JP5466007B2 - プローブカードアセンブリ - Google Patents

プローブカードアセンブリ Download PDF

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Publication number
JP5466007B2
JP5466007B2 JP2009533469A JP2009533469A JP5466007B2 JP 5466007 B2 JP5466007 B2 JP 5466007B2 JP 2009533469 A JP2009533469 A JP 2009533469A JP 2009533469 A JP2009533469 A JP 2009533469A JP 5466007 B2 JP5466007 B2 JP 5466007B2
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JP
Japan
Prior art keywords
column
probe
substrate
spring
terminal portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009533469A
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English (en)
Japanese (ja)
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JP2010507098A5 (enExample
JP2010507098A (ja
Inventor
ベンジャミン エヌ． エルドリッジ，
ジョン ケー． グリッターズ，
ロドニー アイ． マーテンス，
アレクサンダー エイチ． スロカム，
オニック ヤグリオグル，
Original Assignee
フォームファクター， インコーポレイテッド
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Publication of JP2010507098A5 publication Critical patent/JP2010507098A5/ja
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F1/00—Springs
    • F16F1/36—Springs made of rubber or other material having high internal friction, e.g. thermoplastic elastomers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mathematical Physics (AREA)
  • Mechanical Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Connecting Device With Holders (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2009533469A 2006-10-16 2007-10-15 プローブカードアセンブリ Expired - Fee Related JP5466007B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US82967406P 2006-10-16 2006-10-16
US60/829,674 2006-10-16
US93867307P 2007-05-17 2007-05-17
US60/938,673 2007-05-17
US11/872,008 2007-10-13
US11/872,008 US8130007B2 (en) 2006-10-16 2007-10-13 Probe card assembly with carbon nanotube probes having a spring mechanism therein
PCT/US2007/081423 WO2008048938A2 (en) 2006-10-16 2007-10-15 Making and using carbon nanotube probes

Publications (3)

Publication Number Publication Date
JP2010507098A JP2010507098A (ja) 2010-03-04
JP2010507098A5 JP2010507098A5 (enExample) 2010-12-16
JP5466007B2 true JP5466007B2 (ja) 2014-04-09

Family

ID=39314777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009533469A Expired - Fee Related JP5466007B2 (ja) 2006-10-16 2007-10-15 プローブカードアセンブリ

Country Status (6)

