JP5518281B2 - 表面処理方法 - Google Patents

表面処理方法 Download PDF

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Publication number
JP5518281B2
JP5518281B2 JP2006519696A JP2006519696A JP5518281B2 JP 5518281 B2 JP5518281 B2 JP 5518281B2 JP 2006519696 A JP2006519696 A JP 2006519696A JP 2006519696 A JP2006519696 A JP 2006519696A JP 5518281 B2 JP5518281 B2 JP 5518281B2
Authority
JP
Japan
Prior art keywords
water
plasma
article
water vapor
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006519696A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2006104043A1 (ja
Inventor
理玄 上西
信福 野村
洋通 豊田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Ehime University NUC
Original Assignee
Mitsubishi Chemical Corp
Mitsubishi Rayon Co Ltd
Ehime University NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp, Mitsubishi Rayon Co Ltd, Ehime University NUC filed Critical Mitsubishi Chemical Corp
Priority to JP2006519696A priority Critical patent/JP5518281B2/ja
Publication of JPWO2006104043A1 publication Critical patent/JPWO2006104043A1/ja
Application granted granted Critical
Publication of JP5518281B2 publication Critical patent/JP5518281B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D65/00—Accessories or auxiliary operations, in general, for separation processes or apparatus using semi-permeable membranes
    • B01D65/02—Membrane cleaning or sterilisation ; Membrane regeneration
    • A—HUMAN NECESSITIES
    • A62—LIFE-SAVING; FIRE-FIGHTING
    • A62D—CHEMICAL MEANS FOR EXTINGUISHING FIRES OR FOR COMBATING OR PROTECTING AGAINST HARMFUL CHEMICAL AGENTS; CHEMICAL MATERIALS FOR USE IN BREATHING APPARATUS
    • A62D3/00—Processes for making harmful chemical substances harmless or less harmful, by effecting a chemical change in the substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D67/00—Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6502—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials
    • H10P14/6512—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials by exposure to a gas or vapour
    • H10P14/6514—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials by exposure to a gas or vapour by exposure to a plasma
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/18—Cleaning before device manufacture, i.e. Begin-Of-Line process by combined dry cleaning and wet cleaning
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00—Disinfection or sterilisation of materials or objects, in general; Accessories therefor
    • A61L2/02—Disinfection or sterilisation of materials or objects, in general; Accessories therefor using physical processes
    • A61L2/14—Plasma, i.e. ionised gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2321/00—Details relating to membrane cleaning, regeneration, sterilization or to the prevention of fouling
    • B01D2321/20—By influencing the flow
    • B01D2321/2066—Pulsated flow
    • B01D2321/2075—Ultrasonic treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Business, Economics & Management (AREA)
  • Emergency Management (AREA)
  • Materials Engineering (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Surface Treatment Of Glass (AREA)
  • Weting (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Fuel Cell (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2006519696A 2005-03-25 2006-03-24 表面処理方法 Expired - Fee Related JP5518281B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006519696A JP5518281B2 (ja) 2005-03-25 2006-03-24 表面処理方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005089631 2005-03-25
JP2005089631 2005-03-25
PCT/JP2006/305982 WO2006104043A1 (ja) 2005-03-25 2006-03-24 表面処理方法および表面処理された物品
JP2006519696A JP5518281B2 (ja) 2005-03-25 2006-03-24 表面処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012187000A Division JP5725304B2 (ja) 2005-03-25 2012-08-27 表面処理方法

Publications (2)

Publication Number Publication Date
JPWO2006104043A1 JPWO2006104043A1 (ja) 2008-09-04
JP5518281B2 true JP5518281B2 (ja) 2014-06-11

Family

ID=37053300

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2006519696A Expired - Fee Related JP5518281B2 (ja) 2005-03-25 2006-03-24 表面処理方法
JP2012187000A Expired - Fee Related JP5725304B2 (ja) 2005-03-25 2012-08-27 表面処理方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012187000A Expired - Fee Related JP5725304B2 (ja) 2005-03-25 2012-08-27 表面処理方法

Country Status (5)

Country Link
US (1) US20080210664A1 (https=)
JP (2) JP5518281B2 (https=)
KR (1) KR100938323B1 (https=)
TW (1) TWI405608B (https=)
WO (1) WO2006104043A1 (https=)

Families Citing this family (14)

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KR101825149B1 (ko) * 2010-03-03 2018-02-02 조지아 테크 리서치 코포레이션 무기 인터포저상의 패키지-관통-비아(tpv) 구조 및 그의 제조방법
US10369327B2 (en) * 2010-04-28 2019-08-06 Clph, Llc Catheters with lubricious linings and methods for making and using them
JP5696447B2 (ja) 2010-11-25 2015-04-08 Ｊｆｅスチール株式会社 表面処理金属材料の製造方法
JP5645163B2 (ja) * 2011-01-26 2014-12-24 国立大学法人大阪大学 フッ素系樹脂材料の表面改質方法及びフッ素系樹脂材料と金属材料の積層体
KR101405721B1 (ko) * 2011-04-29 2014-06-13 한국과학기술연구원 소수성이 개선된 기공체 및 그 제조 방법
KR101349075B1 (ko) * 2011-10-10 2014-01-16 한국과학기술연구원 물질전달성이 향상된 연료전지 및 그 제조 방법
US9809493B2 (en) * 2015-04-27 2017-11-07 Ford Global Technologies, Llc Surface treatment of glass bubbles
JP2019029333A (ja) * 2017-07-26 2019-02-21 東芝メモリ株式会社 プラズマ処理装置および半導体装置の製造方法
KR102148831B1 (ko) 2018-10-02 2020-08-27 삼성전기주식회사 코일 부품
KR102619877B1 (ko) * 2019-09-11 2024-01-03 삼성전자주식회사 기판 처리 장치
JP7427475B2 (ja) * 2020-02-28 2024-02-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP7399209B2 (ja) * 2022-04-05 2023-12-15 エルジー・ケム・リミテッド 処理装置、分解生成物の製造方法、及び処理方法
CN121889201A (zh) * 2023-09-29 2026-04-17 大金工业株式会社 空气过滤器滤材、空气过滤器滤材的使用方法以及空气处理装置
CN118952032B (zh) * 2024-09-20 2025-05-30 彤程电子材料(常州)有限公司 一种复合抛光垫及其制备方法和应用

Citations (2)

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JP2001058184A (ja) * 1999-08-24 2001-03-06 Mitsubishi Heavy Ind Ltd 有害物処理方法および有害物処理装置
JP2005529455A (ja) * 2002-05-08 2005-09-29 マン トーマス チャン チャック 流体中で作られるプラズマ

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JP2005529455A (ja) * 2002-05-08 2005-09-29 マン トーマス チャン チャック 流体中で作られるプラズマ

Also Published As

Publication number Publication date
TW200637648A (en) 2006-11-01
WO2006104043A1 (ja) 2006-10-05
KR100938323B1 (ko) 2010-01-22
KR20070113313A (ko) 2007-11-28
JPWO2006104043A1 (ja) 2008-09-04
TWI405608B (zh) 2013-08-21
US20080210664A1 (en) 2008-09-04
JP5725304B2 (ja) 2015-05-27
JP2013031842A (ja) 2013-02-14

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