JP5475124B2 - プラズマ処理装置 - Google Patents
プラズマ処理装置 Download PDFInfo
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- JP5475124B2 JP5475124B2 JP2012517141A JP2012517141A JP5475124B2 JP 5475124 B2 JP5475124 B2 JP 5475124B2 JP 2012517141 A JP2012517141 A JP 2012517141A JP 2012517141 A JP2012517141 A JP 2012517141A JP 5475124 B2 JP5475124 B2 JP 5475124B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/22—Removing surface-material, e.g. by engraving, by etching
- B44C1/227—Removing surface-material, e.g. by engraving, by etching by etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Description
4及び図7)に設けられて検査光L1を下方に投光する投光器HS1と、投光器HS1の直下であって底板部4a上に設けられた受光器JS1とを備える。本実施の形態では、アライメント室4の天井部4bはアクリル板等の透明な部材から成っており、ノッチ検出センサ43は天井部4bの上面側に設けられて投光器HS1から投光される検査光L1は天井部4bを透過して下方に照射されるようになっている。しかし、ノッチ検出センサ43の投光器HS1は天井部4bの下面側に設けられていてもよい(2つのウエハ有無検出センサ44A,44Bについても同じ)。
転テーブル41によりトレイ7を回転させながらウエハ有無検出を行う。これにより、ウエハ有無の検出に要する時間を短縮してプラズマ処理装置1における処理作業時間を短縮させることができる。
2 ストック部
3 搬送室(搬送部)
4 アライメント室(アライメント部)
5 処理室(処理部)
6a アライメント処理部(回転方向位置決め部)
6b ウエハ有無判定部
7 トレイ
7a 収容孔
30 搬送機構
31 搬送アーム
41 回転テーブル
42 センタリング機構
43 ノッチ検出センサ(回転方向位置決め部)
44A,44B ウエハ有無検出センサ
51 サセプタ(支持台)
51a トレイ載置部
51b ウエハ
52 プラズマ処理部
81 移載部
82 移載室
83 移載ロボット
W ウエハ
L 検査光
Claims (9)
- 厚み方向に貫通する複数の収容孔それぞれにウエハを収容した搬送可能なトレイを供給及び回収するためのストック部と、
前記ストック部から供給される前記トレイに収容された前記ウエハに対してプラズマ処理を実行する処理部と、
前記プラズマ処理前の前記トレイが載置される回転テーブルと、
前記回転テーブルを回転させることにより前記回転テーブル上の前記トレイの回転方向の位置決めを行う回転方向位置決め部と、
前記回転テーブルに載置された前記トレイの各収容孔内に前記ウエハが存在するか否かの検出を行うウエハ有無検出部と、
前記トレイを前記ストック部から取り出して前記回転テーブル、前記処理部の順で搬送する搬送機構と
を備えたことを特徴とするプラズマ処理装置。 - 前記ウエハ有無検出部が前記回転テーブルに載置された前記トレイのいずれかの前記収容孔に前記収容されていないことを検出すると、前記搬送機構により前記回転テーブル上の前記トレイを前記処理部に搬送することなく前記ストック部に戻す搬送制御部をさらに備えることを特徴とする請求項1に記載のプラズマ処理装置。
- 前記ウエハ有無検出部は、
前記回転テーブル上の前記トレイの前記収容孔に収容された前記ウエハを検出するための光学式センサと、
前記光学式センサからの信号に基づいて、前記トレイが備える前記収容孔に前記ウエハが存在するか否かを判定する判定部とを備えたことを特徴とする、請求項1又は請求項2に記載のプラズマ処理装置。 - 前記光学式センサは、
前記トレイに向けて検査光を投光する投光器と、
前記トレイの前記収容孔に前記ウエハが収容されていれば前記検査光が遮られて受光されないが、前記トレイの前記収容孔に前記ウエハが収容されていなければ前記検査光が受光される位置に配置された受光器と
を備えたことを特徴とする、請求項3に記載のプラズマ処理装置。 - 前記ウエハ有無検出部は、
前記回転テーブル上の前記トレイの前記収容孔を上方から撮像する撮像部と、