Country Link
US (1) US8130007B2 (enExample)
EP (1) EP2084424A2 (enExample)
JP (1) JP5466007B2 (enExample)
KR (1) KR101406270B1 (enExample)
TW (1) TWI433200B (enExample)
WO (1) WO2008048938A2 (enExample)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8466703B2 (en) * 2003-03-14 2013-06-18 Rudolph Technologies, Inc. Probe card analysis system and method
US7439731B2 (en) * 2005-06-24 2008-10-21 Crafts Douglas E Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
US9181639B2 (en) 2006-05-19 2015-11-10 Massachusetts Institute Of Technology Continuous process for the production of nanostructures including nanotubes
US8337979B2 (en) 2006-05-19 2012-12-25 Massachusetts Institute Of Technology Nanostructure-reinforced composite articles and methods
US7731503B2 (en) * 2006-08-21 2010-06-08 Formfactor, Inc. Carbon nanotube contact structures
US8354855B2 (en) * 2006-10-16 2013-01-15 Formfactor, Inc. Carbon nanotube columns and methods of making and using carbon nanotube columns as probes
US8149007B2 (en) * 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components
WO2010037097A1 (en) 2008-09-29 2010-04-01 Wentworth Laboratories, Inc. Probe cards including nanotube probes and methods of fabricating
US8167640B2 (en) * 2009-03-19 2012-05-01 Bioness Inc. Flexible connector for implantable electrical stimulation lead
US8272124B2 (en) * 2009-04-03 2012-09-25 Formfactor, Inc. Anchoring carbon nanotube columns
US20100252317A1 (en) * 2009-04-03 2010-10-07 Formfactor, Inc. Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
FR2944805B1 (fr) * 2009-04-22 2018-04-06 Institut Bergognie Signature moleculaire pronostique des sarcomes et utilisations
JP5465516B2 (ja) * 2009-12-08 2014-04-09 日本電子材料株式会社 プローブ及びプローブの製造方法
TWI534432B (zh) * 2010-09-07 2016-05-21 瓊斯科技國際公司 用於微電路測試器之電氣傳導針腳
US8872176B2 (en) 2010-10-06 2014-10-28 Formfactor, Inc. Elastic encapsulated carbon nanotube based electrical contacts
TWI531527B (zh) * 2010-11-08 2016-05-01 鴻海精密工業股份有限公司 電連接器製造方法
US9267968B2 (en) * 2010-12-09 2016-02-23 Wentworth Laboratories, Inc. Probe card assemblies and probe pins including carbon nanotubes
JP5842349B2 (ja) * 2011-03-18 2016-01-13 富士通株式会社 シート状構造体、シート状構造体の製造方法、電子機器及び電子機器の製造方法
JP2012225865A (ja) * 2011-04-22 2012-11-15 Shinshu Univ プローブ針の製造方法、プローブ針およびプローブ装置
KR101229233B1 (ko) 2011-08-17 2013-02-04 (주)기가레인 프로브카드
KR101280419B1 (ko) 2011-08-17 2013-06-28 (주)기가레인 프로브카드
CN103718290A (zh) 2011-09-26 2014-04-09 富士通株式会社 散热材料及其制造方法以及电子设备及其制造方法
CN103824827B (zh) * 2012-11-16 2017-02-08 台达电子企业管理（上海）有限公司 封装模块、封装终端及其制造方法
US10266402B2 (en) 2012-11-20 2019-04-23 Formfactor, Inc. Contactor devices with carbon nanotube probes embedded in a flexible film and processes of making such
US9494618B2 (en) * 2012-12-26 2016-11-15 Translarity, Inc. Designed asperity contactors, including nanospikes, for semiconductor test using a package, and associated systems and methods
JP6373284B2 (ja) 2013-02-28 2018-08-15 エヌ１２ テクノロジーズ， インク．Ｎ１２ Ｔｅｃｈｎｏｌｏｇｉｅｓ， Ｉｎｃ． ナノ構造フィルムのカートリッジベース払い出し
US9832887B2 (en) * 2013-08-07 2017-11-28 Invensas Corporation Micro mechanical anchor for 3D architecture
JP6301680B2 (ja) * 2014-02-25 2018-03-28 エイブリック株式会社 弾性プローブ
CN104952989B (zh) * 2014-03-26 2018-02-27 清华大学 外延结构
US10732201B2 (en) * 2014-04-13 2020-08-04 Infineon Technologies Ag Test probe and method of manufacturing a test probe
CN107709232A (zh) * 2015-06-12 2018-02-16 琳得科株式会社 碳纳米管林层压体以及产生碳纳米管林层压体的方法
DE102015015452A1 (de) * 2015-12-02 2017-06-08 Forschungszentrum Jülich GmbH Verfahren zum Planarisieren von Nanostrukturen
CN109311239A (zh) 2016-05-31 2019-02-05 麻省理工学院 包括非线性细长纳米结构的复合制品以及相关的方法
CN109070542B (zh) 2016-06-10 2021-03-09 琳得科美国股份有限公司 纳米纤维片材
KR101839949B1 (ko) * 2016-10-14 2018-03-19 부경대학교 산학협력단 반도체 소자 테스트용 소켓의 제조 방법
EP3585605A4 (en) 2017-02-24 2020-12-09 Lintec Of America, Inc. NANOFIBER THERMAL CONDUCTING MATERIAL
JP2019035698A (ja) * 2017-08-18 2019-03-07 日本電産リード株式会社 プローブ構造体、及びプローブ構造体の製造方法
EP4516846A3 (en) 2017-09-15 2025-12-24 Massachusetts Institute of Technology Low-defect fabrication of composite materials
JP2019066245A (ja) * 2017-09-29 2019-04-25 日本電産リード株式会社 接触端子、接触端子を備えた検査治具、及び接触端子の製造方法
WO2019108616A1 (en) 2017-11-28 2019-06-06 Massachusetts Institute Of Technology Separators comprising elongated nanostructures and associated devices and methods for energy storage and/or use
US20200194341A1 (en) * 2018-12-18 2020-06-18 Tien-Chien Cheng Semiconductor Package and Fabricating Method thereof
US11579171B1 (en) * 2019-02-15 2023-02-14 Meta Platforms Technologies, Llc Probe card for characterizing processes of submicron semiconductor device fabrication
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
WO2025029297A1 (en) * 2023-08-03 2025-02-06 Microfabrica Inc. Probes with modulating mechanical properties by using nano-fibers, corresponding probe arrays and methods of forming probe arrays

