JP5475772B2 - ワイヤスライシングシステム - Google Patents

ワイヤスライシングシステム Download PDF

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Publication number
JP5475772B2
JP5475772B2 JP2011517614A JP2011517614A JP5475772B2 JP 5475772 B2 JP5475772 B2 JP 5475772B2 JP 2011517614 A JP2011517614 A JP 2011517614A JP 2011517614 A JP2011517614 A JP 2011517614A JP 5475772 B2 JP5475772 B2 JP 5475772B2
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Japan
Prior art keywords
wire
slicing
roller
assembly
workpiece
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2011517614A
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English (en)
Japanese (ja)
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JP2011527644A5 (enExample
JP2011527644A (ja
Inventor
ルーカス・エー・グリンスキー
デーヴィッド・グラハム
エドワード・エル・ランバート
クリシュナムールシー・スブラマニアン
Original Assignee
サンーゴバン アブレイシブズ，インコーポレイティド
サン−ゴバン アブラジフ
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Publication of JP2011527644A publication Critical patent/JP2011527644A/ja
Publication of JP2011527644A5 publication Critical patent/JP2011527644A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/30—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor to form contours, i.e. curved surfaces, irrespective of the method of working used
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9292—Wire tool

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2011517614A 2008-07-11 2009-07-09 ワイヤスライシングシステム Expired - Fee Related JP5475772B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7992808P 2008-07-11 2008-07-11
US61/079,928 2008-07-11
PCT/US2009/050075 WO2010006148A2 (en) 2008-07-11 2009-07-09 Wire slicing system

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014021528A Division JP2014121784A (ja) 2008-07-11 2014-02-06 ワークピースのワイヤスライシング方法、及び当該方法で製造されたワークピース

Publications (3)

Publication Number Publication Date
JP2011527644A JP2011527644A (ja) 2011-11-04
JP2011527644A5 JP2011527644A5 (enExample) 2013-07-25
JP5475772B2 true JP5475772B2 (ja) 2014-04-16

Family

ID=41503996

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011517614A Expired - Fee Related JP5475772B2 (ja) 2008-07-11 2009-07-09 ワイヤスライシングシステム
JP2014021528A Ceased JP2014121784A (ja) 2008-07-11 2014-02-06 ワークピースのワイヤスライシング方法、及び当該方法で製造されたワークピース

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014021528A Ceased JP2014121784A (ja) 2008-07-11 2014-02-06 ワークピースのワイヤスライシング方法、及び当該方法で製造されたワークピース

Country Status (5)

Country Link
US (1) US20100006082A1 (enExample)
EP (1) EP2313233A2 (enExample)
JP (2) JP5475772B2 (enExample)
CN (1) CN102137735A (enExample)
WO (1) WO2010006148A2 (enExample)

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JP5217918B2 (ja) * 2008-11-07 2013-06-19 信越半導体株式会社 インゴット切断装置及び切断方法
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CN102229215A (zh) * 2011-05-23 2011-11-02 运城恒磁科技有限公司 一种安装于多线切割机的y轴方向滑动平台
CN102225527B (zh) * 2011-05-23 2012-11-14 中磁科技股份有限公司 一种切割曲面的多线切割机及其控制方法
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WO2012165108A1 (ja) * 2011-06-02 2012-12-06 住友電気工業株式会社 炭化珪素基板の製造方法
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JP6778509B2 (ja) * 2016-05-18 2020-11-04 株式会社共立合金製作所 ワイヤーソー装置及びこの装置を用いた粉末成形体の切り出し方法
CN105946127B (zh) * 2016-05-23 2019-03-08 天通日进精密技术有限公司 单段式硅棒截断机及其截断方法
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CN221136468U (zh) * 2022-11-19 2024-06-14 青岛高测科技股份有限公司 活动组件、线锯单元、线切割机
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CN119666652A (zh) * 2024-12-12 2025-03-21 晶科能源股份有限公司 测试装置以及测试方法

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US20100006082A1 (en) 2010-01-14
EP2313233A2 (en) 2011-04-27
WO2010006148A2 (en) 2010-01-14
JP2011527644A (ja) 2011-11-04
JP2014121784A (ja) 2014-07-03
WO2010006148A3 (en) 2010-05-20
CN102137735A (zh) 2011-07-27

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