前記撮像部により得られた画像に基づいて、前記トレイの前記収容孔に前記ウエハが存在するか否かを判定する判定部とを備えたことを特徴とする、請求項1又は請求項2に記載のプラズマ処理装置。 - 前記ウエハ有無検出部は、前記回転テーブルによる前記トレイの回転中に、前記トレイが備える各収容孔内に前記ウエハが存在するか否かの検出を行うことを特徴とする、請求項1から請求項5のいずれか1項に記載のプラズマ処理装置。
- 前記回転テーブルに対するトレイの中心位置合わせを行うセンタリング機構をさらに備えることを特徴とする、請求項6に記載のプラズマ処理装置。
- 前記ウエハ有無検出部が前記トレイのいずれかの前記収容孔に前記ウエハが収容されていないことを検出すると警報を発生する警報発生部をさらに備える、請求項1から請求項7のいずれか1項に記載のプラズマ処理装置。
- 厚み方向に貫通する複数の収容孔それぞれにウエハを収容したトレイを、ストック部から取り出して回転テーブルに載置し、
前記回転テーブルを回転させて前記回転テーブル上の前記トレイの回転方向の位置決めを行い、
前記回転テーブルに載置された前記トレイの各収容孔内に前記ウエハが存在するか否かの検出を行い、
前記回転テーブル上の前記トレイのすべての前記収容孔内に前記ウエハが存在していれば、前記トレイを前記回転テーブルから処理部に搬送して前記ウエハのプラズマ処理を実行し、
前記回転テーブル上の前記トレイのいずれかの前記収容孔に前記ウエハが存在していなければ前記プラズマ処理を実行しないことを特徴とする、プラズマ処理方法。
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JP2012517141A JP5475124B2 (ja) | 2010-05-27 | 2011-05-25 | プラズマ処理装置 |
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JP2010121094 | 2010-05-27 | ||
JP2010121094 | 2010-05-27 | ||
PCT/JP2011/002908 WO2011148629A1 (ja) | 2010-05-27 | 2011-05-25 | プラズマ処理装置 |
JP2012517141A JP5475124B2 (ja) | 2010-05-27 | 2011-05-25 | プラズマ処理装置 |
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JPWO2011148629A1 JPWO2011148629A1 (ja) | 2013-07-25 |
JP5475124B2 true JP5475124B2 (ja) | 2014-04-16 |
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US (1) | US20130068726A1 (ja) |
JP (1) | JP5475124B2 (ja) |
CN (1) | CN102918640B (ja) |
WO (1) | WO2011148629A1 (ja) |
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KR101686032B1 (ko) * | 2013-03-28 | 2016-12-13 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리 장치, 반도체 장치의 제조 방법 및 기록 매체 |
JP6114708B2 (ja) * | 2013-05-27 | 2017-04-12 | 東京エレクトロン株式会社 | 基板脱離検出装置及び基板脱離検出方法、並びにこれらを用いた基板処理装置及び基板処理方法 |
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CN112490149B (zh) * | 2020-11-13 | 2024-04-12 | 北京北方华创微电子装备有限公司 | 半导体工艺设备、检测工艺腔室中是否存在晶圆的方法 |
JP7389076B2 (ja) | 2021-03-22 | 2023-11-29 | 大陽日酸株式会社 | 基板搬送機構及びこれを用いた基板搬送方法 |
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WO2011148629A1 (ja) | 2011-12-01 |
CN102918640A (zh) | 2013-02-06 |
CN102918640B (zh) | 2015-11-25 |
JPWO2011148629A1 (ja) | 2013-07-25 |
US20130068726A1 (en) | 2013-03-21 |
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