JPWO2007097161A1 - 炭化珪素質多孔体及びその製造方法 - Google Patents
炭化珪素質多孔体及びその製造方法 Download PDFInfo
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Abstract
Description
SiC原料粉末と,平均粒径5μmのSi粉末とを、質量比で80:20の組成となるように配合し、この粉末100質量部に対して、平均粒子径12μmのレジン系のシリコーン樹脂粒子(組成は(CH3SiO1.5)n)を15質量部添加した(他の特性については表1に合わせて記載した)。次いで、有機バインダーとしてメチルセルロース6質量部、界面活性剤2.5質量部及び水24質量部を加え、均一に混合及び混練して成形用の坏土を得た。得られた坏土を押出成形し、乾燥して隔壁の厚さが310μm、セル密度が約46.5セル/cm2(300セル/平方インチ)、断面が一辺35mmの正四角形、長さが152mmの炭化珪素質多孔体の成形体を得た。この炭化珪素質多孔体の成形体を、端面が市松模様状を呈するように、セルの両端面を目封じした。即ち、隣接するセルが,互いに反対側の端部で封じられるように目封じを行った。目封じ材としては、炭化珪素質多孔体原料と同様な材料を用いた。セルの両端面を目封じし、乾燥させた後、大気雰囲気中約400℃で脱脂し、その後、Ar不活性雰囲気で約1450℃で焼成して、炭化珪素質多孔体(実施例1)を作製した。
実施例1において、更に表1記載の助剤成分(SrO、SiO2)を加えた以外は実施例1と同様にした。
実施例1において、平均粒子径2μmのレジン系のシリコーン樹脂粒子(組成は(CH3SiO1.5)n)を用いた以外は実施例1と同様にした。
実施例3において、更に表1記載の助剤成分(SrO、SiO2)を加えた以外は実施例3と同様にした。
実施例1において、平均粒子径30μmのレジン・ゴム複合系のシリコーン樹脂粒子(組成は(CH3SiO1.5)n、((CH3)2SiO)nの混合)を用いた以外は実施例1と同様にした。
実施例5において、更に表1記載の助剤成分(SrO、SiO2)を加えた以外は実施例5と同様にした。
実施例5において、更に有機造孔材としてデンプン10質量部加えた以外は実施例5と同様にした。
実施例1において、平均粒子径40μmのゴム系のシリコーン樹脂粒子(組成は((CH3)2SiO)n)を5質量部添加した以外は実施例1と同様にした。
実施例8において、平均粒子径40μmのゴム系のシリコーン樹脂粒子(組成は((CH3)2SiO)n)を15質量部添加した以外は実施例8と同様にした。
実施例8において、平均粒子径40μmのゴム系のシリコーン樹脂粒子(組成は((CH3)2SiO)n)を25質量部添加した以外は実施例8と同様にした。
実施例9において、更に表1記載の助剤成分(SrO、SiO2)を加えた以外は実施例9と同様にした。
実施例1において、シリコーン樹脂粒子を添加しないこと以外は実施例1と同様にした。
比較例1において、有機造孔材として、デンプン10質量部と表1記載の助剤成分(SrO、SiO2)を加えた以外は比較例1と同様にした。
比較例2において、有機造孔材として、20質量部(比較例3)、25質量部(比較例4)、とした以外は比較例2と同様にした。
実施例1において、平均粒子径43μmのシリカゲルを用いた以外は実施例1と同様にした。
(1)粒子径:レーザ回折・散乱式粒子径分布測定装置を用いて平均粒子径を計測した。
(2)タップ密度:重量既知の試料紛体をメスシリンダーに充填し、一定距離から繰り返し落下させ,その嵩が一定値となった時の体積を測定し,タップ密度を算出した。
(1)気孔率:得られた炭化珪素質多孔体から隔壁厚みの平板を切り出し、アルキメデス法で測定した。
(2)平均細孔径及び細孔容量:得られた炭化珪素質多孔体から測定試料を切り出し、水銀ポロシメーターで測定した。
(3)細孔径分布の”シャープさ”の評価:水銀ポロシメーターにて測定した結果から、全細孔容量と全細孔容量の10%(V10)、90%(V90)の容量を算出した。細孔径-積算細孔容量の関係からV10、V90に相当する細孔径D10、D90を算出した。
(4)熱膨張率:JIS R1618記載の方法に準拠し、平均線熱膨張係数を測定した。
(5)熱伝導率:JIS R1611記載の方法に準拠し、レーザーフラシュ熱定数測定装置で測定した。
(6)骨材粒子の評価:得られた焼成体の表面の微構造をSEM/EDSにより観察し、骨材状粒子の成分を調べた。焼成体に含まれる粒子の中に、Si、C、O元素が含まれる粒子が存在したものを○とした。
表1及び表2の結果から、実施例1、2、5〜11で使用した有機金属化合物(シリコーン樹脂粒子)は、タップ密度が0.6g/cc以下であり、且つ平均粒子径が10〜70μmを満たし、その組成もSi、C、Oを含んでいる。また、これらの有機金属化合物(シリコーン樹脂粒子)を5〜30質量%(ms%)添加することで,気孔率45〜70%かつ平均細孔径が8〜20μmの多孔質体を作製することができた。
Claims (10)
- 骨材となる炭化珪素粒子と金属珪素とを含み、且つ熱処理により分解・転化することで体積収縮し、気孔を形成する有機金属化合物粒子由来の骨材を含む炭化珪素質多孔体。
- 前記有機金属化合物粒子由来の骨材が、Si、O、Cを含む請求項1に記載の炭化珪素質多孔体。
- 気孔率が45〜70%であるとともに、その平均細孔径が8〜20μmである請求項1又は2に記載の炭化珪素質多孔体。
- 全細孔容量の10%及び90%を示す細孔容量V10、V90に対応する細孔径をD10、D90とするとき、log(D90)−log(D10)の値が0.4以下の細孔径分布を示す請求項1〜3のいずれか1項に記載の炭化珪素質多孔体。
- 炭化珪素粒子及び金属珪素を含む原料混合物に、熱処理により分解・転化することで体積収縮し、気孔を形成する有機金属化合物粒子を添加した後、所定形状に成形し、得られた成形体を仮焼及び/又は本焼成し、前記有機金属化合物粒子が分解・転化し、体積収縮して気孔を形成し、前記有機金属化合物粒子が分解・転化した物質が骨材として存在する多孔体を得る炭化珪素質多孔体の製造方法。
- 前記有機金属化合物粒子を、5〜30質量部添加する請求項5に記載の炭化珪素質多孔体の製造方法。
- 前記有機金属化合物粒子が、Si、O、Cを含む請求項5又は6に記載の炭化珪素質多孔体の製造方法。
- 前記有機金属化合物粒子のタップ密度が、0.6g/cc以下である請求項5〜7のいずれか1項に記載の炭化珪素質多孔体の製造方法。
- 前記有機金属化合物粒子の平均粒子径が10〜70μmである請求項5〜8のいずれか1項に記載の炭化珪素質多孔体の製造方法。
- 前記所定形状が、ハニカム形状である請求項5〜9のいずれか1項に記載の炭化珪素質多孔体の製造方法。
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