the present application is illustrated, wherein the camera module includes a photosensitive component 810 and an optical lens 820 held on the photosensitive path thereof.
  • the photosensitive component 810 includes a circuit board 811, a photosensitive chip 812 electrically connected to the circuit board 811, and at least one electronic component electrically connected to the circuit board 811 813.
  • a bracket 814 arranged on the circuit board 811 and a filter element 815 installed on the bracket 814 and corresponding to the photosensitive path of the photosensitive chip 812.
  • the type of the circuit board 811 is not limited to this application, and it includes, but is not limited to, a flexible board, a rigid board, a rigid-flex board, a ceramic substrate, and the like.
  • the at least one electronic component 813 provided on the circuit board 811 includes, but is not limited to, a resistor, a capacitor, an inductor, and the like.
  • the electronic component 813 can be mounted and electrically connected to the upper surface of the circuit board 811 through an SMT process (Surface Mounting Technology).
  • SMT process Surface Mounting Technology
  • the photosensitive chip 812 is electrically connected to the circuit board 811 through a lead 816
  • the type of the lead 816 is not limited by this application, for example, the lead 816 Can be gold wire, silver wire, copper wire.
  • the lead 816 may be installed between the circuit board 811 and the photosensitive chip 812 through a process of "golding wire” to realize electrical connection between the two.
  • the "golden thread” process is generally divided into two types: the "positive gold line” process and the "reverse gold line” process.
  • the "positive gold wire” process means that in the process of laying out the leads 816, first one end of the lead 816 is formed on the conductive end of the circuit board 811, and then the lead 816 is bent and extended, and finally The other end of the lead 816 is formed on the conductive end of the photosensitive chip 812, and in this way, the lead 816 is formed between the photosensitive chip 812 and the circuit board 811.
  • the "reverse gold wire” process means that in the process of laying the lead 816, one end of the lead 816 is first formed on the conductive end of the photosensitive chip 812, and then the lead 816 is bent and extended, and finally The other end of the lead 816 is formed on the conductive end of the circuit board 811, and in this way, the lead 816 is formed between the photosensitive chip 812 and the circuit board 811. It is worth mentioning that the height of the upward protrusion of the lead 816 formed by the "reverse gold wire” process is lower than the height of the upward protrusion of the lead 816 formed by the "positive gold wire” process. Therefore, preferably In this specific implementation, the wire 816 is formed by the "reverse gold wire” process.
  • the photosensitive chip 812 and the circuit board 811 can be connected in other ways (the lead 816 may not be used), for example,
  • the electrical conduction scheme with the back conduction is not limited by this application.
  • the bracket 814 is a prefabricated bracket 814, which can be attached to the corresponding position of the circuit board 811 through a COB (Chip on Board) process.
  • the optical lens 820 is also installed on the bracket 814. That is, in the embodiment of the present application, the supporting structure for supporting the optical lens 820 and the supporting structure for supporting the filter element 815 are both the bracket 814, that is, the bracket 814 is integrated ⁇ Type bracket.
  • the size of the filter element matching the photosensitive chip also needs to be increased accordingly, resulting in a further increase in the sensitivity and fragility of the filter element.
  • the structural configuration of the bracket 814 is optimized, so that the bracket 814 can achieve better overall performance in terms of overall support strength, installation flatness, and stress reduction.
  • the bracket 814 includes a metal insert 8142 and is integrated into the metal in a manner of covering at least a part of the metal insert 8142.
  • the encapsulation portion 8141 of the insert 8142 wherein the part of the metal insert 8142 exposed to the outside extends inwardly and laterally from the encapsulation portion 8141 to form a suspension portion 81420, and the suspension portion 81420 is configured for mounting
  • the filter element 815 is thereon. That is to say, in the embodiment of the present application, the suspension portion 81420 for mounting and forming the filter element 815 is made of a metal material. As shown in FIG.
  • the inner periphery of the suspension portion 81420 forms a light window corresponding to the photosensitive chip 812, so that when the filter element 815 is mounted on the bracket 814 When the suspension portion 81420 is used, the imaging light collected by the optical lens 820 can pass through the light window and reach the photosensitive chip 812 after being filtered by the filter element 815.
  • the suspension portion 81420 formed by the metal insert 8142 has a relatively higher flatness, thereby enhancing the filter element 815 The installation flatness. It should be understood that when the installation flatness of the filter element 815 is improved, the filter element 815 can be more evenly and tightly attached to the upper surface of the suspension portion 81420, so that the filter element 815 The coefficient of friction between the element 815 and the suspension portion 81420 can be reduced to reduce the ability of stress transmission. Further, the increase in the flatness of the installation can make the stress distribution relatively more uniform, reduce the occurrence of stress concentration, and thereby reduce the possibility of damage to the filter element 815.
  • the thermal expansion coefficient of the metal insert 8142 is smaller than that of the packaging material, when the same temperature change occurs, the suspension portion 81420 formed by the metal insert 8142 will be relatively smaller. The amount of deformation is reduced to reduce the stress applied to the filter element 815 by the bracket 814, so as to prevent the filter element 815 from being damaged. Moreover, compared with the existing bracket 814 and the filter element 815, in the embodiment of the present application, the coefficient of thermal expansion of the metal insert 8142 and the coefficient of thermal expansion of the filter element 815 are relatively close, so that Under the premise of the same temperature change, the stress generated between the filter element 815 and the suspension portion 81420 can be relatively reduced, thereby reducing the possibility of damage to the filter element 815.
  • the thermal expansion coefficient of the metal insert 8142 ranges from 10 ppm to 20 ppm
  • the thermal expansion coefficient of the filter element 815 is less than 10 ppm
  • the metal insert 8142 (Especially the suspension portion 81420) and the filter element 815 have a thermal expansion coefficient difference in a range of less than ⁇ 15.
  • the metal insert 8142 is implemented as SUS316 with a thermal expansion coefficient of 16 ppm
  • the thermal expansion coefficient of the filter element 815 is 7.82, which is 8.88 in between.
  • the metal insert 8142 may also be made of other metal materials, metal and non-metal alloy materials, or metal and metal alloy materials, which is not limited by this application.
  • the suspension portion 81420 formed by the metal insert 8142 has relatively high strength. Therefore, the thickness of the suspension portion 81420 can be reduced under the premise of meeting the strength requirement.
  • the thickness dimension of the suspension portion 81420 is 0.08-0.15 mm.
  • the suspension portion 81420 extends outwardly from the side of the packaging portion 8141 in a suspended manner, wherein the upper surface of the suspension portion 81420 and the There is a certain distance between the upper surfaces of the encapsulation portion 8141. That is to say, in the embodiment of the present application, the encapsulation portion 8141 is higher than the suspension portion 81420 formed by the metal insert 8142.
  • the distance between the upper surface of the encapsulation portion 8141 and the upper surface of the suspension portion 81420 is greater than or almost equal to the thickness of the filter element 815, so that when the filter element 815 is mounted on the suspension portion 81420 of the bracket 814, the upper surface of the filter element 815 is lower than the upper surface of the main body of the bracket 814 or is close to the upper surface of the main body of the bracket 814 They are flush to protect the filter element 815 from unnecessary collisions.
  • the bracket 814 is an integrated bracket, which is used to support the optical lens 820 and the filter element 815 at the same time. It should be understood that since the optical lens 820 is mounted on the bracket 814, the bracket 814 should have a certain structural strength. In the prior art, the structural strength of the bracket 814 is usually increased by increasing the thickness of the bracket 814. However, when the thickness dimension is increased, the bracket 814 will undergo a greater deformation under the same temperature change, resulting in greater stress for filtering light. The element 815 causes the filter element 815 to be more easily damaged. In other words, in the existing one-piece bracket 814, its thickness is a contradictory physical parameter. However, in the embodiment of the present application, the bracket 814 improves its overall structural strength through the embedded metal insert 8142. In this way, the bracket 814 can maintain the existing size configuration. Under (even smaller), with satisfactory structural strength.
  • the metal inlay 8142 includes an inlay frame 8143. After injection molding, a part of the inlay frame 8143 It is exposed to the outside to form the suspension portion 81420, and another part of the embedded frame body 8143 is covered and extends inside the encapsulation portion 8141. Further, the metal insert 8142 further includes a reinforcing member 8144 extending laterally outward from the inlay frame body 8143, and the reinforcing member 8144 is covered and extends in the encapsulation portion 8141. It should be understood The reinforcing member 8144 that is wrapped and extended in the encapsulation portion 8141 can further enhance the overall structural strength of the bracket 814.
  • the reinforcing member 8144 can be arranged on one side, adjacent two sides, symmetrical two sides, three sides, or all sides of the embedded frame body 8143, that is to say In this embodiment of the present application, the location of the reinforcing member 8144 is not limited by this application. Moreover, in the embodiment of the present application, the shape of the reinforcing member 8144 is not limited by this application.
  • the reinforcing member 8144 may include a reinforcing bar with a strip structure, and a reinforcing bar with a "mountain" structure. Box etc.
  • the packaging portion 8141 of the bracket 814 has a recess formed therein
  • the upper surface is connected to the groove 8145 of the suspension portion 81420.
  • the groove 8145 has an elliptical shape and is recessed from the upper surface of the packaging portion 8141 and extends diagonally downward to the suspension portion 81420, so as to facilitate picking up the Filter element 815.
  • the groove 8145 can be implemented as a groove 8145 of other shapes, which is not limited by this application.
  • the metal insert 8142 can be integrally combined with the encapsulation portion 8141 through an injection molding process to form the bracket 814.
  • the metal insert 8142 is first placed in the molding cavity of the forming mold, for example, the metal insert 8142 is pressed and flattened by a thimble; then, the molding material is filled in the molding cavity Then, the molding material is cold-cured to form the encapsulation part 8141.