Family Cites Families (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829128A (en) 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5366380A (en) 1989-06-13 1994-11-22 General Datacomm, Inc. Spring biased tapered contact elements for electrical connectors and integrated circuit packages
US6714625B1 (en) 1992-04-08 2004-03-30 Elm Technology Corporation Lithography device for semiconductor circuit pattern generation
US6184053B1 (en) 1993-11-16 2001-02-06 Formfactor, Inc. Method of making microelectronic spring contact elements
US5903161A (en) 1995-01-26 1999-05-11 Denki Kagaku Kogyo Kabushiki Kaisha Electrically conductive rod-shaped single crystal product and assembly for measuring electrical properties employing such product, as well as processes for their production
TW267265B (en) 1995-06-12 1996-01-01 Connector Systems Tech Nv Low cross talk and impedance controlled electrical connector
CA2254911C (en) 1996-05-15 2006-07-25 Hyperion Catalysis International, Inc. Graphitic nanofibers in electrochemical capacitors
JP2000516708A (ja) * 1996-08-08 2000-12-12 ウィリアム・マーシュ・ライス・ユニバーシティ ナノチューブ組立体から作製された巨視的操作可能なナノ規模の装置
JP3740295B2 (ja) 1997-10-30 2006-02-01 キヤノン株式会社 カーボンナノチューブデバイス、その製造方法及び電子放出素子
US6020747A (en) 1998-01-26 2000-02-01 Bahns; John T. Electrical contact probe
JP2002518280A (ja) 1998-06-19 2002-06-25 ザ・リサーチ・ファウンデーション・オブ・ステイト・ユニバーシティ・オブ・ニューヨーク 整列した自立炭素ナノチューブおよびその合成
US6346189B1 (en) 1998-08-14 2002-02-12 The Board Of Trustees Of The Leland Stanford Junior University Carbon nanotube structures made using catalyst islands
US6597090B1 (en) 1998-09-28 2003-07-22 Xidex Corporation Method for manufacturing carbon nanotubes as functional elements of MEMS devices
US6232706B1 (en) 1998-11-12 2001-05-15 The Board Of Trustees Of The Leland Stanford Junior University Self-oriented bundles of carbon nanotubes and method of making same
EP1054249B1 (en) 1998-12-03 2007-03-07 Daiken Chemical Co. Ltd. Electronic device surface signal control probe and method of manufacturing the probe
US7349223B2 (en) 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US6799976B1 (en) 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
WO2001098793A2 (en) 2000-06-20 2001-12-27 Nanonexus, Inc. Systems for testing integraged circuits during burn-in
AUPQ065099A0 (en) 1999-05-28 1999-06-24 Commonwealth Scientific And Industrial Research Organisation Substrate-supported aligned carbon nanotube films
US6400173B1 (en) 1999-11-19 2002-06-04 Hitachi, Ltd. Test system and manufacturing of semiconductor device
US6401526B1 (en) 1999-12-10 2002-06-11 The Board Of Trustees Of The Leland Stanford Junior University Carbon nanotubes and methods of fabrication thereof using a liquid phase catalyst precursor
DE10006964C2 (de) 2000-02-16 2002-01-31 Infineon Technologies Ag Elektronisches Bauelement mit einer leitenden Verbindung zwischen zwei leitenden Schichten und Verfahren zum Herstellen eines elektronischen Bauelements
WO2001087193A1 (en) 2000-05-16 2001-11-22 Rensselaer Polytechnic Institute Electrically conducting nanocomposite materials for biomedical applications
US6709566B2 (en) 2000-07-25 2004-03-23 The Regents Of The University Of California Method for shaping a nanotube and a nanotube shaped thereby
US6379982B1 (en) 2000-08-17 2002-04-30 Micron Technology, Inc. Wafer on wafer packaging and method of fabrication for full-wafer burn-in and testing
US7258901B1 (en) 2000-09-08 2007-08-21 Fei Company Directed growth of nanotubes on a catalyst
US6457350B1 (en) 2000-09-08 2002-10-01 Fei Company Carbon nanotube probe tip grown on a small probe
JP2002179418A (ja) 2000-12-13 2002-06-26 Tohoku Techno Arch Co Ltd カーボン・ナノチューブ作成方法
JP3912583B2 (ja) 2001-03-14 2007-05-09 三菱瓦斯化学株式会社 配向性カーボンナノチューブ膜の製造方法
