JP5732839B2 - 半導体素子封止体の製造方法および半導体パッケージの製造方法 - Google Patents
半導体素子封止体の製造方法および半導体パッケージの製造方法 Download PDFInfo
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- JP5732839B2 JP5732839B2 JP2010277520A JP2010277520A JP5732839B2 JP 5732839 B2 JP5732839 B2 JP 5732839B2 JP 2010277520 A JP2010277520 A JP 2010277520A JP 2010277520 A JP2010277520 A JP 2010277520A JP 5732839 B2 JP5732839 B2 JP 5732839B2
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- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 1
- 150000002848 norbornenes Chemical class 0.000 description 1
- 230000000269 nucleophilic effect Effects 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- KTNLYTNKBOKXRW-UHFFFAOYSA-N phenyliodanium Chemical compound [IH+]C1=CC=CC=C1 KTNLYTNKBOKXRW-UHFFFAOYSA-N 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000006798 ring closing metathesis reaction Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- YYMBJDOZVAITBP-UHFFFAOYSA-N rubrene Chemical compound C1=CC=CC=C1C(C1=C(C=2C=CC=CC=2)C2=CC=CC=C2C(C=2C=CC=CC=2)=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 YYMBJDOZVAITBP-UHFFFAOYSA-N 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical class [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- XBFJAVXCNXDMBH-UHFFFAOYSA-N tetracyclo[6.2.1.1(3,6).0(2,7)]dodec-4-ene Chemical compound C1C(C23)C=CC1C3C1CC2CC1 XBFJAVXCNXDMBH-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- VLCLHFYFMCKBRP-UHFFFAOYSA-N tricalcium;diborate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]B([O-])[O-].[O-]B([O-])[O-] VLCLHFYFMCKBRP-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- PAEMYAOPFRRKOG-UHFFFAOYSA-N triethylsilyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)O[Si](CC)(CC)CC)CC1C=C2 PAEMYAOPFRRKOG-UHFFFAOYSA-N 0.000 description 1
- PBIMIGNDTBRRPI-UHFFFAOYSA-N trifluoro borate Chemical compound FOB(OF)OF PBIMIGNDTBRRPI-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- ODHKAQHVQPQOFZ-UHFFFAOYSA-N triphenyl-$l^{3}-iodane Chemical compound C1=CC=CC=C1I(C=1C=CC=CC=1)C1=CC=CC=C1 ODHKAQHVQPQOFZ-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- WUKMCKCDYKBLBG-UHFFFAOYSA-N tris(4-methoxyphenyl)sulfanium Chemical compound C1=CC(OC)=CC=C1[S+](C=1C=CC(OC)=CC=1)C1=CC=C(OC)C=C1 WUKMCKCDYKBLBG-UHFFFAOYSA-N 0.000 description 1
- QKFJVDSYTSWPII-UHFFFAOYSA-N tris(4-methylphenyl)sulfanium Chemical compound C1=CC(C)=CC=C1[S+](C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 QKFJVDSYTSWPII-UHFFFAOYSA-N 0.000 description 1
- ZMOJTPABCOWEOS-UHFFFAOYSA-N tris(4-tert-butylphenyl)sulfanium Chemical compound C1=CC(C(C)(C)C)=CC=C1[S+](C=1C=CC(=CC=1)C(C)(C)C)C1=CC=C(C(C)(C)C)C=C1 ZMOJTPABCOWEOS-UHFFFAOYSA-N 0.000 description 1
- ZQTYRTSKQFQYPQ-UHFFFAOYSA-N trisiloxane Chemical compound [SiH3]O[SiH2]O[SiH3] ZQTYRTSKQFQYPQ-UHFFFAOYSA-N 0.000 description 1
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical class O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92142—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92144—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1035—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the device being entirely enclosed by the support, e.g. high-density interconnect [HDI]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
(1) 少なくとも1つの電極パッドを有する複数の半導体素子と、導電性を有する複数の導体柱と、前記半導体素子および前記導体柱を封止する封止部とを有する半導体素子封止体の製造方法であって、
平板状をなし、熱分解性の樹脂成分を含んで構成される接着層を備えるダミー基板を用意し、前記接着層側の前記ダミー基板上に、前記電極パッドが前記ダミー基板側となるように前記半導体素子を配置する半導体素子配置工程と、
前記半導体素子が配置されている側の面に、前記ダミー基板と前記半導体素子とを覆うように感光性を有する絶縁性材料で封止して封止部を形成する封止部形成工程と、
前記封止部の各前記導体柱を形成すべき位置にフォトリソグラフィー法を用いて第1の貫通孔を形成した後、該第1の貫通孔に前記導体柱を形成することにより、前記ダミー基板上に前記半導体素子封止体を得る導体柱形成工程と、
前記接着層を加熱して前記樹脂成分を熱分解させることで前記半導体素子封止体から前記ダミー基板を剥離させる剥離工程とを有し、
前記樹脂成分は、下記化学式(1X)で表わされるカーボネート構成単位、および、下記化学式(2X)で表わされるカーボネート構成単位のうちの少なくとも1種を有するカーボネート系樹脂を含むことを特徴とする半導体素子封止体の製造方法。
前記第2の貫通孔に導電性を有する導体ポストを形成する導体ポスト形成工程と、
前記シート材の前記半導体素子封止体とは反対の面側に、前記導体ポストに電気的に接続する配線を形成する配線形成工程と、
前記半導体素子封止体とは反対側の面に、前記配線の一部が露出するように、開口部を備える被覆部を形成する被覆部形成工程と、
前記開口部で露出する前記配線に、バンプを電気的に接続するバンプ接続工程と、
前記半導体素子毎に対応するように、前記半導体素子封止体を個片化することにより、複数の半導体パッケージを一括して得る個片化工程とを有することを特徴とする半導体パッケージの製造方法。
図1は、本発明の半導体パッケージの製造方法により製造された半導体パッケージを備える半導体装置の一例を示す縦断面図、図2は、図1に示す半導体装置が備える各半導体パッケージを示す縦断面図である。なお、以下の説明では、図1、2中の上側を「上」、下側を「下」と言う。
以下、本発明の半導体パッケージの製造方法を適用したパッケージ20の製造方法について詳述する。
まず、パッケージ20を製造する製造方法の第1実施形態ついて説明する。
さらに、接着層102を構成する樹脂組成物は、溶媒(溶剤)を含有していても良い。
まず、アルカリ可溶性樹脂と感光剤とを含有するアルカリ可溶系樹脂組成物が、感光性を有する絶縁性材料として好適に用いられる。
また、R3として窒素含有環状化合物を用いても良い。これにより、金属配線(特に銅配線)等との密着性に優れる。この前記窒素含有環状化合物としては、例えば(1H−テトラゾル−5−イル)アミノ基、1−(1H−テトラゾル−5−イル)メチル−アミノ基、3−(1H−テトラゾル−5−イル)ベンズ−アミノ基等が挙げられる。
R2は、水酸基、カルボキシル基、−O−R3、−COOR3であり、それぞれ同じであっても異なっていても良い。R3が炭素数1〜15の有機基または窒素含有環状化合物である。R3の具体例としては、ホルミル基、メチル基、エチル基、プロピル基、イソプロピル基、ターシャリーブチル基、ターシャリーブトキシカルボニル基、フェニル基、ベンジル基、テトラヒドロフラニル基、テトラヒドロピラニル基等が挙げられる。
また、前記アルカリ可溶性樹脂の側鎖および他方の末端の少なくとも一方は、窒素含有環状化合物で置換されているのが好ましい。これにより、被覆部22の配線23に対する密着性を向上させることができる。
次に、上述したアルカリ可溶系樹脂組成物の他に、感光性を有する絶縁性材料として好適に用いられるものとして、ノルボルネン系樹脂組成物が挙げられる。このノルボルネン系樹脂組成物の中でも、特に、密着性、厚さ均一性および段差埋め込み性を顕著に発揮するものとして、環状オレフィンの重合体またはその水素添加物(A)および下記一般式(5)で示される構造を有する化合物(B)を含む樹脂組成物が好ましく用いられる。
