JP5465942B2 - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

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Publication number
JP5465942B2
JP5465942B2 JP2009167716A JP2009167716A JP5465942B2 JP 5465942 B2 JP5465942 B2 JP 5465942B2 JP 2009167716 A JP2009167716 A JP 2009167716A JP 2009167716 A JP2009167716 A JP 2009167716A JP 5465942 B2 JP5465942 B2 JP 5465942B2
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JP
Japan
Prior art keywords
chip
solder
semiconductor chip
electrode
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009167716A
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English (en)
Japanese (ja)
Other versions
JP2011023574A5 (enExample
JP2011023574A (ja
Inventor
英恵 秦
真人 中村
順弘 木下
順平 紺野
智子 依田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2009167716A priority Critical patent/JP5465942B2/ja
Priority to TW099116411A priority patent/TWI414049B/zh
Priority to CN201410264924.2A priority patent/CN104022092A/zh
Priority to CN2010102060615A priority patent/CN101958298A/zh
Priority to US12/814,472 priority patent/US8633103B2/en
Publication of JP2011023574A publication Critical patent/JP2011023574A/ja
Publication of JP2011023574A5 publication Critical patent/JP2011023574A5/ja
Application granted granted Critical
Publication of JP5465942B2 publication Critical patent/JP5465942B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01257—Changing the shapes of bumps by reflowing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07255—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H10W72/2528—Intermetallic compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

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  • Wire Bonding (AREA)
JP2009167716A 2009-07-16 2009-07-16 半導体装置およびその製造方法 Expired - Fee Related JP5465942B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009167716A JP5465942B2 (ja) 2009-07-16 2009-07-16 半導体装置およびその製造方法
TW099116411A TWI414049B (zh) 2009-07-16 2010-05-21 半導體裝置之製造方法
CN201410264924.2A CN104022092A (zh) 2009-07-16 2010-06-13 半导体器件的制造方法
CN2010102060615A CN101958298A (zh) 2009-07-16 2010-06-13 半导体器件及其制造方法
US12/814,472 US8633103B2 (en) 2009-07-16 2010-06-13 Semiconductor device and manufacturing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009167716A JP5465942B2 (ja) 2009-07-16 2009-07-16 半導体装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2011023574A JP2011023574A (ja) 2011-02-03
JP2011023574A5 JP2011023574A5 (enExample) 2012-07-26
JP5465942B2 true JP5465942B2 (ja) 2014-04-09

Family

ID=43464697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009167716A Expired - Fee Related JP5465942B2 (ja) 2009-07-16 2009-07-16 半導体装置およびその製造方法

Country Status (4)

Country Link
US (1) US8633103B2 (enExample)
JP (1) JP5465942B2 (enExample)
CN (2) CN101958298A (enExample)
TW (1) TWI414049B (enExample)

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US8810035B2 (en) * 2010-10-22 2014-08-19 Panasonic Corporation Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body
US9324905B2 (en) * 2011-03-15 2016-04-26 Micron Technology, Inc. Solid state optoelectronic device with preformed metal support substrate
JP5613100B2 (ja) * 2011-04-21 2014-10-22 パナソニック株式会社 半導体装置の製造方法
KR101574911B1 (ko) 2011-09-16 2015-12-04 파나소닉 주식회사 실장 구조 및 그 제조 방법
US8497579B1 (en) * 2012-02-16 2013-07-30 Chipbond Technology Corporation Semiconductor packaging method and structure thereof
CN102637747A (zh) * 2012-04-05 2012-08-15 祁门县硅鼎电子元件厂 镀涂环保材料的双铜质电极整流管芯片及镀涂工艺
DE102013103081A1 (de) * 2013-03-26 2014-10-02 Osram Opto Semiconductors Gmbh Verfahren zum Verbinden von Fügepartnern und Anordnung von Fügepartnern
JP2015122445A (ja) * 2013-12-24 2015-07-02 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN104282582B (zh) * 2014-09-17 2017-02-01 中南大学 一种Ni‑P基板的封装方法
US10886250B2 (en) 2015-07-10 2021-01-05 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
TWI910033B (zh) 2016-10-27 2025-12-21 美商艾德亞半導體科技有限責任公司 用於低溫接合的結構和方法
JP6621068B2 (ja) * 2016-12-08 2019-12-18 パナソニックＩｐマネジメント株式会社 実装構造体
TW202618935A (zh) 2020-12-30 2026-05-01 美商艾德亞半導體接合科技有限公司 具有導電特徵的結構以及形成此結構的方法
KR20230058949A (ko) * 2021-10-25 2023-05-03 삼성전자주식회사 반도체 패키지 및 반도체 패키지의 제조 방법
US20240222139A1 (en) * 2022-12-29 2024-07-04 Intel Corporation Microelectronic package structures with solder joint assemblies having roughened bump structures
CN116313834B (zh) * 2023-05-24 2023-09-12 江西兆驰半导体有限公司 晶圆级封装方法及晶圆级封装结构

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Also Published As

Publication number Publication date
US8633103B2 (en) 2014-01-21
CN101958298A (zh) 2011-01-26
TW201104817A (en) 2011-02-01
TWI414049B (zh) 2013-11-01
CN104022092A (zh) 2014-09-03
US20110012263A1 (en) 2011-01-20
JP2011023574A (ja) 2011-02-03

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