  • FIG. 20 illustrates a schematic diagram of a modified implementation of the camera module according to an embodiment of the present application.
  • the photosensitive component 810 further includes a base 817 disposed on the circuit board 811, wherein the bracket 814 is mounted on the base 817. That is to say, compared with the camera module shown in FIGS. 14 to 19, in this modified implementation, the setting position of the bracket 814 has been adjusted. Specifically, as shown in FIG.
  • the base 817 is formed on the circuit board 811 by a MOB (Molding on Board) process, and covers at least a part of the circuit board 811 and For at least a part of the electronic component 813, the bracket 814 is installed on the upper surface of the base 817.
  • FIG. 21 illustrates a schematic diagram of a modified implementation of the camera module according to an embodiment of the present application.
  • the photosensitive component 810 further includes a base 817 disposed on the circuit board 811, and the base 817 is formed on the circuit board by a MOB (Molding on Board) process.
  • the bracket 814 is installed on the upper surface of the base 817.
  • the optical lens 820 is mounted on the base 817
  • the filter element 815 is mounted on the base 817.
  • the position and manner of forming the base 817 on the circuit board 811 are not limited by this application.
  • the base 817 is formed on the circuit board 811 through a MOC (Molding on Chip) process, and covers at least a part of the circuit board 811, at least a part of the electronic components 813, and At least a part of the non-photosensitive area of the photosensitive chip 812 (in the case that the photosensitive chip 812 is connected to the circuit board 811 through the lead 816, the base 817 may further cover the lead 816)
  • MOC Manufacturing on Chip
  • FIG. 23 illustrates another modified implementation of the camera module according to the embodiment of the present application.
  • the bracket 814 is disposed on the non-photosensitive area of the photosensitive chip 812
  • the photosensitive component 810 further includes a base 817 disposed on the circuit board 811, wherein, The optical lens 820 is installed on the base 817.
  • the bracket 814 has a symmetrical structure as an example, a person of ordinary skill in the art should know that in some camera modules, based on specific According to scene requirements, the layout mode of the electronic components 813 on the circuit board 811 will be adjusted. Accordingly, in these scenes, the overall shape of the bracket 814 will be asymmetrical.
  • a terminal device such as a smart phone
  • the at least one electronic component 813 is concentrated on the line One side of the board 811.
  • the camera module further includes a drive that is arranged between the photosensitive component 810 and the optical lens 820 and is used to carry the movement of the optical lens 820.
  • Component 830 Correspondingly, when there are many pins 831 of the driving element 830, in order to avoid the pins 831 of the driving element 830, at least one side of the bracket 814 is contracted inwardly to connect the bracket 814 and the An escape space is formed between the circuit boards 811 to allow the pins 831 to pass through and be electrically connected to the circuit board 811.
  • FIG. 24 illustrates a schematic diagram of another modified implementation of the camera module according to an embodiment of the present application. As shown in FIG. 24, in this example, the bracket 814 has an asymmetrical shape.
  • the driving element 830 includes but is limited to a dynamic focus motor (that is, the camera module is a dynamic focus camera module), an optical image stabilization motor ( That is, the camera module is implemented as an optical image stabilization motor) or the like.
  • the camera module based on the embodiment of the present application is clarified, wherein the bracket 814 used to support the filter element 815 in the camera module is formed by integrally combining packaging materials and covering the metal insert 8142, so that all The bracket 814 can achieve better overall performance in terms of overall support strength, installation flatness, and stress reduction.
  • the camera module is implemented as a single-camera camera module as an example above, a person of ordinary skill in the art should understand that the technical solution for partially thinning the bracket 814 disclosed in this application The same idea can be applied to an array camera module, for example, it is implemented as a dual camera module 8100 as shown in FIG. 25.
