JP5535494B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

Info

Publication number
JP5535494B2
JP5535494B2 JP2009039213A JP2009039213A JP5535494B2 JP 5535494 B2 JP5535494 B2 JP 5535494B2 JP 2009039213 A JP2009039213 A JP 2009039213A JP 2009039213 A JP2009039213 A JP 2009039213A JP 5535494 B2 JP5535494 B2 JP 5535494B2
Authority
JP
Japan
Prior art keywords
electrode
semiconductor device
wiring
insulating member
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009039213A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010199129A5 (enExample
JP2010199129A (ja
Inventor
健太 内山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009039213A priority Critical patent/JP5535494B2/ja
Priority to US12/706,861 priority patent/US8450853B2/en
Publication of JP2010199129A publication Critical patent/JP2010199129A/ja
Publication of JP2010199129A5 publication Critical patent/JP2010199129A5/ja
Application granted granted Critical
Publication of JP5535494B2 publication Critical patent/JP5535494B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H10P72/74—
    • H10W70/09—
    • H10W70/60—
    • H10W70/611—
    • H10W70/614—
    • H10W70/635—
    • H10W72/0198—
    • H10W74/012—
    • H10W74/016—
    • H10W74/117—
    • H10W74/15—
    • H10W90/00—
    • H10P72/7424—
    • H10W70/093—
    • H10W70/63—
    • H10W72/241—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/856—
    • H10W72/884—
    • H10W72/9413—
    • H10W74/00—
    • H10W74/019—
    • H10W74/142—
    • H10W90/10—
    • H10W90/701—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2009039213A 2009-02-23 2009-02-23 半導体装置 Expired - Fee Related JP5535494B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009039213A JP5535494B2 (ja) 2009-02-23 2009-02-23 半導体装置
US12/706,861 US8450853B2 (en) 2009-02-23 2010-02-17 Semiconductor device and a method of manufacturing the same, and an electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009039213A JP5535494B2 (ja) 2009-02-23 2009-02-23 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014030594A Division JP5693763B2 (ja) 2014-02-20 2014-02-20 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2010199129A JP2010199129A (ja) 2010-09-09
JP2010199129A5 JP2010199129A5 (enExample) 2012-03-01
JP5535494B2 true JP5535494B2 (ja) 2014-07-02

Family

ID=42630265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009039213A Expired - Fee Related JP5535494B2 (ja) 2009-02-23 2009-02-23 半導体装置

Country Status (2)

