JP5532743B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP5532743B2
JP5532743B2 JP2009191093A JP2009191093A JP5532743B2 JP 5532743 B2 JP5532743 B2 JP 5532743B2 JP 2009191093 A JP2009191093 A JP 2009191093A JP 2009191093 A JP2009191093 A JP 2009191093A JP 5532743 B2 JP5532743 B2 JP 5532743B2
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Japan
Prior art keywords
metal layer
layer
gaas substrate
main surface
hole
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Expired - Fee Related
Application number
JP2009191093A
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English (en)
Japanese (ja)
Other versions
JP2011044546A (ja
JP2011044546A5 (enExample
Inventor
弘一郎 西沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2009191093A priority Critical patent/JP5532743B2/ja
Priority to TW099111380A priority patent/TWI419276B/zh
Priority to US12/766,966 priority patent/US8581411B2/en
Publication of JP2011044546A publication Critical patent/JP2011044546A/ja
Publication of JP2011044546A5 publication Critical patent/JP2011044546A5/ja
Priority to US14/050,412 priority patent/US20140035145A1/en
Application granted granted Critical
Publication of JP5532743B2 publication Critical patent/JP5532743B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/62—Electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2009191093A 2009-08-20 2009-08-20 半導体装置及びその製造方法 Expired - Fee Related JP5532743B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009191093A JP5532743B2 (ja) 2009-08-20 2009-08-20 半導体装置及びその製造方法
TW099111380A TWI419276B (zh) 2009-08-20 2010-04-13 Semiconductor device and manufacturing method thereof
US12/766,966 US8581411B2 (en) 2009-08-20 2010-04-26 Semiconductor device
US14/050,412 US20140035145A1 (en) 2009-08-20 2013-10-10 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009191093A JP5532743B2 (ja) 2009-08-20 2009-08-20 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2011044546A JP2011044546A (ja) 2011-03-03
JP2011044546A5 JP2011044546A5 (enExample) 2012-07-05
JP5532743B2 true JP5532743B2 (ja) 2014-06-25

Family

ID=43604671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009191093A Expired - Fee Related JP5532743B2 (ja) 2009-08-20 2009-08-20 半導体装置及びその製造方法

Country Status (3)

Country Link
US (2) US8581411B2 (enExample)
JP (1) JP5532743B2 (enExample)
TW (1) TWI419276B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9616379B2 (en) * 2013-07-25 2017-04-11 Korea Institute Of Energy Research Method for preparing hydrogen separation membrane and device for preparing hydrogen separation membrane
WO2015145815A1 (ja) * 2014-03-27 2015-10-01 三菱電機株式会社 半導体装置、半導体装置の製造方法
WO2023079631A1 (ja) 2021-11-04 2023-05-11 三菱電機株式会社 半導体装置及びその製造方法
JPWO2024189685A1 (enExample) * 2023-03-10 2024-09-19

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3642528A (en) * 1968-06-05 1972-02-15 Matsushita Electronics Corp Semiconductor device and method of making same
US4179533A (en) * 1978-04-25 1979-12-18 The United States Of America As Represented By The Secretary Of The Navy Multi-refractory films for gallium arsenide devices
US5075763A (en) * 1988-09-28 1991-12-24 Kopin Corporation High temperature metallization system for contacting semiconductor materials
JPH03109725A (ja) * 1989-09-25 1991-05-09 Fujitsu Ltd 半導体装置の製造方法
JP2679320B2 (ja) * 1989-12-20 1997-11-19 富士電機株式会社 ショットキバリアダイオード
US5027189A (en) * 1990-01-10 1991-06-25 Hughes Aircraft Company Integrated circuit solder die-attach design and method
JPH07193214A (ja) 1993-12-27 1995-07-28 Mitsubishi Electric Corp バイアホール及びその形成方法
US5956362A (en) * 1996-02-27 1999-09-21 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting device and method of etching
JP3724110B2 (ja) * 1997-04-24 2005-12-07 三菱電機株式会社 半導体装置の製造方法
JP4865130B2 (ja) * 1999-02-18 2012-02-01 古河電気工業株式会社 半導体素子用電極とその製造方法
JP3462166B2 (ja) * 2000-09-08 2003-11-05 富士通カンタムデバイス株式会社 化合物半導体装置
US6787910B2 (en) * 2002-07-23 2004-09-07 National Chiao Tung University Schottky structure in GaAs semiconductor device
JP3715975B2 (ja) * 2003-04-24 2005-11-16 株式会社半導体理工学研究センター 多層配線構造の製造方法
JP2005109058A (ja) * 2003-09-30 2005-04-21 Sanyo Electric Co Ltd 半導体素子およびその製造方法
JP4637009B2 (ja) 2005-12-02 2011-02-23 三菱電機株式会社 半導体装置の製造方法
KR100761467B1 (ko) * 2006-06-28 2007-09-27 삼성전자주식회사 금속배선 및 그 형성 방법
JP2008251562A (ja) * 2007-03-29 2008-10-16 Sharp Corp 半導体レーザ素子およびその形成方法
JP2009064961A (ja) * 2007-09-06 2009-03-26 Sharp Corp 半導体レーザ装置およびその製造方法

Also Published As

Publication number Publication date
TW201108362A (en) 2011-03-01
JP2011044546A (ja) 2011-03-03
TWI419276B (zh) 2013-12-11
US20110042822A1 (en) 2011-02-24
US20140035145A1 (en) 2014-02-06
US8581411B2 (en) 2013-11-12

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