  • a bracket 814 for supporting the filter element 815 is also provided.
  • the bracket 814 includes a metal insert 8142 and an encapsulation portion 8141 integrally coupled to the metal insert 8142 in a manner of covering at least a part of the metal insert 8142, Wherein, the part of the metal insert 8142 exposed to the outside extends inwardly and laterally from the encapsulation portion 8141 to form a suspension portion 81420, wherein the suspension portion 81420 is configured to mount the filter Element 815 is on it.
  • the metal insert 8142 includes an inlay frame 8143, a part of the inlay frame 8143 is exposed to the outside to form the suspension portion 81420, and the inlay frame 8143 The other part of the frame 8143 is covered and extends inside the packaging portion 8141.
  • the metal insert 8142 further includes a reinforcing member 8144 extending laterally outward from the inlay frame 8143, and the reinforcing member 8144 is covered and extends over the Inside the package 8141.
  • the upper surface of the encapsulation portion 8141 is higher than the upper surface of the suspension portion 81420.
  • the distance between the upper surface of the encapsulation portion 8141 and the upper surface of the suspension portion 81420 is greater than or equal to the thickness of the filter element 815.
  • the packaging portion has a groove 8145 formed recessed on the upper surface thereof and communicating with the suspension portion 81420.
  • the thickness dimension of the suspension portion 81420 in the metal insert 8142 is 0.08-0.15 mm.
  • bracket 814 based on the embodiment of the present application is clarified, which integrates the metal insert 8142 through the packaging material, so that the bracket 814 can achieve better overall support strength, installation flatness, and stress reduction. Comprehensive performance.
  • a method for preparing a stent which includes the steps of: S110, placing a metal insert 8142 in a molding cavity formed by a molding die; S120, filling the molding cavity with a molding material; and , S130, curing the molding material, wherein the molding material is cured to form an encapsulation portion 8141 covering at least a part of the metal insert 8142, and the part of the metal insert 8142 exposed to the outside Extending inward and laterally from the encapsulation portion 8141 to form a suspension portion 81420, and the suspension portion 81420 is configured to mount the filter element 815 thereon.
  • step S110 a thimble can be used to hold and flatten the metal insert 8142 in the molding cavity.
  • the method of curing the molding material is cold curing, that is, curing the molding material by lowering the temperature.
  • the stent preparation method based on the examples of the present application is clarified, which can prepare the stent 814 as described above.

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Abstract

本申请公开了一种支架、感光组件、摄像模组和支架制备方法。该感光组件包括线路板、电连接于所述线路板的感光芯片、保持于所述感光芯片的感光路径上的滤光元件，以及，用于安装所述滤光元件以使得其被保持于所述感光芯片的感光路径上的支架，所述支架包括金属内嵌件和包覆所述金属内嵌件的至少一部分的封装部，所述金属内嵌件中裸露于外界的部分自所述封装部向内且横向地延伸以形成悬持部，其中，所述滤光元件安装于所述悬持部。这样，所述支架通过封装材料一体结合金属内嵌件，以使得所述支架能够在整体支撑强度、安装平整度和降低应力等方面取得较优的综合性能。

Description

支架、感光组件、摄像模组和支架制备方法 技术领域
本申请涉及摄像模组领域，尤其涉及支架、感光组件、摄像模组和支架制备方法。
背景技术
随着移动电子设备的普及，被应用于移动电子设备用于帮助使用者获取影像(例如视频或者图像)的摄像模组的相关技术得到了迅猛的发展和进步，并且，在近年来，摄像模组在诸如医疗、安防、工业生产等诸多的领域都得到了广泛的应用。
为了满足越来越广泛的市场需求，高像素、大芯片、小尺寸、大光圈是现有摄像模组不可逆转的发展趋势。由于感光芯片的尺寸逐步提升，例如现阶段比较常见的4800万像素的芯片，其尺寸为1/2英寸，未来1/1.87英寸乃至更大尺寸的芯片将普及，与所述感光芯片匹配的滤光元件尺寸也相应地需增加。
然而，在本领域普通技术人员应知晓，滤光元件为敏感且脆弱的元器件，随着尺寸的增加，其敏感性和脆弱度将进一步增加。在实际产业应用中，已出现滤光元件破裂的现象。滤光元件破损会影响摄像模组的成像性能且一旦破坏之后难以修复。
因此，需要一种有效的方案来确保滤光元件的稳定性和安全性。
发明内容
本申请的主要目的在于提供一种摄像模组及其感光组件，所述摄像模组中用于支持滤光元件的支架被部分减薄，以降低作用于所述滤光元件的应力，防止其因受不当应力而损坏。
本申请的另一目的在于提供一种摄像模组及其感光组件，用于支持所述滤光元件的支架被部分减薄，以增强所述支架的柔韧性，以使得所述支架自身能吸收相对更多的应力，以相对地减小作用于所述滤光元件的应力。
本申请另一目的在于提供一种摄像模组及其感光组件，所述支架被减薄的部分设置于所述悬持部，以使得所述悬持部的柔韧性增强，也就是说，在应力通过所述悬持部传递并作用于所述滤光元件的过程中，所述悬持部能吸收相对更多的应力，从而相对地减小作用于所述滤光元件的应力，以防止所述滤光元件破损。
本申请另一目的在于提供一种摄像模组及其感光组件，通过将所述支架的悬持部做薄，在预定收缩率的前提下，所述悬持部在相同温度变化下的收缩量可以减小，以减小所述悬持部因自身形变而作用于所述滤光元件的应力。
本申请的另一目的在于提供一种摄像模组及其感光组件，所述支架被减薄的部分包括所述悬持部的转角区域，通过该位置设定以减小(甚至消除)所述支架主体传递给所述滤光元件的转角的应力。
本申请的另一目的在于提供一种摄像模组及其感光组件，所述支架自身具有不对称结构，通过将所述支架的部分做薄，可降低所述支架因其自身结构的不对称性而作用于所述滤光元件不对称的应力，以防止所述滤光元件破损。
本申请的主要目的在于提供一种支架、感光组件、摄像模组和支架制备方法，所述摄像模组中用于支持滤光元件的支架通过封装材料一体结合金属内嵌件，以使得所述支架能够在整体支撑强度、安装平整度和降低应力等方面取得较优的综合性能。
本申请的另一目的在于提供一种支架、感光组件、摄像模组和支架制备方法，所述支架包括金属内嵌件和包覆所述金属内嵌件的至少一部分的封装部，所述金属内嵌件中裸露于外界的部分自所述封装部向内且横向地延伸以形成悬持部，所述悬持部被配置为支持所述滤光元件于其上。也就是说，在本申请实施例中，所述滤光元件安装于所述金属内嵌件上。
本申请的另一目的在于提供一种支架、感光组件、摄像模组和支架制备方法，由所述金属内嵌件形成的所述悬持部具有相对更高的平整度，以提升所述滤光元件的安装平整度。