Country Link
US (1) US8450853B2 (enExample)
JP (1) JP5535494B2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5188426B2 (ja) * 2009-03-13 2013-04-24 新光電気工業株式会社 半導体装置及びその製造方法、電子装置
JP5372579B2 (ja) * 2009-04-10 2013-12-18 新光電気工業株式会社 半導体装置及びその製造方法、並びに電子装置
JP5330065B2 (ja) 2009-04-13 2013-10-30 新光電気工業株式会社 電子装置及びその製造方法
CN102044600A (zh) * 2009-10-15 2011-05-04 展晶科技(深圳)有限公司 发光二极管封装结构及其制备方法
JP5136632B2 (ja) * 2010-01-08 2013-02-06 大日本印刷株式会社 電子部品
JP5732838B2 (ja) * 2010-12-13 2015-06-10 住友ベークライト株式会社 半導体素子封止体の製造方法および半導体パッケージの製造方法
JP5732839B2 (ja) * 2010-12-13 2015-06-10 住友ベークライト株式会社 半導体素子封止体の製造方法および半導体パッケージの製造方法
KR20130005465A (ko) * 2011-07-06 2013-01-16 삼성전자주식회사 반도체 스택 패키지 장치
KR101420526B1 (ko) * 2012-11-29 2014-07-17 삼성전기주식회사 전자부품 내장기판 및 그 제조방법
US10433424B2 (en) * 2014-10-16 2019-10-01 Cyntec Co., Ltd Electronic module and the fabrication method thereof
JP2018073890A (ja) * 2016-10-25 2018-05-10 イビデン株式会社 プリント配線板およびプリント配線板の製造方法
CN109906506A (zh) * 2016-11-28 2019-06-18 株式会社村田制作所 电子部件及其制造方法
JP6540912B2 (ja) * 2016-12-07 2019-07-10 株式会社村田製作所 電子部品及びその製造方法
US10784220B2 (en) * 2017-03-30 2020-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layer
US10515921B2 (en) * 2017-07-27 2019-12-24 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package and method of fabricating semiconductor package
JP7046639B2 (ja) * 2018-02-21 2022-04-04 新光電気工業株式会社 配線基板及びその製造方法
CN112563155A (zh) * 2019-09-26 2021-03-26 伟创力有限公司 在模制电子装置中形成暴露腔的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5222014A (en) * 1992-03-02 1993-06-22 Motorola, Inc. Three-dimensional multi-chip pad array carrier
US6734534B1 (en) 2000-08-16 2004-05-11 Intel Corporation Microelectronic substrate with integrated devices
ATE429032T1 (de) 2000-08-16 2009-05-15 Intel Corp Direktaufbauschicht auf einer verkapselten chipverpackung
JP4135390B2 (ja) * 2002-04-19 2008-08-20 カシオ計算機株式会社 半導体装置およびその製造方法
JP3888267B2 (ja) * 2002-08-30 2007-02-28 カシオ計算機株式会社 半導体装置およびその製造方法
JP2004253406A (ja) * 2002-12-24 2004-09-09 Adtec:Kk モジュールカバーおよびメモリモジュール
JP2004221418A (ja) * 2003-01-16 2004-08-05 Casio Comput Co Ltd 半導体装置およびその製造方法
JP2004342862A (ja) * 2003-05-16 2004-12-02 Sony Corp 半導体装置及びその製造方法、疑似ウェーハ及びその製造方法、並びにマルチチップモジュール
JP4303563B2 (ja) * 2003-11-12 2009-07-29 大日本印刷株式会社 電子装置および電子装置の製造方法
JP4899604B2 (ja) * 2006-04-13 2012-03-21 ソニー株式会社 三次元半導体パッケージ製造方法
TWI335652B (en) * 2007-04-04 2011-01-01 Unimicron Technology Corp Stacked packing module

Also Published As

Publication number Publication date
US20100213616A1 (en) 2010-08-26
US8450853B2 (en) 2013-05-28
JP2010199129A (ja) 2010-09-09

Similar Documents

Publication Publication Date Title
JP5535494B2 (ja) 半導体装置
US8174109B2 (en) Electronic device and method of manufacturing same
JP5193898B2 (ja) 半導体装置及び電子装置
TWI443791B (zh) 佈線基板之製造方法、半導體裝置之製造方法及佈線基板
JP4298559B2 (ja) 電子部品実装構造及びその製造方法
JP6342120B2 (ja) 超薄埋設ダイモジュール及びその製造方法
JP5188426B2 (ja) 半導体装置及びその製造方法、電子装置
JP3740469B2 (ja) 半導体装置および半導体装置の製造方法
JP5372579B2 (ja) 半導体装置及びその製造方法、並びに電子装置
JP5147755B2 (ja) 半導体装置及びその製造方法
JP2010251395A (ja) 電子装置及びその製造方法
JP2013243345A5 (enExample)
JP2006049424A (ja) 電子部品内蔵基板およびその製造方法
JP5357239B2 (ja) 配線基板、半導体装置、及び配線基板の製造方法
US8410596B2 (en) Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package
JP4171499B2 (ja) 電子装置用基板およびその製造方法、並びに電子装置およびその製造方法
CN101252092B (zh) 多芯片封装结构及其制作方法
JP2004327624A (ja) 部品内蔵多層回路基板
CN101236943A (zh) 内埋芯片的散热型无芯板薄型基板及其制造方法
JP2008210912A (ja) 半導体装置及びその製造方法
JP4901809B2 (ja) 部品内蔵多層回路基板
CN101393877A (zh) 制造半导体器件的方法
JP5693763B2 (ja) 半導体装置及びその製造方法
JP4955259B2 (ja) 配線基板、半導体装置、及び配線基板の製造方法
JP2005011856A (ja) チップ状電子部品及びその製造方法、並びにその実装構造

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120113

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120113

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121113

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121115

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130604

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130726

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20131203

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140220

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20140227

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140401

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140423

R150 Certificate of patent or registration of utility model

Ref document number: 5535494

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees