JP5518327B2 - 炭化珪素質多孔体及びその製造方法 - Google Patents
炭化珪素質多孔体及びその製造方法 Download PDFInfo
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- JP5518327B2 JP5518327B2 JP2008501655A JP2008501655A JP5518327B2 JP 5518327 B2 JP5518327 B2 JP 5518327B2 JP 2008501655 A JP2008501655 A JP 2008501655A JP 2008501655 A JP2008501655 A JP 2008501655A JP 5518327 B2 JP5518327 B2 JP 5518327B2
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- silicon carbide
- silicone resin
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- 239000011148 porous material Substances 0.000 title claims description 137
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims description 92
- 229910010271 silicon carbide Inorganic materials 0.000 title claims description 89
- 238000004519 manufacturing process Methods 0.000 title claims description 32
- 239000002245 particle Substances 0.000 claims description 150
- 229920002050 silicone resin Polymers 0.000 claims description 43
- 229910052710 silicon Inorganic materials 0.000 claims description 42
- 239000010703 silicon Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 19
- 238000010304 firing Methods 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 14
- 238000009826 distribution Methods 0.000 claims description 13
- 229910052760 oxygen Inorganic materials 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 239000002994 raw material Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 238000000354 decomposition reaction Methods 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 150000002902 organometallic compounds Chemical class 0.000 description 39
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 28
- 239000000463 material Substances 0.000 description 26
- 230000000052 comparative effect Effects 0.000 description 21
- 238000000034 method Methods 0.000 description 14
- 239000003054 catalyst Substances 0.000 description 13
- 239000007789 gas Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 229920002472 Starch Polymers 0.000 description 5
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 5
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- 229910021426 porous silicon Inorganic materials 0.000 description 2
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- Chemical Kinetics & Catalysis (AREA)
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- Porous Artificial Stone Or Porous Ceramic Products (AREA)
Description
SiC原料粉末と,平均粒径5μmのSi粉末とを、質量比で80:20の組成となるように配合し、この粉末100質量部に対して、平均粒子径12μmのレジン系のシリコーン樹脂粒子(組成は(CH3SiO1.5)n)を15質量部添加した(他の特性については表1に合わせて記載した)。次いで、有機バインダーとしてメチルセルロース6質量部、界面活性剤2.5質量部及び水24質量部を加え、均一に混合及び混練して成形用の坏土を得た。得られた坏土を押出成形し、乾燥して隔壁の厚さが310μm、セル密度が約46.5セル/cm2(300セル/平方インチ)、断面が一辺35mmの正四角形、長さが152mmの炭化珪素質多孔体の成形体を得た。この炭化珪素質多孔体の成形体を、端面が市松模様状を呈するように、セルの両端面を目封じした。即ち、隣接するセルが,互いに反対側の端部で封じられるように目封じを行った。目封じ材としては、炭化珪素質多孔体原料と同様な材料を用いた。セルの両端面を目封じし、乾燥させた後、大気雰囲気中約400℃で脱脂し、その後、Ar不活性雰囲気で約1450℃で焼成して、炭化珪素質多孔体(実施例1)を作製した。
実施例1において、更に表1記載の助剤成分(SrO、SiO2)を加えた以外は実施例1と同様にした。
実施例1において、平均粒子径2μmのレジン系のシリコーン樹脂粒子(組成は(CH3SiO1.5)n)を用いた以外は実施例1と同様にした。
実施例3において、更に表1記載の助剤成分(SrO、SiO2)を加えた以外は実施例3と同様にした。
実施例1において、平均粒子径30μmのレジン・ゴム複合系のシリコーン樹脂粒子(組成は(CH3SiO1.5)n、((CH3)2SiO)nの混合)を用いた以外は実施例1と同様にした。
実施例5において、更に表1記載の助剤成分(SrO、SiO2)を加えた以外は実施例5と同様にした。
実施例5において、更に有機造孔材としてデンプン10質量部加えた以外は実施例5と同様にした。
実施例1において、平均粒子径40μmのゴム系のシリコーン樹脂粒子(組成は((CH3)2SiO)n)を5質量部添加した以外は実施例1と同様にした。
実施例8において、平均粒子径40μmのゴム系のシリコーン樹脂粒子(組成は((CH3)2SiO)n)を15質量部添加した以外は実施例8と同様にした。
実施例8において、平均粒子径40μmのゴム系のシリコーン樹脂粒子(組成は((CH3)2SiO)n)を25質量部添加した以外は実施例8と同様にした。
実施例9において、更に表1記載の助剤成分(SrO、SiO2)を加えた以外は実施例9と同様にした。
実施例1において、シリコーン樹脂粒子を添加しないこと以外は実施例1と同様にした。
比較例1において、有機造孔材として、デンプン10質量部と表1記載の助剤成分(SrO、SiO2)を加えた以外は比較例1と同様にした。
比較例2において、有機造孔材として、20質量部(比較例3)、25質量部(比較例4)、とした以外は比較例2と同様にした。
実施例1において、平均粒子径43μmのシリカゲルを用いた以外は実施例1と同様にした。
(1)粒子径:レーザ回折・散乱式粒子径分布測定装置を用いて平均粒子径を計測した。
(2)タップ密度:重量既知の試料紛体をメスシリンダーに充填し、一定距離から繰り返し落下させ,その嵩が一定値となった時の体積を測定し,タップ密度を算出した。
(1)気孔率:得られた炭化珪素質多孔体から隔壁厚みの平板を切り出し、アルキメデス法で測定した。
(2)平均細孔径及び細孔容量:得られた炭化珪素質多孔体から測定試料を切り出し、水銀ポロシメーターで測定した。
(3)細孔径分布の”シャープさ”の評価:水銀ポロシメーターにて測定した結果から、全細孔容量と全細孔容量の10%(V10)、90%(V90)の容量を算出した。細孔径-積算細孔容量の関係からV10、V90に相当する細孔径D10、D90を算出した。
(4)熱膨張率:JIS R1618記載の方法に準拠し、平均線熱膨張係数を測定した。
(5)熱伝導率:JIS R1611記載の方法に準拠し、レーザーフラシュ熱定数測定装置で測定した。
(6)骨材粒子の評価:得られた焼成体の表面の微構造をSEM/EDSにより観察し、骨材状粒子の成分を調べた。焼成体に含まれる粒子の中に、Si、C、O元素が含まれる粒子が存在したものを○とした。
表1及び表2の結果から、実施例1、2、5〜11で使用した有機金属化合物(シリコーン樹脂粒子)は、タップ密度が0.6g/cc以下であり、且つ平均粒子径が10〜70μmを満たし、その組成もSi、C、Oを含んでいる。また、これらの有機金属化合物(シリコーン樹脂粒子)を5〜30質量%(ms%)添加することで,気孔率45〜70%かつ平均細孔径が8〜20μmの多孔質体を作製することができた。
Claims (10)
- 骨材となる炭化珪素粒子と金属珪素とを含み、且つ熱処理により分解・転化することで体積収縮し、気孔を形成するシリコーン樹脂粒子由来の骨材を含み、
前記シリコーン樹脂粒子は、レジン系のシリコーン樹脂粒子[(CH 3 SiO 1.5 ) n ]およびゴム系のシリコーン樹脂粒子[((CH 3 ) 2 SiO) n )]のうちの1種以上からなる炭化珪素質多孔体。 - 前記シリコーン樹脂粒子由来の骨材が、Si、O、Cを含む請求項1に記載の炭化珪素質多孔体。
- 気孔率が45〜70%であるとともに、その平均細孔径が8〜20μmである請求項1又は2に記載の炭化珪素質多孔体。
- 全細孔容量の10%及び90%を示す細孔容量V10、V90に対応する細孔径をD10、D90とするとき、log(D90)−log(D10)の値が0.4以下の細孔径分布を示す請求項1〜3のいずれか1項に記載の炭化珪素質多孔体。
- 炭化珪素粒子及び金属珪素を含む原料混合物に、熱処理により分解・転化することで体積収縮し、気孔を形成するシリコーン樹脂粒子を添加した後、所定形状に成形し、得られた成形体を仮焼及び/又は本焼成し、前記シリコーン樹脂粒子が分解・転化し、体積収縮して気孔を形成し、前記シリコーン樹脂粒子が分解・転化した物質が骨材として存在する多孔体を得、
前記シリコーン樹脂粒子は、レジン系のシリコーン樹脂粒子[(CH 3 SiO 1.5 ) n ]およびゴム系のシリコーン樹脂粒子[((CH 3 ) 2 SiO) n )]のうちの1種以上からなる炭化珪素質多孔体の製造方法。 - 前記シリコーン樹脂物粒子を、5〜30質量部添加する請求項5に記載の炭化珪素質多孔体の製造方法。
- 前記シリコーン樹脂粒子が、Si、O、Cを含む請求項5又は6に記載の炭化珪素質多孔体の製造方法。
- 前記シリコーン樹脂粒子のタップ密度が、0.6g/cc以下である請求項5〜7のいずれか1項に記載の炭化珪素質多孔体の製造方法。
- 前記シリコーン樹脂粒子の平均粒子径が10〜70μmである請求項5〜8のいずれか1項に記載の炭化珪素質多孔体の製造方法。
- 前記所定形状が、ハニカム形状である請求項5〜9のいずれか1項に記載の炭化珪素質多孔体の製造方法。
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