本申请的另一目的在于提供一种支架、感光组件、摄像模组和支架制备方法，由于所述金属内嵌件的热膨胀系数小于封装材料的热膨胀系数，因此，当发生相同温度变化时，由所述金属内嵌件形成的所述悬持部发生相对更小的形变量，以降低所述支架作用于所述滤光元件的应力，以防止所述滤光元 件破损。
本申请的另一目的在于提供一种支架、感光组件、摄像模组和支架制备方法，由所述金属内嵌件形成的所述悬持部具有更高的结构强度，从而在外部应力通过所述悬持部作用于所述滤光元件的过程中，所述悬持部几近不会发生形变，以缩减传递并作用于所述滤光元件的应力。
本申请另一目的在于提供一种支架、感光组件、摄像模组和支架制备方法，所述支架具有内嵌的所述金属内嵌件，以使得其整体结构强度能够增强，从而所述支架的尺寸(尤其是厚度尺寸)能够缩减。也就是说，所述支架能够更加小型化。
本申请的另一目的在于提供一种支架、感光组件、摄像模组和支架制备方法，所述金属内嵌件包括延伸于所述封装体内部的加强件，以通过所述加强件增强所述支架的整体结构强度，其中，在一些实施例中，所述支架主体用于安装马达或光学镜头。
为实现上述至少一目的或优势，提出了本申请。本申请提供了一种感光组件，其包括：
线路板；
感光芯片，电连接于所述线路板；
滤光元件，保持于所述感光芯片的感光路径上；以及
支架，用于安装所述滤光元件以使得所述滤光元件被保持于所述感光芯片的感光路径上，所述支架包括支架主体和自所述支架主体向内延伸的悬持部，所述悬持部安装所述滤光元件，其中，至少一凹槽凹陷地形成于所述悬持部，以通过所述至少一凹槽降低作用于所述滤光元件的应力。
在根据本申请的感光组件中，所述凹槽凹陷地形成于所述悬持部的上表面，所述滤光元件安装于所述凹槽。
在根据本申请的感光组件中，所述凹槽凹陷地形成于所述悬持部的下表面，所述滤光元件安装于所述悬持部上表面的位置对应于所述凹槽。
在根据本申请的感光组件中，所述凹槽凹陷地形成于所述悬持部的转角区域。
在根据本申请的感光组件中，所述凹槽延伸至所述悬持部的外侧边缘，以形成边缘槽。
在根据本申请的感光组件中，所述凹槽延伸于所述悬持部的内侧边缘和 外侧边缘之间，以形成收容槽。
在根据本申请的感光组件中，所述凹槽进一步凹陷地形成于所述悬持部的边。
在根据本申请的感光组件中，所述凹槽关于所述滤光元件对称地设置。
在根据本申请的感光组件中，所述感光组件进一步包括施加于所述收容槽内的黏着剂，其中，所述黏着剂具有柔韧性，以被配置为吸收作用于所述滤光元件的应力。
在根据本申请的感光组件中，所述感光组件进一步包括施加于所述边缘槽内的黏着剂，其中，所述黏着剂具有柔韧性，以被配置为吸收作用于所述滤光元件的应力。
在根据本申请的感光组件中，具有所述凹槽的所述悬持部的对应部分的厚度为0.05mm-0.1mm，所述悬持部在除所述凹槽对应部分之外的其他部分的厚度为0.18mm-0.2mm。
在根据本申请的感光组件中，所述支架设置于所述线路板。
在根据本申请的感光组件中，所述感光组件进一步包括设置于所述线路板的基座，其中，所述支架安装于所述基座。
根据本申请的另一方面，还提供一种摄像模组，其包括：
如上所述的感光组件；以及
保持于所述感光组件的感光路径的光学镜头。
在根据本申请的摄像模组中，所述摄像模组进一步包括设置于所述感光组件和所述光学镜头之间的驱动元件。
根据本申请的又一方面，还提供了一种感光组件，其包括：
线路板；
感光芯片，电连接于所述线路板；
滤光元件，保持于所述感光芯片的感光路径上；以及
支架，用于安装所述滤光元件以使得所述滤光元件被保持于所述感光芯片的感光路径上，所述支架包括金属内嵌件和包覆所述金属内嵌件的至少一部分的封装部，所述金属内嵌件中裸露于外界的部分自所述封装部向内且横向地延伸以形成悬持部，其中，所述滤光元件安装于所述悬持部。
在根据本申请的感光组件中，所述金属内嵌件包括内嵌框体，所述内嵌框体的一部分裸露于外界以形成所述悬持部，所述内嵌框体的另一部分被包 覆且延伸于所述封装部内。
在根据本申请的感光组件中，所述金属内嵌件进一步包括自所述内嵌框体向外横向延伸的加强条，所述加强条被包覆且延伸于所述封装部内。
在根据本申请的感光组件中，所述封装部的上表面高于所述悬持部的上表面。
在根据本申请的感光组件中，所述封装部的上表面与所述悬持部的上表面之间的间距大于或等于所述滤光元件的厚度尺寸。
在根据本申请的感光组件中，所述封装部具有凹陷地形成于其上表面且连通于所述悬持部的凹槽。
在根据本申请的感光组件中，所述金属内嵌件中所述悬持部的厚度尺寸为0.08-0.15mm。
在根据本申请的感光组件中，所述金属内嵌件中所述悬持部的热膨胀系数与所述滤光元件的热膨胀系数之差的范围小于或等于15ppm。
在根据本申请的感光组件中，所述支架设置于所述线路板。
在根据本申请的感光组件中，所述感光组件进一步包括设置于所述线路板的基座，其中，所述支架安装于所述基座。
在根据本申请的感光组件中，所述支架设置于所述感光芯片的非感光区域。
根据本申请的另一方面，还提供一种摄像模组，其包括：
如上所述的感光组件；以及
保持于所述感光组件的感光路径的光学镜头。
在根据本申请的摄像模组中，进一步包括设置于所述感光组件和所述光学镜头之间的驱动元件，所述驱动元件包括一系列引脚，所述引脚延伸至并电连接于所述线路板，以将所述驱动元件电连接于所述线路板。
在根据本申请的摄像模组中，所述支架中至少一侧向内收缩以所述支架和所述线路板之间形成避让空间，所述避让空间被配置为允许所述驱动元件的引脚穿过并电连接于所述线路板。
根据本申请的另一方面，还提供一种支架，其包括：
金属内嵌件；以及
包覆所述金属内嵌件的至少一部分的封装部，其中，所述金属内嵌件中裸露于外界的部分自所述封装部向内且横向地延伸以形成悬持部，其中，所 述悬持部被配置为安装所述滤光元件于其上。
在根据本申请的支架中，所述金属内嵌件包括内嵌框体，所述内嵌框体的一部分裸露于外界以形成所述悬持部，所述内嵌框体的另一部分被包覆且延伸于所述封装部内。
在根据本申请的支架中，所述金属内嵌件进一步包括自所述内嵌框体向外横向延伸的加强条，所述加强条被包覆且延伸于所述封装部内。
在根据本申请的支架中，所述金属内嵌件中所述悬持部的热膨胀系数与滤光元件的热膨胀系数之差的范围小于或等于15ppm。
在根据本申请的支架中，所述支架具有对称结构。
在根据本申请的支架中，所述支架具有非对称结构，其中，所述支架中至少一侧向内收缩。
根据本申请又一方面，还提供一种支架制备方法，其包括：
将金属内嵌件放置于由成型模具形成的成型腔内；
填充成型材料于所述成型腔；以及
固化所述成型材料，其中，所述成型材料固化后形成包覆所述金属内嵌件的至少一部分的封装部，并且，所述金属内嵌件中裸露于外界的部分自所述封装部向内且横向地延伸以形成悬持部，所述悬持部被配置为安装所述滤光元件于其上。
通过对随后的描述和附图的理解，本申请进一步的目的和优势将得以充分体现。
本申请的这些和其它目的、特点和优势，通过下述的详细说明，附图和权利要求得以充分体现。
附图说明
通过结合附图对本申请实施例进行更详细的描述，本申请的上述以及其他目的、特征和优势将变得更加明显。附图用来提供对本申请实施例的进一步理解，并且构成说明书的一部分，与本申请实施例一起用于解释本申请，并不构成对本申请的限制。在附图中，相同的参考标号通常代表相同部件或步骤。
图1图示了根据本申请实施例的摄像模组的示意图。
图2图示了根据本申请实施的所述摄像模组中支架的示意图。
图3图示了根据本申请实施例的所述支架的俯视示意图。
图4图示了根据本申请实施例的所述支架与所述滤光元件的俯视示意图。
图5图示了根据本申请实施例的所述支架的一种变形实施的示意图。
图6图示了根据本申请实施例的所述支架的又一种变形实施的示意图。
图7图示了根据本申请实施例的所述支架的又一种变形实施的示意图。
图8图示了根据本申请实施例的所述支架的又一种变形实施的示意图。
图9图示了根据本申请实施例的所述支架的又一种变形实施的示意图。
图10图示了根据本申请实施例的所述摄像模组的一种变形实施的示意图。
图11图示了根据本申请实施例的所述摄像模组的的又一种变形实施的示意图。
图12图示了根据本申请实施例的所述摄像模组的的又一种变形实施的示意图。
图13图示了根据本申请实施例的所述摄像模组为阵列摄像模组的示意图。
图14图示了根据本申请实施例的摄像模组的示意图。
图15图示了根据本申请实施的所述摄像模组中支架的示意图。
图16图示了根据本申请实施例的所述支架的俯视示意图。
图17图示了根据本申请实施例的所述支架的立体透视示意图。
图18图示了根据本申请实施例的所述支架的爆炸示意图。
图19图示了根据本申请实施例的所述支架的仰视示意图。
图20图示了根据本申请实施例的所述摄像模组的一种变形实施的示意图。
图21图示了根据本申请实施例的所述摄像模组的另一种变形实施的示意图。
图22图示了根据本申请实施例的所述摄像模组的又一种变形实施的示意图。
图23图示了根据本申请实施例的所述摄像模组的又一种变形实施的示意图。
图24图示了根据本申请实施例的所述摄像模组的又一种变形实施的示意图。
图25图示了根据本申请实施例的所述摄像模组为阵列摄像模组的示意图
具体实施方式
下面，将参考附图详细地描述根据本申请的示例实施例。显然，所描述的实施例仅仅是本申请的一部分实施例，而不是本申请的全部实施例，应理解，本申请不受这里描述的示例实施例的限制。
申请概述
如上所述，随着感光芯片的尺寸逐步提升，与所述感光芯片匹配的滤光元件尺寸也相应地需增加。滤光元件为敏感且脆弱的元器件，随着尺寸的增加，其敏感性和脆弱度将进一步增加。在实际产业应用中，已出现滤光元件破裂的现象。本申请发明人仔细研究了滤光元件破裂的机理，发现其破裂主要由以下几个方面的原因造成。
首先，在摄像模组中，滤光元件通常安装于支架上。通常，该支架包括支架主体和自支架主体向内延伸的悬臂梁，所述滤光元件安装于该悬臂梁上。作用于滤光元件的应力主要有两个部分：第一部分来自支架自身产生的应力，第二部分来自其他部件通过支架传递到滤光元件的应力。
针对于第一部分应力，本领域普通技术人员应知晓，支架通常由塑料材料制成，在温度变化较差的情况下，支架会发生涨缩而产生作用于滤光元件的应力。
针对于第二部分应力，本领域普通技术人员应知晓，在摄像模组的组装结构中，用于支撑滤光元件的支架还可能与其他部件之间具有结构关系，例如，在一些摄像模组中，会将马达或者镜头安装于该支架；在一些摄像模组中，支架的外侧还贴附有用于包覆摄像模组的金属外罩等，这些部件受外力作用下会通过支架将应力传递给滤光元件。并且，由于支架通常由塑料材料制成且具有一定的厚度，其形变能力相对较弱，因此，在传递应力的过程中，应力也不能通过支架的形变得到释放。也就是说，现有的支架无法降低传递到滤光元件的应力。
进一步地，本申请发明人发现，滤光元件的四个转角区域是最容易发生破裂的区域。究其原因不难发现：滤光元件的转角区域对应于悬臂梁的四个转角区域，即，两条相邻的悬臂的交叉处，这里更容易发生应力集中的现象，导致滤光元件的四个转角区域在应力集中的作用下发生破损。
针对上述技术问题，本申请的基本构思是通过将用于支持滤光元件的支架部分做薄，以降低作用于所述滤光元件的应力，防止其因受不当应力而损坏。并且，降低作用于滤光元件的应力的机理包括两个层面：第一，减薄支架有利于降低支架因自身形变而作用于滤光元件的应力；第二，减薄支架有利于增强支架的柔韧性，从而在传递应力的过程中能更多地吸收部分应力，以相对减小作用于滤光元件的应力。
基于此，本申请提出了一种感光组件，包括线路板、电连接于所述线路板的感光芯片、保持于所述感光芯片的感光路径上的滤光元件，以及，用于安装所述滤光元件以使得其被保持于所述感光芯片的感光路径上的支架，所述支架包括支架主体和自所述支架主体向内延伸的悬持部，所述悬持部安装所述滤光元件，其中，至少一凹槽凹陷地形成于所述悬持部，以通过所述至少一凹槽降低作用于所述滤光元件的应力。这样，通过将用于支持滤光元件的支架部分做薄，以降低作用于所述滤光元件的应力，防止其因受不当应力而损坏。
在介绍本申请的基本原理之后，下面将参考附图来具体介绍本申请的各种非限制性实施例。
示例性摄像模组及其感光组件
如图1所示，基于本申请实施例的摄像模组被阐明，其中，所述摄像模组包括感光组件710和保持于其感光路径上的光学镜头720。如图1所示，在本申请实施例中，所述感光组件710包括线路板711、电连接于所述线路板711的感光芯片712、电连接于所述线路板711的至少一电子元器件713、设置于所述线路板711上的支架714和安装于所述支架714并对应于所述感光芯片712的感光路径的滤光元件715。
在本申请实施例中，所述线路板711的类型并不为本申请所局限，其包括但不限于软板、硬板、软硬结合板、陶瓷基板等。设置于所述线路板711的至少一电子元器件713，其包括但不限于电阻、电容、电感等。在安装过 程中，所述电子元器件713可通过SMT工艺(Surface Mounted Technology,表面贴装工艺)贴装并电连接于所述线路板711的上表面。当然，本领域普通技术人员应知晓，所述电子元器件713设置于所述线路板711的方式和位置并不为本申请所局限，例如，所述电子元器件713可部分内埋或全部内埋于所述线路板711。
如图1所示，在本申请实施例中，所述感光芯片712通过引线716电连接于所述线路板711，所述引线716的类型并不为本申请所局限，例如，所述引线716可以是金线、银线、铜线。并且，所述引线716可通过“打金线”的工艺安装于所述线路板711和所述感光芯片712之间，以用于实现两者之间的电连接。具体来说，“打金线”工艺一般分为两种类型：“正打金线”工艺和“反打金线”工艺。“正打金线”工艺指的是在布设所述引线716的过程中，首先在所述线路板711的导电端上形成所述引线716的一端，进而弯曲地延伸所述引线716，并最终在所述感光芯片712的导电端上形成所述引线716的另一端，通过这样的方式，在所述感光芯片712和所述线路板711之间形成所述引线716。“反打金线”工艺指的是在布设所述引线716的过程中，首先在所述感光芯片712的导电端上形成所述引线716的一端，进而弯曲地延伸所述引线716，并最终在所述线路板711的导电端上形成所述引线716的另一端，通过这样的方式，在所述感光芯片712和所述线路板711之间形成所述引线716。值得一提的是，通过“反打金线”工艺所形成的所述引线716向上突起的高度相对“正打金线”工艺所形成的所述引线716向上突起的高度，因此，优选地，在该具体实施中，采用“反打金线”工艺形成所述引线716。
当然，本领域的技术人员应知晓，在本申请实施例的其他示例中，所述感光芯片712和所述线路板711可通过其他方式进行导通(可不采用所述引线716)，例如，采用背部导通的电导通方案，对此，并不为本申请所局限。
如图1所示，在本申请实施例中，所述支架714为预制成型的支架714，其可通过COB(Chip on Board)工艺贴附于所述线路板711的相应位置。特别地，在本申请实施中，所述光学镜头720同样安装于所述支架714上。也就是说，在本申请实施例中，用于支撑所述光学镜头720的支撑结构和用于支撑所述滤光元件715的支撑结构同为所述支架714，即，所述支架714为一体式支架。
如前所述，随着感光芯片712的尺寸逐步提升，与所述感光芯片712匹配的滤光元件715尺寸也相应地需增加。滤光元件715为敏感且脆弱的元器件，随着尺寸的增加，其敏感性和脆弱度将进一步增加。在实际产业应用中，已出现滤光元件715破裂的现象。特别地，在本申请实施例中，通过将用于支持所述滤光元件715的所述支架714部分做薄，以降低作用于所述滤光元件715的应力，防止其因受不当应力而损坏。
具体来说，如图2所示，在本申请实施例中，所述支架714包括支架主体7141和自所述支架主体7141向内延伸的悬持部7142，其中，所述悬持部7142的外侧周缘形成对应于所述感光芯片712的光窗7140，这样，当所述滤光元件715安装于所述支架714的所述悬持部7142时，由所述光学镜头720采集的成像光线在被所述滤光元件715过滤后能穿过所述光窗7140并抵达所述感光芯片712。特别地，在本申请实施中，所述悬持部7142悬持地自所述支架主体7141的内侧面往外延伸，其中，所述悬持部7142的上表面和所述支架主体7141的上表面之间具有一定间距，优选地，该间距大于或近乎等于所述滤光元件715的厚度尺寸，这样，当所述滤光元件715安装于所述支架714的所述悬持部7142时，所述滤光元件715的上表面低于所述支架主体7141的上表面或近乎与所述支架主体7141的上表面齐平，以保护所述滤光元件715避免其发生不必要的碰撞。
特别地，在本申请实施例中，所述支架714的所述悬持部7142被部分做薄，以降低作用于所述滤光元件715的应力，防止其因受不当应力而损坏。具体来说，如图2所示，在本申请实施例中，所述支架714具有凹陷的形成于所述悬持部7142的至少一凹槽71420，以通过所述至少一凹槽71420将所述悬持部7142的对应部分减薄，通过这样的方式，降低作用于所述滤光元件715的应力。也就是说，在本申请实施例中，所述支架714被减薄的部分设置于所述悬持部7142。应可以理解，通过在所述悬持部7142上设置所述至少一凹槽71420将所述悬持部7142做薄，一方面，在一定的收缩率的前提下，所述悬持部7142在相同温度变化下的收缩量可以减小，通过这样的方式，能够减小所述悬持部7142因自身形变而作用于所述滤光元件715的应力；另一方面，部分减薄后的所述悬持部7142的柔韧性相对被增强，从而在外界应力通过所述悬持部7142传递并作用于所述滤光元件715的过程中，所述悬持部7142能通过自身形变吸收相对更多的应力，从而相对地减 小作用于所述滤光元件715的应力，以防止所述滤光元件715破损。
特别地，如图2所示，在本申请实施例中，所述凹槽71420凹陷地形成于所述悬持部7142的下表面，并且，所述滤光元件715安装于所述悬持部7142上表面的位置对应于所述凹槽71420。应可以理解，通过所述凹槽71420这样的位置设定，所述悬持部7142用于支持所述滤光元件715的部分被减薄，以使得在发生相同温度发生的情况下，所述悬持部7142用于支撑所述滤光元件715的部分的收缩量相对变小，从而能够减小所述悬持部7142因自身形变而作用于所述滤光元件715的应力。
另一方面，当其他部件(例如，安装于所述支架714的所述光学镜头720、包覆所述摄像模组外侧的金属外罩等)对所述支架714产生作用力时，该应力在通过所述支架主体7141和所述悬持部7142传递并作用于所述滤光元件715的过程中，减薄的所述悬持部7142能产生相对更大的形变量以更多地吸收该应力，从而传递并作用于所述滤光元件715的应力能相对较少。特别地，在本申请实施例中，所述悬持部7142于所述凹槽71420处的厚度为0.05mm-0.1mm，所述悬持部7142中除所述凹槽71420之外的其他部分的厚度为0.18mm-0.2mm，也就是说，具有所述凹槽71420的所述悬持部7142的对应部分的厚度为0.05mm-0.1mm，所述悬持部7142在除所述凹槽71420对应部分之外的其他部分的厚度为0.18mm-0.2mm。
特别地，如图3和图4所示，在本申请实施例中，所述凹槽71420凹陷地形成于所述悬持部7142的转角区域71424，也就是说，在本申请实施例中，所述悬持部7142被减薄的部分设置于其转角区域71424。本领域普通技术人员应知晓，通常所述支架714具有对称结构，因此，所述支架714作用于所述滤光元件715的应力和藉由所述支架714传递并作用于所述滤光元件715的应力具有对称性，并且，在所述滤光元件715的转角区域71424容易发生应力集中的现象。
相应地，通过在所述悬持部7142的转角区域71424设置所述凹槽71420，所述支架714形变产生的应力以及藉由所述支架714传递并作用于所述滤光元件715的应力能够在所述悬持部7142的转角区域71424被释放，以避免应力在所述滤光元件715的转角区域71424集中并且能够相对地减少作用于所述滤光元件715的应力，以降低所述滤光元件715破损的风险。并且，如图2所示，在本申请实施例中，所述凹槽71420延伸至所述悬持部7142的 内侧边缘71422，以形成边缘槽。这里，在本申请实施例中，所述悬持部7142的内侧边缘71422表示所述悬持部7142邻近所述支架主体7141的边缘，而所述悬持部7142的外侧边缘71421表示所述悬持部7142远离所述支架主体7141的边缘。
图5图示了根据本申请实施例的所述支架714的一种变形示例的示意图。如图5所示，在该变形实施中，所述凹槽71420同样凹陷地形成于所述悬持部7142的下表面，但与图2至图4所示意的实施例区别在于：所述凹槽71420延伸于所述悬持部7142的内侧边缘71422和外侧边缘71421之间，以形成收容槽。
图6图示了根据本申请实施例的所述支架714的另一种变形实施的示意图。如图6所示，在该变形实施中，所述凹槽71420凹陷地形成于所述悬持部7142的上表面，并且所述凹槽71420延伸至所述悬持部7142的外侧边缘71421，以形成边缘槽。特别地，在该变形实施中，所述滤光元件715安装于所述边缘槽，也就是说，在该变形实施中，所述滤光元件715安装于所述悬持部7142的位置设置于所述凹槽71420内，这样，当所述滤光元件715安装于所述边缘槽时，所述滤光元件715的上表面更低于所述支架主体7141的上表面，以保护所述滤光元件715发生不必要的碰撞。
图7图示了根据本申请实施例的所述支架714的又一种变形实施例的示意图，其中，图7所示意的所述支架714为图6所示意的所述支架714的一种变形实施。如图7所示，在该变形实施中，所述凹槽71420同样凹陷地形成于所述悬持部7142的上表面，但与图6所示的所述支架714不同之处在于：所述凹槽71420延伸于所述悬持部7142的内侧边缘71422和外侧边缘71421之间，以形成收容槽。
本领域普通技术人员应知晓，所述滤光元件715通过黏着剂717贴附于所述支架714的所述悬持部7142。相应地，在该变形实施中，所述收容槽的存在为施加所述黏着剂717提供空间和便利。如图7所示，在该变形实施中，所述黏着剂717施加于所述收容槽内并且有一部分黏着剂717溢出所述收容槽，以将所述滤光元件715贴附于所述收容槽的附近区域。优选地，在该变形实施例中，所述黏着剂717具有一定的柔韧性，以被配置为吸收作用于所述滤光元件715的应力。这里，所述黏着剂717具有一定的柔韧性表示所述黏着剂717具有一定的柔软度和变形能力，以能够吸收应力起到缓冲吸震的 作用。
值得一提的是，不仅在如图7所示的变形实施例中，所述黏着剂717优选地具有一定的柔韧性，此技术特征在其他实施例中，同样为优选方案，对此，本领域普通技术人员应可以理解。
图8图示了根据本申请实施例的所述支架714的又一种变形实施的示意图。如图8所示，在该变形实施中，所述凹槽71420进一步凹陷地形成于所述悬持部7142的边71423。应可以理解，所述悬持部7142具有边71423和在边71423与边71423交界处形成的转角区域71424。也就是说，在本该变形实施例中，所述凹槽71420的设置范围被扩展。具体地，在该变形实施中，所述凹槽71420的设置范围进一步包括所述悬持部7142的一对对称边71423。
图9图示了根据本申请实施例的所述支架714的又一种变形实施的示意图，其中，图9所示的支架714为图8所示意的支架714的变形实施。如图9所示，在该变形实施中，所述凹槽71420的设置范围进一步被扩展。具体地，在该变形实施中，所述凹槽71420的设置范围进一步包括所述悬持部7142的所有边71423。应可以理解，图8和图9示意的是所述凹槽71420的设置范围的扩展，在具体实施中，其扩展范围和区域可做调整，例如，仅包括所述悬持部7142的三条边71423，对此，并不为本申请所局限。
图10图示了根据本申请实施例的所述摄像模组的一种变形实施的示意图。如图10所示，在该变形实施中，所述感光组件710进一步包括设置于所述线路板711的基座718，其中，所述支架714安装于所述基座718。也就是说，相较于图1至图9所示意的摄像模组，在该变形实施中，所述支架714的设置位置做出了调整。具体来说，如图10所示，在该变形实施中，所述基座718通过MOB(Molding on Board)工艺形成于所述线路板711，并包覆所述线路板711的至少一部分和所述电子元器件713的至少一部分，所述支架714安装于所述基座718的上表面，其中，所述支架714的所述支架主体7141用于承载光学镜头720，所述支架714的所述悬持部7142用于安装所述滤光元件715。值得一提的是，在本该变形实施中，所述基座718形成于所述线路板711的位置和方式并不为本申请所局限，例如，在如图11所示意的例子中，所述基座718通过MOC(Molding on Chip)工艺形成于所述线路板711，并包覆所述线路板711的至少一部分、所述电子元器件713的至少一部分和所述感光芯片712的非感光区域的至少一部分(在所述感光 芯片712通过所述引线716连接于所述线路板711的情况下，所述基座718还可以进一步包覆所述引线716)，对此，并不为本申请所局限。
值得一提的是，虽然在如图1至图11所示的实施例中，以所述支架714具有对称结构为示例，本领域普通技术人员应知晓，由于所述线路板711的电子设计空间是有限的，会导致所述电子元器件713在所述线路板711的分布不均匀(例如，电阻、电容集中于所述线路板711的某一侧)，这样会导致所述支架714不具有对称结构。例如，在如图12所示的所述摄像模组的一种变形实施中，所述摄像模组中所述支架不具有对称结构。相应地，在所述支架714不具有对称结构的情况下，由于所述支架714自身形变而产生的作用于所述滤光元件715的应力和通过所述支架714传递给所述滤光元件715的应力会呈现出不对称的情况，更容易导致所述滤光元件715的破损。在这种情况下，通过将所述支架714的部分做薄，也能够降低所述支架714因其自身结构的不对称性而导致作用于所述滤光元件715不对称的应力，以防止所述滤光元件715破损。
综上基于本申请实施例的摄像模组被阐明，其中所述摄像模组中用于支持滤光元件715的支架714被部分减薄，以降低作用于所述滤光元件715的应力，防止其因受不当应力而损坏。
值得一提的是，虽然以上以所述摄像模组被实施为定焦摄像模组为示例，本领域普通技术人员应可以理解，在本申请其他示例中，所述摄像模组还可以包括动焦摄像模组或者光学防抖摄像模组。
相应地，当所述摄像模组被实施为动焦摄像模组时，所述摄像模组进一步包括驱动元件，其中，所述驱动元件安装于所述支架714的上表面或所述基座718的上表面，所述光学镜头720安装于所述驱动元件，以使得所述光学镜头720被保持于所述感光组件710的感光路径。
相应地，当所述摄像模组被实施为光学防抖摄像模组时，所述摄像模组进一步包括防抖马达，其中，所述防抖马达安装于所述支架714的上表面或所述基座718的上表面，所述光学镜头720安装于所述防抖马达，以使得所述光学镜头720被保持于所述感光组件710的感光路径。
并且，虽然以上以所述摄像模组被实施为单摄摄像模组为示例，本领域普通技术人员应可以理解，本申请所揭露的将所述支架714部分减薄的技术方案和精神同样能够应用于阵列摄像模组，例如，被实施为图13示意的双 摄摄像模组7100。
申请概述
如上所述，随着感光芯片的尺寸逐步提升，与所述感光芯片匹配的滤光元件尺寸也相应地需增加。滤光元件为敏感且脆弱的元器件，随着尺寸的增加，其敏感性和脆弱度将进一步增加。在实际产业应用中，已出现滤光元件破裂的现象。本申请发明人仔细研究了滤光元件破裂的机理，发现其破裂主要由以下几个方面的原因造成。
首先，在摄像模组中，滤光元件通常安装于支架上。通常，该支架包括支架主体和自支架主体向内延伸的悬臂梁，所述滤光元件安装于该悬臂梁上。作用于滤光元件的应力主要有两个部分：第一部分来自支架自身产生的应力，第二部分来自其他部件通过支架传递到滤光元件的应力。
针对于第一部分应力，本申请发明人发现支架通常由塑料材料制成，在温度变化较大的情况下，支架会发生胀缩而产生作用于滤光元件的应力。有一些厂商选择缩减支架的厚度尺寸的方案来缩减第一部分应力的影响，但缩减支架的厚度尺寸会导致支架的整体支撑强度不足，尤其是，当该支架还同时用于支撑光学镜头或马达时。
本申请发明人进一步发现，在现有的摄像模组中，支架和滤光元件之间的热膨胀系数相差较大(通常超过±20ppm)，这样，在温度发生变化时，支架和滤光元件支架发生的相对胀缩量相对较大，以产生较大的应力，导致滤光元件发生破损。
针对于第二部分应力，本申请发明人发现在摄像模组的组装结构中，用于支撑滤光元件的支架还可能与其他部件之间具有结构关系，例如，在一些摄像模组中，会将马达或者镜头安装于该支架；在一些摄像模组中，支架的外侧还贴附有用于包覆摄像模组的金属外罩等，这些部件受外力作用下会通过支架将应力传递给滤光元件。并且，由于支架通常由塑料材料制成且具有一定的厚度，其形变能力相对较弱，因此，在传递应力的过程中，应力也不能通过支架的形变得到释放。也就是说，现有的支架无法降低传递到滤光元件的应力。
其次，现有的支架通常由塑料材料制成(例如，由模塑材料制成，其中，模塑材料包括但不限于环氧树脂等)，其成型后的表面精度不高。也就是说， 用于安装滤光元件的支架表面具有较高的粗糙度，这一方面会影响滤光元件安装的平整度，另一方面，也会增大滤光元件和支架表面之间的应力大小，而导致滤光元件更容易破损。
针对上述技术问题，本申请的基本构思是通过封装材料一体结合金属内嵌件以形成新型的支架结构，其中，所述金属内嵌件中裸露于外界的部分用于支撑所述滤光元件于其上。这样，所述支架能够在整体支撑强度、安装平整度和降低应力等方面取得较优的综合性能。
具体来说，具有上述结构配置的所述支架能够降低作用于滤光元件的应力的机理包括如下几个层面：第一，用于安装滤光元件的所述支架的悬持部由金属材料制成，其具有相对更小的热膨胀系数，从而在发生相同温度变化的前提下，所述悬持部发生的张缩量也相对较小，以降低所述支架自身作用于所述滤光元件的应力；第二，用于安装滤光元件的所述支架的悬持部由金属材料制成，其与滤光元件之间的热膨胀系数相对较为接近，从而在发生相同温度变化的前提下，产生在所述滤光元件和所述悬持部之间的应力相对能够减小；第三，相较于现有的支架，由所述金属内嵌件形成的所述悬持部具有相对更高的平整度，从而提升所述滤光元件的安装平整度，其中，安装平整度的增加可以使得应力分布相对更为均匀，减少应力集中现象的发生，从而降低了所述滤光元件破损的可能性。
基于此，本申请提出了一种感光组件，其包括线路板、电连接于所述线路板的感光芯片、保持于所述感光芯片的感光路径上的滤光元件，以及，用于安装所述滤光元件以使得其被保持于所述感光芯片的感光路径上的支架，所述支架包括金属内嵌件和包覆所述金属内嵌件的至少一部分的封装部，所述金属内嵌件中裸露于外界的部分自所述封装部向内且横向地延伸以形成悬持部，其中，所述滤光元件安装于所述悬持部。这样，所述支架通过封装材料一体结合金属内嵌件，以使得所述支架能够在整体支撑强度、安装平整度和降低应力等方面取得较优的综合性能。
在介绍本申请的基本原理之后，下面将参考附图来具体介绍本申请的各种非限制性实施例。
示例性摄像模组
如图14所示，基于本申请实施例的摄像模组被阐明，其中，所述摄像 模组包括感光组件810和保持于其感光路径上的光学镜头820。如图14所示，在本申请实施例中，所述感光组件810包括线路板811、电连接于所述线路板811的感光芯片812、电连接于所述线路板811的至少一电子元器件813、设置于所述线路板811上的支架814和安装于所述支架814并对应于所述感光芯片812的感光路径的滤光元件815。
在本申请实施例中，所述线路板811的类型并不为本申请所局限，其包括但不限于软板、硬板、软硬结合板、陶瓷基板等。设置于所述线路板811的至少一电子元器件813，其包括但不限于电阻、电容、电感等。在安装过程中，所述电子元器件813可通过SMT工艺(Surface Mounting Techique,表面贴装工艺)贴装并电连接于所述线路板811的上表面。当然，本领域普通技术人员应知晓，所述电子元器件813设置于所述线路板811的方式和位置并不为本申请所局限，例如，所述电子元器件813可部分内埋或全部内埋于所述线路板811。
如图14所示，在本申请实施例中，所述感光芯片812通过引线816电连接于所述线路板811，所述引线816的类型并不为本申请所局限，例如，所述引线816可以是金线、银线、铜线。并且，所述引线816可通过“打金线”的工艺安装于所述线路板811和所述感光芯片812之间，以用于实现两者之间的电连接。具体来说，“打金线”工艺一般分为两种类型：“正打金线”工艺和“反打金线”工艺。“正打金线”工艺指的是在布设所述引线816的过程中，首先在所述线路板811的导电端上形成所述引线816的一端，进而弯曲地延伸所述引线816，并最终在所述感光芯片812的导电端上形成所述引线816的另一端，通过这样的方式，在所述感光芯片812和所述线路板811之间形成所述引线816。“反打金线”工艺指的是在布设所述引线816的过程中，首先在所述感光芯片812的导电端上形成所述引线816的一端，进而弯曲地延伸所述引线816，并最终在所述线路板811的导电端上形成所述引线816的另一端，通过这样的方式，在所述感光芯片812和所述线路板811之间形成所述引线816。值得一提的是，通过“反打金线”工艺所形成的所述引线816向上突起的高度相对“正打金线”工艺所形成的所述引线816向上突起的高度低，因此，优选地，在该具体实施中，采用“反打金线”工艺形成所述引线816。
当然，本领域的技术人员应知晓，在本申请实施例的其他示例中，所述 感光芯片812和所述线路板811可通过其他方式进行导通(可不采用所述引线816)，例如，采用背部导通的电导通方案，对此，并不为本申请所局限。
如图14所示，在本申请实施例中，所述支架814为预制成型的支架814，其可通过COB(Chip on Board)工艺贴附于所述线路板811的相应位置。特别地，在本申请实施中，所述光学镜头820同样安装于所述支架814上。也就是说，在本申请实施例中，用于支撑所述光学镜头820的支撑结构和用于支撑所述滤光元件815的支撑结构同为所述支架814，即，所述支架814为一体式支架。
如前所述，随着感光芯片的尺寸逐步提升，与所述感光芯片匹配的滤光元件尺寸也需相应地增加，导致滤光元件的敏感性和脆弱度进一步增加。在实际产业应用中，已出现滤光元件破裂的现象。
针对上述技术问题，在本申请实施例中，对所述支架814的结构配置进行优化，以使得所述支架814能够在整体支撑强度、安装平整度和降低应力等方面取得较优的综合性能。
具体来说，如图15所示，在本申请实施例中，所述支架814包括金属内嵌件8142和以包覆所述金属内嵌件8142的至少一部分的方式一体结合于所述金属内嵌件8142的封装部8141，其中，金属内嵌件8142中裸露于外界的部分自所述封装部8141向内且横向地延伸以形成悬持部81420，所述悬持部81420被配置为安装所述滤光元件815于其上。也就是说，在本申请实施例中，用于安装并制成所述滤光元件815的所述悬持部81420由金属材料制成。如图15所示，在本申请实施例中，所述悬持部81420的内侧周缘形成对应于所述感光芯片812的光窗，这样，当所述滤光元件815安装于所述支架814的所述悬持部81420时，由所述光学镜头820采集的成像光线在被所述滤光元件815过滤后能穿过所述光窗并抵达所述感光芯片812。
本领域普通技术人员应可以理解，相较于现有的支架814，由所述金属内嵌件8142形成的所述悬持部81420具有相对更高的平整度，从而提升所述滤光元件815的安装平整度。应可以理解，当所述滤光元件815的安装平整度提高后，所述滤光元件815能够更为平整地且紧密地贴附于所述悬持部81420的上表面，从而所述滤光元件815与所述悬持部81420之间的摩擦系数能够降低，以降低应力传递的能力。进一步地，安装平整度的增加可以使得应力分布相对更为均匀，减少应力集中现象的发生，从而降低了所述滤光 元件815破损的可能性。
并且，由于所述金属内嵌件8142的热膨胀系数小于封装材料的热膨胀系数，因此，当发生相同温度变化时，由所述金属内嵌件8142形成的所述悬持部81420发生相对更小的形变量，以降低所述支架814作用于所述滤光元件815的应力，从而起到防止所述滤光元件815破损的目的。并且，相较于现有的支架814和滤光元件815，在本申请实施例中，所述金属内嵌件8142的热膨胀系数与所述滤光元件815的热膨胀系数之间相对较为接近，从而在发生相同温度变化的前提下，产生在所述滤光元件815和所述悬持部81420之间的应力相对能够减小，从而降低了所述滤光元件815破损的可能性。
具体来说，在本申请实施例中，所述金属内嵌件8142的热膨胀系数的范围为10ppm-20ppm，所述滤光元件815的热膨胀系数为小于10ppm，并且，所述金属内嵌件8142(尤其是所述悬持部81420)和所述滤光元件815之间的热膨胀系数之差的范围小于±15。例如，在本申请实施例中，所述金属内嵌件8142被实施为SUS316，其热膨胀系数为16ppm，所述滤光元件815的热膨胀系数为7.82，两者之间为8.88。当然，在本申请其他示例中，所述金属内嵌件8142也可以由其他金属材料、金属与非金属合金材料或金属与金属合金材料制成，对此，并不为本申请所局限。
还有，由所述金属内嵌件8142形成的所述悬持部81420具有相对较高的强度，因此，在满足强度要求的前提下所述悬持部81420的厚度尺寸可以缩减。特别地，在本申请实施例中，所述悬持部81420的厚度尺寸为0.08-0.15mm。
进一步地，如图15所示，在本申请实施例中，所述悬持部81420悬挂地自所述封装部8141的侧部往外延伸，其中，所述悬持部81420的上表面和所述封装部8141的上表面之间具有一定间距。也就是说，在本申请实施例中，所述封装部8141高于由所述金属内嵌件8142形成的所述悬持部81420，通过这样的结构配置，有利于防止所述感光组件810在移动过程中，所述滤光元件815被意外撞击到而导致破碎。优选地，在本申请实施例中，所述封装部8141的上表面和所述悬持部81420的上表面之间的间距大于或近乎等于所述滤光元件815的厚度尺寸，这样，当所述滤光元件815安装于所述支架814的所述悬持部81420时，所述滤光元件815的上表面低于所述支架814主体的上表面或近乎与所述支架814主体的上表面齐平，以保护所述滤光元 件815避免其发生不必要的碰撞。
值得一提的是，在如图14所示意的实施例中，所述支架814为一体式支架，其同时用于支撑所述光学镜头820和所述滤光元件815。应可以理解，由于所述光学镜头820安装于所述支架814上，因此，所述支架814应具有一定的结构强度。在现有技术中，通常通过增加支架814的厚度来增强其结构强度，然而，当厚度尺寸增加后，在相同温度变化下支架814将发生更大的形变量而产生更大的应力于滤光元件815，导致滤光元件815更容易破坏。也就是说，在现有的一体式支架814中，其厚度尺寸是一个矛盾的物理参数。然而，在本申请实施例中，所述支架814通过内嵌的所述金属内嵌件8142，提高其整体结构强度，通过这样的方式，所述支架814能够在保持现有的尺寸配置的前提下(甚至可以做得更小)，拥有满意的结构强度。
更具体地说，如图14至如图19所示，在本申请实施例中，所述金属内嵌件8142包括内嵌框体8143，在注塑成型后，所述内嵌框体8143的一部分裸露于外界以形成所述悬持部81420，所述内嵌框体8143的另一部分被包覆且延伸于所述封装部8141内。进一步地，所述金属内嵌件8142进一步包括自所述内嵌框体8143向外横向延伸的加强件8144，所述加强件8144被包覆且延伸于所述封装部8141内，应可以理解，被包覆且延伸于所述封装部8141内的所述加强件8144能够进一步增强所述支架814整体结构强度。特别地，在本申请实施例中，所述加强件8144可被设置于所述内嵌框体8143的一侧、相邻的两侧、对称的两侧、三侧或者所有侧，也就是说，在本申请实施例中，所述加强件8144的设置位置并不为本申请所局限。并且，在本申请实施例中，所述加强件8144的形状也并不为本申请所局限，例如，所述加强件8144可包括具有条状结构的加强条、具有“山”字结构的加强框等。
为了便于从所述悬持部81420上取出所述滤光元件815，如图14至图18所示，在本申请实施例中，所述支架814的所述封装部8141具有凹陷地形成于其上表面且连通于所述悬持部81420的凹槽8145。特别地，在本申请实施例中，所述凹槽8145具有椭圆状并自所述封装部8141的上表面凹陷地且向斜向下地延伸到所述悬持部81420，以便于拾取出所述滤光元件815。应可以理解，在本申请其他示例中，所述凹槽8145能够被实施为其他形状的凹槽8145，对此，并不本申请所局限。
值得一提的是，在具体实施中，所述金属内嵌件8142可通过注塑工艺 一体结合于所述封装部8141以形成所述支架814。在制备过程中，首先将所述金属内嵌件8142放置于成型模具的成型腔中，例如，通过顶针顶住放平所述金属内嵌件8142；然后，将成型材料填充于所述成型腔中，然后冷固化所述成型材料以形成所述封装部8141。
图20图示了根据本申请实施例的所述摄像模组的一种变形实施的示意图。如图20所示，在该变形实施中，所述感光组件810进一步包括设置于所述线路板811的基座817，其中，所述支架814安装于所述基座817。也就是说，相较于图14至图19所示意的摄像模组，在该变形实施中，所述支架814的设置位置做出了调整。具体来说，如图20所示，在该变形实施中，所述基座817通过MOB(Molding on Board)工艺形成于所述线路板811，并包覆所述线路板811的至少一部分和所述电子元器件813的至少一部分，所述支架814安装于所述基座817的上表面。图21图示了根据本申请实施例的所述摄像模组的一种变形实施的示意图。如图21所示，在该变形实施中，所述感光组件810进一步包括设置于所述线路板811的基座817，所述基座817通过MOB(Molding on Board)工艺形成于所述线路板811，并包覆所述线路板811的至少一部分和所述电子元器件813的至少一部分，所述支架814安装于所述基座817的上表面。与图20所示意的所述摄像模组不同的是，在图21所示意的变形实施例中，其中，所述光学镜头820安装于所述基座817，所述滤光元件815安装于所述支架814的所述悬持部81420。
值得一提的是，在如图20和图21所示意的变形实施例中，所述基座817形成于所述线路板811的位置和方式并不为本申请所局限，例如，在如图22所示意的例子中，所述基座817通过MOC(Molding on Chip)工艺形成于所述线路板811，并包覆所述线路板811的至少一部分、所述电子元器件813的至少一部分和所述感光芯片812的非感光区域的至少一部分(在所述感光芯片812通过所述引线816连接于所述线路板811的情况下，所述基座817还可以进一步包覆所述引线816)，对此，并不为本申请所局限。
图23图示了根据本申请实施例的所述摄像模组的又一种变形实施。如图23所示，在该变形实施例中，所述支架814设置于所述感光芯片812的非感光区域，所述感光组件810进一步包括设置于所述线路板811的基座817，其中，所述光学镜头820安装于所述基座817。
值得一提的是，虽然在如图14至图23所示的实施例中，以所述支架814 具有对称结构为示例，本领域普通技术人员应知晓，在一些摄像模组中，基于特定的场景需求，会调整所述电子元器件813在所述线路板811的布设模式，相应地，在这些场景中，所述支架814在整体形状上会呈现出不对称的样态。例如，当所述摄像模组作为前置摄像模组被应用于终端设备(例如智能手机)时，为了提高终端设备的屏幕占比，会将所述至少一电子元器件813集中于所述线路板811的某一侧。再如，在如图24所示意的摄像模组中，所述摄像模组进一步包括设置于所述感光组件810和所述光学镜头820之间的且用于承载所述光学镜头820移动的驱动元件830。相应地，当所述驱动元件830的引脚831较多时，为了避让所述驱动元件830的所述引脚831，所述支架814中至少一侧向内收缩以在所述支架814和所述线路板811之间形成避让空间，以允许所述引脚831穿过并电连接于所述线路板811。图24图示了根据本申请实施例的所述摄像模组的又一种变形实施的示意图。如图24所示，在该示例中，所述支架814具有不对称的形状。值得一提的是，在如图24所示的摄像模组中，所述驱动元件830包括但限于动焦马达(即，所述摄像模组为动焦摄像模组)，光学防抖马达(即，所述摄像模组被实施为光学防抖马达)等。
综上基于本申请实施例的摄像模组被阐明，其中所述摄像模组中的用于支持滤光元件815的支架814由封装材料一体结合并包覆金属内嵌件8142形成，以使得所述支架814能够在整体支撑强度、安装平整度和降低应力等方面取得较优的综合性能。
值得一提的是，虽然以上以所述摄像模组被实施为单摄摄像模组为示例，本领域普通技术人员应可以理解，本申请所揭露的将所述支架814部分减薄的技术方案和思想同样能够应用于阵列摄像模组，例如，被实施为图25示意的双摄摄像模组8100。
示意性支架
根据本申请另一方面，还提供一种用于支撑滤光元件815的支架814。如图15至图19所示，所述支架814包括金属内嵌件8142和以包覆所述金属内嵌件8142的至少一部分的方式一体结合于所述金属内嵌件8142的封装部8141，其中，所述金属内嵌件8142中裸露于外界的部分自所述封装部8141向内且横向地延伸以形成悬持部81420，其中，所述悬持部81420被配置为 安装所述滤光元件815于其上。
在一个示例中，在上述支架814中，所述金属内嵌件8142包括内嵌框体8143，所述内嵌框体8143的一部分裸露于外界以形成所述悬持部81420，所述内嵌框体8143的另一部分被包覆且延伸于所述封装部8141内。
在一个示例中，在上述支架814中，所述金属内嵌件8142进一步包括自所述内嵌框体8143向外横向延伸的加强件8144，所述加强件8144被包覆且延伸于所述封装部8141内。
在一个示例中，在上述支架814中，所述封装部8141的上表面高于所述悬持部81420的上表面。
在一个示例中，在上述支架814中，所述封装部8141的上表面与所述悬持部81420的上表面之间的间距大于或等于所述滤光元件815的厚度尺寸。
在一个示例中，在上述支架814中，所述封装部具有凹陷地形成于其上表面且连通于所述悬持部81420的凹槽8145。
在一个示例中，在上述支架814中，所述金属内嵌件8142中所述悬持部81420的厚度尺寸为0.08-0.15mm。
综上，基于本申请实施例的支架814被阐明，其通过封装材料一体结合金属内嵌件8142，以使得所述支架814能够在整体支撑强度、安装平整度和降低应力等方面取得较优的综合性能。
示意性支架制备方法
根据本申请又一方面，还提供一种支架制备方法，其包括步骤：S110,将金属内嵌件8142放置于由成型模具形成的成型腔内；S120，填充成型材料于所述成型腔；以及，S130，固化所述成型材料，其中，所述成型材料固化后形成包覆所述金属内嵌件8142的至少一部分的封装部8141，并且，所述金属内嵌件8142中裸露于外界的部分自所述封装部8141向内且横向地延伸以形成悬持部81420，所述悬持部81420被配置为安装所述滤光元件815于其上。
具体来说，在步骤S110中，可通过顶针顶住放平所述金属内嵌件8142于所述成型腔中。在步骤S130中，固化所述成型材料的方式为冷固化，即通过降低温度来固化所述成型材料。
综上，基于本申请实施例的所述支架制备方法被阐明，其能够制备如上 所述的支架814。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (36)

  1. 一种感光组件，其特征在于，包括：
    线路板；
    感光芯片，电连接于所述线路板；
    滤光元件，保持于所述感光芯片的感光路径上；以及
    支架，用于安装所述滤光元件以使得所述滤光元件被保持于所述感光芯片的感光路径上，所述支架包括支架主体和自所述支架主体向内延伸的悬持部，所述悬持部用于安装所述滤光元件，其中，至少一凹槽形成于所述悬持部。
  2. 根据权利要求1所述的感光组件，其中，所述凹槽凹陷地形成于所述悬持部的上表面，所述滤光元件安装于所述凹槽。
  3. 根据权利要求1所述的感光组件，其中，所述凹槽凹陷地形成于所述悬持部的下表面，所述滤光元件安装于所述悬持部上表面的位置对应于所述凹槽。
  4. 根据权利要求2或3所述的感光组件，其中，所述凹槽凹陷地形成于所述悬持部的转角区域。
  5. 根据权利要求4所述的感光组件，其中，所述凹槽延伸至所述悬持部的外侧边缘，以形成边缘槽。
  6. 根据权利要求4所述的感光组件，其中，所述凹槽延伸于所述悬持部的内侧边缘和外侧边缘之间，以形成收容槽。
  7. 根据权利要求5或6所述的感光组件，其中，所述凹槽进一步凹陷地形成于所述悬持部的边。
  8. 根据权利要求7所述的感光组件，其中，所述凹槽关于所述滤光元 件对称地设置。
  9. 根据权利要求6所述的感光组件，进一步包括施加于所述收容槽内的黏着剂，其中，所述黏着剂具有柔韧性，以被配置为吸收作用于所述滤光元件的应力。
  10. 根据权利要求5所述的感光组件，进一步包括施加于所述边缘槽内的黏着剂，其中，所述黏着剂具有柔韧性，以被配置为吸收作用于所述滤光元件的应力。
  11. 根据权利要求1所述的感光组件，其中，具有所述凹槽的所述悬持部的对应部分的厚度为0.05mm-0.1mm，所述悬持部在除所述凹槽对应部分之外的其他部分的厚度为0.18mm-0.2mm。
  12. 根据权利要求1所述的感光组件，其中，所述支架设置于所述线路板。
  13. 根据权利要求1所述的感光组件，进一步包括设置于所述线路板的基座，其中，所述支架安装于所述基座。
  14. 一种摄像模组，其特征在于，包括：
    根据权利要求1-13任一所述的感光组件；以及
    保持于所述感光组件的感光路径的光学镜头。
  15. 根据权利要求14所述的摄像模组，进一步包括设置于所述感光组件和所述光学镜头之间的驱动元件。
  16. 一种感光组件，其特征在于，包括：
    线路板；
    感光芯片，电连接于所述线路板；
    滤光元件，保持于所述感光芯片的感光路径上；以及
    支架，用于安装所述滤光元件以使得所述滤光元件被保持于所述感光芯片的感光路径上，所述支架包括金属内嵌件和包覆所述金属内嵌件的至少一部分的封装部，所述金属内嵌件中裸露于外界的部分自所述封装部向内且横向地延伸以形成悬持部，其中，所述滤光元件安装于所述悬持部。
  17. 根据权利要求16所述的感光组件，其中，所述金属内嵌件包括内嵌框体，所述内嵌框体的一部分裸露于外界以形成所述悬持部，所述内嵌框体的另一部分被包覆且延伸于所述封装部内。
  18. 根据权利要求17所述的感光组件，其中，所述金属内嵌件进一步包括自所述内嵌框体向外横向延伸的加强件，所述加强件被包覆且延伸于所述封装部内。
  19. 根据权利要求16所述的感光组件，其中，所述封装部的上表面高于所述悬持部的上表面。
  20. 根据权利要求19所述的感光组件，其中，所述封装部的上表面与所述悬持部的上表面之间的间距大于或等于所述滤光元件的厚度尺寸。
  21. 根据权利要求19所述的感光组件，其中，所述封装部具有凹陷地形成于其上表面且连通于所述悬持部的凹槽。
  22. 根据权利要求16所述的感光组件，其中，所述金属内嵌件中所述悬持部的热膨胀系数与所述滤光元件的热膨胀系数之差的范围小于或等于15ppm。
  23. 根据权利要求16所述的感光组件，其中，所述金属内嵌件中所述悬持部的厚度尺寸为0.08-0.15mm。
  24. 根据权利要求16-23任一所述的感光组件，其中，所述支架设置于所述线路板。
  25. 根据权利要求16-23任一所述的感光组件，进一步包括设置于所述线路板的基座，其中，所述支架安装于所述基座。
  26. 根据权利要求16-23任一所述的感光组件，其中，所述支架设置于所述感光芯片的非感光区域。
  27. 一种摄像模组，其特征在于，包括：
    根据权利要求16-26任一所述的感光组件；以及
    保持于所述感光组件的感光路径的光学镜头。
  28. 根据权利要求27所述的摄像模组，进一步包括设置于所述感光组件和所述光学镜头之间的驱动元件，其中，所述驱动元件包括一系列引脚，所述引脚延伸至并电连接于所述线路板，以将所述驱动元件电连接于所述线路板。
  29. 根据权利要求28所述的摄像模组，其中，所述支架中至少一侧向内收缩以使所述支架和所述线路板之间形成避让空间，所述避让空间被配置为允许所述驱动元件的引脚穿过并电连接于所述线路板。
  30. 一种支架，其特征在于，包括：
    金属内嵌件；以及
    包覆所述金属内嵌件的至少一部分的封装部，其中，所述金属内嵌件中裸露于外界的部分自所述封装部向内且横向地延伸以形成悬持部，其中，所述悬持部被配置为安装所述滤光元件于其上。
  31. 根据权利要30所述的支架，其中，所述金属内嵌件包括内嵌框体，所述内嵌框体的一部分裸露于外界以形成所述悬持部，所述内嵌框体的另一部分被包覆且延伸于所述封装部内。
  32. 根据权利要求31所述的感光组件，其中，所述金属内嵌件进一步 包括自所述内嵌框体向外横向延伸的加强件，所述加强件被包覆且延伸于所述封装部内。
  33. 根据权利要求30-32任一所述的感光组件，其中，所述金属内嵌件中所述悬持部的热膨胀系数与滤光元件的热膨胀系数之差的范围小于或等于15ppm。
  34. 根据权利要求30-32任一所述的感光组件，其中，所述支架具有对称结构。
  35. 根据权利要求30-32任一所述的感光组件，其中，所述支架具有非对称结构，其中，所述支架中至少一侧向内收缩。
  36. 一种支架制备方法，其特征在于，包括：
    将金属内嵌件放置于由成型模具形成的成型腔内；
    填充成型材料于所述成型腔；以及
    固化所述成型材料，其中，所述成型材料固化后形成包覆所述金属内嵌件的至少一部分的封装部，并且，所述金属内嵌件中裸露于外界的部分自所述封装部向内且横向地延伸以形成悬持部，所述悬持部被配置为安装所述滤光元件于其上。
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