このマスクの除去は、プラズマエッチング、リアクティブエッチング、ビームエッチング、光アシストエッチング等の物理的エッチング法、ウェットエッチング等の化学的エッチング法等のうち1種または2種以上を組み合わせて行うことができるが、具体的には、マスクをアルカリ現像液で膨潤・溶解し除去する方法が好ましく用いられる。
以上のような工程を経て、第2の貫通孔251内に導体ポスト24が形成される。
[8−1]まず、本実施形態では、前記工程[7−4]において残存させておいたシード層の配線23を形成しない領域にマスクを形成する。
ここで、本工程[8−2]において、配線23を電解メッキ法により形成する場合には、前述のように、シード層を除去することなくシート材25’に残存させていることから、このシード層を電極として用いて、電解メッキ法により配線23を形成することができる。
以上のような工程を経て、複数の半導体パッケージ20が製造される。
次に、パッケージ20を製造する製造方法の第2実施形態ついて説明する。
なお、この第2の貫通孔251は、導体柱28に対応する位置に形成される。
以上のような工程を経て、半導体パッケージ20が製造される。
12、22 被覆部
121、221 開口部
13、23 配線
14、24 導体ポスト
142 マスク
15、25 インターポーザー
151、251 貫通孔
16、26 半導体素子
17、27 封止部
21 バンプ
25’ シート材
270、270’ 半導体素子封止体
28 導体柱
30 半導体装置
501 振動フィーダー
502 樹脂材料供給容器
503 エポキシ樹脂組成物
504 下型キャビティ
600 パッケージ
101、601 ダミー基板
102、602 接着層
610 封止体
611 バンプ
612 第2の被覆層
613 配線
614 導体ポスト
615 第1の被覆層
616 半導体素子
617 封止部
622 開口部
625 貫通孔
Claims (9)
- 少なくとも1つの電極パッドを有する複数の半導体素子と、導電性を有する複数の導体柱と、前記半導体素子および前記導体柱を封止する封止部とを有する半導体素子封止体の製造方法であって、
平板状をなし、熱分解性の樹脂成分を含んで構成される接着層を備えるダミー基板を用意し、前記接着層側の前記ダミー基板上に、前記電極パッドが前記ダミー基板側となるように前記半導体素子を配置する半導体素子配置工程と、
前記半導体素子が配置されている側の面に、前記ダミー基板と前記半導体素子とを覆うように感光性を有する絶縁性材料で封止して封止部を形成する封止部形成工程と、
前記封止部の各前記導体柱を形成すべき位置にフォトリソグラフィー法を用いて第1の貫通孔を形成した後、該第1の貫通孔に前記導体柱を形成することにより、前記ダミー基板上に前記半導体素子封止体を得る導体柱形成工程と、
前記接着層を加熱して前記樹脂成分を熱分解させることで前記半導体素子封止体から前記ダミー基板を剥離させる剥離工程とを有し、
前記樹脂成分は、下記化学式(1X)で表わされるカーボネート構成単位、および、下記化学式(2X)で表わされるカーボネート構成単位のうちの少なくとも1種を有するカーボネート系樹脂を含むことを特徴とする半導体素子封止体の製造方法。
- 前記封止部形成工程において、前記封止部は、前記感光性を有する絶縁性材料を含有する液状材料を、前記ダミー基板および前記半導体素子を覆うように、前記半導体素子が配置されている側の面に供給した後、前記液状材料を乾燥させることにより形成される請求項1に記載の半導体素子封止体の製造方法。
- 前記封止部形成工程において、前記封止部は、前記感光性を有する絶縁性材料を含有するフィルム材を、前記ダミー基板および前記半導体素子を覆うように、前記半導体素子が配置されている側の面に貼り合わせることにより形成される請求項1に記載の半導体素子封止体の製造方法。
- 前記導体柱形成工程において、前記第1の貫通孔は、前記封止部を、前記導体柱の形状に対応するフォトマスクを介して露光した後、前記導体柱を形成すべき領域に位置する前記封止部を、現像液を用いて除去することにより形成される請求項1ないし3のいずれかに記載の半導体素子封止体の製造方法。
- 前記導体柱形成工程において、前記導体柱は、電解メッキ法により形成される請求項1ないし4のいずれかに記載の半導体素子封止体の製造方法。
- 請求項1ないし5のいずれかに記載の半導体素子封止体の製造方法により製造された半導体素子封止体と、厚さ方向に複数の第2の貫通孔が形成されたシート材とを用意し、各前記第2の貫通孔に前記電極パッドおよび前記導体柱が対応するように、前記半導体素子封止体に前記シート材を貼り合わせるシート材貼り合わせ工程と、
前記第2の貫通孔に導電性を有する導体ポストを形成する導体ポスト形成工程と、
前記シート材の前記半導体素子封止体とは反対の面側に、前記導体ポストに電気的に接続する配線を形成する配線形成工程と、
前記半導体素子封止体とは反対側の面に、前記配線の一部が露出するように、開口部を備える被覆部を形成する被覆部形成工程と、
前記開口部で露出する前記配線に、バンプを電気的に接続するバンプ接続工程と、
前記半導体素子毎に対応するように、前記半導体素子封止体を個片化することにより、複数の半導体パッケージを一括して得る個片化工程とを有することを特徴とする半導体パッケージの製造方法。 - 前記導体ポスト形成工程において、前記導体ポストは、電解メッキ法により形成される請求項6に記載の半導体パッケージの製造方法。
- 前記配線形成工程において、前記配線は、電解メッキ法により形成される請求項6または7に記載の半導体パッケージの製造方法。
- 前記導体ポストと前記バンプとは、前記シート材の面方向において、異なる位置に形成される請求項6ないし8のいずれかに記載の半導体パッケージの製造方法。
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