JP5460322B2 - 熱硬化性樹脂組成物及びその硬化物 - Google Patents
熱硬化性樹脂組成物及びその硬化物 Download PDFInfo
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- JP5460322B2 JP5460322B2 JP2009529985A JP2009529985A JP5460322B2 JP 5460322 B2 JP5460322 B2 JP 5460322B2 JP 2009529985 A JP2009529985 A JP 2009529985A JP 2009529985 A JP2009529985 A JP 2009529985A JP 5460322 B2 JP5460322 B2 JP 5460322B2
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- epoxy resin
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
- C08G59/46—Amides together with other curing agents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D177/00—Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
- C09D177/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009529985A JP5460322B2 (ja) | 2007-08-27 | 2008-08-26 | 熱硬化性樹脂組成物及びその硬化物 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007219545 | 2007-08-27 | ||
| JP2007219545 | 2007-08-27 | ||
| PCT/JP2008/002306 WO2009028170A1 (fr) | 2007-08-27 | 2008-08-26 | Composition de résine thermodurcissable et produit durci de celle-ci |
| JP2009529985A JP5460322B2 (ja) | 2007-08-27 | 2008-08-26 | 熱硬化性樹脂組成物及びその硬化物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2009028170A1 JPWO2009028170A1 (ja) | 2010-11-25 |
| JP5460322B2 true JP5460322B2 (ja) | 2014-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2009529985A Expired - Fee Related JP5460322B2 (ja) | 2007-08-27 | 2008-08-26 | 熱硬化性樹脂組成物及びその硬化物 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5460322B2 (fr) |
| KR (1) | KR20100057777A (fr) |
| CN (1) | CN101784580A (fr) |
| TW (1) | TW200909519A (fr) |
| WO (1) | WO2009028170A1 (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101208373B (zh) | 2005-07-21 | 2010-12-01 | 日本化药株式会社 | 聚酰胺树脂，环氧树脂组合物及其固化物 |
| KR20120135217A (ko) * | 2010-03-15 | 2012-12-12 | 니폰 가야꾸 가부시끼가이샤 | 내열용 접착제 |
| JP5323780B2 (ja) * | 2010-07-28 | 2013-10-23 | ナン ヤ プラスティクス コーポレーション | 積層基板用低誘導電率樹脂ワニス組成物及びその製法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001106769A (ja) * | 1999-10-06 | 2001-04-17 | Nippon Kayaku Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| JP2007204598A (ja) * | 2006-02-01 | 2007-08-16 | Nippon Kayaku Co Ltd | 樹脂組成物およびその硬化物 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001049082A (ja) * | 1999-06-04 | 2001-02-20 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物、そのワニス、それを用いたフィルム状接着剤及びその硬化物 |
| JP4095381B2 (ja) * | 2002-09-03 | 2008-06-04 | 群栄化学工業株式会社 | 芳香族ポリアミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤 |
| TWI306867B (en) * | 2002-11-28 | 2009-03-01 | Nippon Kayaku Kk | Flame-retardant epoxy resin and its cured product |
| JP2004269615A (ja) * | 2003-03-06 | 2004-09-30 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物、及びその硬化物 |
| JP2008138191A (ja) * | 2006-11-07 | 2008-06-19 | Nippon Kayaku Co Ltd | ポリアミド樹脂ワニス、その硬化物、および物品。 |
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2008
- 2008-08-26 CN CN200880104396A patent/CN101784580A/zh active Pending
- 2008-08-26 KR KR1020107001369A patent/KR20100057777A/ko not_active Application Discontinuation
- 2008-08-26 TW TW097132481A patent/TW200909519A/zh unknown
- 2008-08-26 WO PCT/JP2008/002306 patent/WO2009028170A1/fr active Application Filing
- 2008-08-26 JP JP2009529985A patent/JP5460322B2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001106769A (ja) * | 1999-10-06 | 2001-04-17 | Nippon Kayaku Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| JP2007204598A (ja) * | 2006-02-01 | 2007-08-16 | Nippon Kayaku Co Ltd | 樹脂組成物およびその硬化物 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200909519A (en) | 2009-03-01 |
| JPWO2009028170A1 (ja) | 2010-11-25 |
| CN101784580A (zh) | 2010-07-21 |
| KR20100057777A (ko) | 2010-06-01 |
| WO2009028170A1 (fr) | 2009-03-05 |
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