US6890506B1 (en) 2001-04-12 2005-05-10 Penn State Research Foundation Method of forming carbon fibers
US7160531B1 (en) 2001-05-08 2007-01-09 University Of Kentucky Research Foundation Process for the continuous production of aligned carbon nanotubes
DE10132787A1 (de) 2001-07-06 2003-01-30 Infineon Technologies Ag Katalysatormaterial, Kohlenstoffnanoröhren-Anordnung und Verfahren zum Herstellen einer Kohlenstoffnanoröhren-Anordnung
JP3768937B2 (ja) 2001-09-10 2006-04-19 キヤノン株式会社 電子放出素子、電子源及び画像表示装置の製造方法
AU2002357037A1 (en) 2001-11-30 2003-06-17 The Trustees Of Boston College Coated carbon nanotube array electrodes
TW200301360A (en) * 2001-12-03 2003-07-01 Advantest Corp Contact structure and production method thereof and probe contact assembly using same
EP1341184B1 (en) 2002-02-09 2005-09-14 Samsung Electronics Co., Ltd. Memory device utilizing carbon nanotubes and method of fabricating the memory device
JP2005517537A (ja) 2002-02-11 2005-06-16 レンセラー・ポリテクニック・インスティチュート 高度に組織化されたカーボン・ナノチューブ構造の指向性アセンブリ
US6919730B2 (en) 2002-03-18 2005-07-19 Honeywell International, Inc. Carbon nanotube sensor
JP3860057B2 (ja) * 2002-03-20 2006-12-20 アンリツ株式会社 電気接点装置及び接触子
JP4051988B2 (ja) 2002-04-09 2008-02-27 富士ゼロックス株式会社 光電変換素子および光電変換装置
US20040208788A1 (en) 2003-04-15 2004-10-21 Colton Jonathan S. Polymer micro-cantilevers and their methods of manufacture
US6869671B1 (en) 2002-06-03 2005-03-22 University Of Notre Dame Enabling nanostructured materials via multilayer thin film precursor and applications to biosensors
US6626684B1 (en) 2002-06-24 2003-09-30 Hewlett-Packard Development Company, L.P. Nanotube socket system and method
US6963077B2 (en) 2002-07-25 2005-11-08 California Institute Of Technology Sublithographic nanoscale memory architecture
JP2005534515A (ja) 2002-08-01 2005-11-17 ステイト オブ オレゴン アクティング バイ アンド スルー ザ ステイト ボード オブ ハイヤー エデュケーション オン ビハーフ オブ ポートランド ステイト ユニバーシティー ナノスケール構造物を所定位置に合成する方法
EP1540378A4 (en) 2002-09-20 2008-09-10 Trustees Of Boston College Low NANOTUBE PROBES IN DOOR-A-FALSE FOR MAGNETIC MICROSCOPY WITH NANOMETRIC SCALE
JP3933035B2 (ja) 2002-11-06 2007-06-20 富士ゼロックス株式会社 カーボンナノチューブの製造装置および製造方法
AU2003291061A1 (en) 2002-11-18 2004-06-15 Rensselaer Polytechnic Institute Nanotube polymer composite and methods of making same
TWI220162B (en) 2002-11-29 2004-08-11 Ind Tech Res Inst Integrated compound nano probe card and method of making same
US6870361B2 (en) 2002-12-21 2005-03-22 Agilent Technologies, Inc. System with nano-scale conductor and nano-opening
US6945827B2 (en) 2002-12-23 2005-09-20 Formfactor, Inc. Microelectronic contact structure
US6933222B2 (en) 2003-01-02 2005-08-23 Intel Corporation Microcircuit fabrication and interconnection
WO2004102582A1 (en) 2003-03-05 2004-11-25 University Of Florida Carbon nanotube-based probes, related devices and methods of forming the same
US7641863B2 (en) 2003-03-06 2010-01-05 Ut-Battelle Llc Nanoengineered membranes for controlled transport
JP4065801B2 (ja) 2003-03-20 2008-03-26 株式会社日立製作所 ナノピラーセンサ
US7082683B2 (en) 2003-04-24 2006-08-01 Korea Institute Of Machinery & Materials Method for attaching rod-shaped nano structure to probe holder
TWI220163B (en) 2003-04-24 2004-08-11 Ind Tech Res Inst Manufacturing method of high-conductivity nanometer thin-film probe card
US7531267B2 (en) 2003-06-02 2009-05-12 Kh Chemicals Co., Ltd. Process for preparing carbon nanotube electrode comprising sulfur or metal nanoparticles as a binder
US20050019245A1 (en) 2003-07-21 2005-01-27 Dmitri Koulikov Continuous production of carbon nanotubes and fullerenes
US7109732B2 (en) 2003-07-31 2006-09-19 Endicott Interconnect Technologies, Inc. Electronic component test apparatus
GB0318987D0 (en) 2003-08-13 2003-09-17 Univ Warwick Probe
JP2005083857A (ja) 2003-09-08 2005-03-31 Yoshikazu Nakayama ナノチューブプローブ及び製造方法
US20050116214A1 (en) 2003-10-31 2005-06-02 Mammana Victor P. Back-gated field emission electron source
TW200517042A (en) 2003-11-04 2005-05-16 Hon Hai Prec Ind Co Ltd Heat sink
US7473411B2 (en) 2003-12-12 2009-01-06 Rensselaer Polytechnic Institute Carbon nanotube foam and method of making and using thereof
DE602004013641D1 (de) 2004-03-02 2008-06-19 Eth Zuerich Kraftsensor
US7250188B2 (en) 2004-03-31 2007-07-31 Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of National Defense Of Her Majesty's Canadian Government Depositing metal particles on carbon nanotubes
US20050233263A1 (en) 2004-04-20 2005-10-20 Applied Materials, Inc. Growth of carbon nanotubes at low temperature
US7251884B2 (en) 2004-04-26 2007-08-07 Formfactor, Inc. Method to build robust mechanical structures on substrate surfaces
US20050285116A1 (en) 2004-06-29 2005-12-29 Yongqian Wang Electronic assembly with carbon nanotube contact formations or interconnections
KR20070083499A (ko) 2004-07-21 2007-08-24 에스브이 프로브 피티이 엘티디 반도체 장치 테스트용 보강 프로브
JP4167212B2 (ja) 2004-10-05 2008-10-15 富士通株式会社 カーボンナノチューブ構造体、半導体装置、および半導体パッケージ
JP2006125846A (ja) 2004-10-26 2006-05-18 Olympus Corp カンチレバー
JP2006177759A (ja) * 2004-12-22 2006-07-06 Namiki Precision Jewel Co Ltd カーボンナノチューブの先端加工
CN100501413C (zh) 2005-01-22 2009-06-17 鸿富锦精密工业（深圳）有限公司 集成电路检测装置及其制备方法
US20060188721A1 (en) 2005-02-22 2006-08-24 Eastman Kodak Company Adhesive transfer method of carbon nanotube layer
US20060198956A1 (en) 2005-03-04 2006-09-07 Gyula Eres Chemical vapor deposition of long vertically aligned dense carbon nanotube arrays by external control of catalyst composition
US7439731B2 (en) 2005-06-24 2008-10-21 Crafts Douglas E Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
US7538040B2 (en) 2005-06-30 2009-05-26 Nantero, Inc. Techniques for precision pattern transfer of carbon nanotubes from photo mask to wafers
US7777291B2 (en) 2005-08-26 2010-08-17 Smoltek Ab Integrated circuits having interconnects and heat dissipators based on nanostructures
DE102006039651A1 (de) 2005-08-31 2007-03-22 Hitachi Kenki Finetech Co., Ltd. Cantilever und Prüfvorrichtung
WO2007033188A2 (en) 2005-09-12 2007-03-22 University Of Dayton Substrate-enhanced electroless deposition (seed) of metal nanoparticles on carbon nanotubes
CN1964028B (zh) 2005-11-11 2010-08-18 鸿富锦精密工业（深圳）有限公司 散热器
US7727624B2 (en) 2005-11-22 2010-06-01 Rensselaer Polytechnic Institute Super-compressible carbon nanotube films and micro-bundles
US7625817B2 (en) 2005-12-30 2009-12-01 Intel Corporation Method of fabricating a carbon nanotube interconnect structures
US20070158768A1 (en) 2006-01-06 2007-07-12 Honeywell International, Inc. Electrical contacts formed of carbon nanotubes
KR101159074B1 (ko) 2006-01-14 2012-06-25 삼성전자주식회사 도전성 탄소나노튜브 팁, 이를 구비한 스캐닝 프로브마이크로스코프의 탐침 및 상기 도전성 탄소나노튜브 팁의제조 방법
JP4806762B2 (ja) 2006-03-03 2011-11-02 国立大学法人 名古屋工業大学 Ｓｐｍカンチレバー
US20070235713A1 (en) 2006-04-03 2007-10-11 Motorola, Inc. Semiconductor device having carbon nanotube interconnects and method of fabrication
EP1845124A1 (en) 2006-04-14 2007-10-17 Arkema France Conductive carbon nanotube-polymer composite
US7687981B2 (en) 2006-05-05 2010-03-30 Brother International Corporation Method for controlled density growth of carbon nanotubes
US7731503B2 (en) 2006-08-21 2010-06-08 Formfactor, Inc. Carbon nanotube contact structures
TWI360182B (en) 2007-10-05 2012-03-11 Ind Tech Res Inst Method for making a conductive film
US8149007B2 (en) 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components

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WO2008048938A3 (en) 2008-09-12
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