JP5422138B2 - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

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Publication number
JP5422138B2
JP5422138B2 JP2008094894A JP2008094894A JP5422138B2 JP 5422138 B2 JP5422138 B2 JP 5422138B2 JP 2008094894 A JP2008094894 A JP 2008094894A JP 2008094894 A JP2008094894 A JP 2008094894A JP 5422138 B2 JP5422138 B2 JP 5422138B2
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JP
Japan
Prior art keywords
conductive film
film
insulating film
semiconductor device
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008094894A
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English (en)
Japanese (ja)
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JP2008277798A (ja
JP2008277798A5 (enExample
Inventor
舜平 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2008094894A priority Critical patent/JP5422138B2/ja
Publication of JP2008277798A publication Critical patent/JP2008277798A/ja
Publication of JP2008277798A5 publication Critical patent/JP2008277798A5/ja
Application granted granted Critical
Publication of JP5422138B2 publication Critical patent/JP5422138B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07775—Antenna details the antenna being on-chip
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07784—Antenna details the antenna being of the inductive type the inductive antenna consisting of a plurality of coils stacked on top of one another
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/5328—Conductive materials containing conductive organic materials or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Thin Film Transistor (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2008094894A 2007-04-06 2008-04-01 半導体装置の作製方法 Expired - Fee Related JP5422138B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008094894A JP5422138B2 (ja) 2007-04-06 2008-04-01 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007100062 2007-04-06
JP2007100062 2007-04-06
JP2008094894A JP5422138B2 (ja) 2007-04-06 2008-04-01 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2008277798A JP2008277798A (ja) 2008-11-13
JP2008277798A5 JP2008277798A5 (enExample) 2011-05-06
JP5422138B2 true JP5422138B2 (ja) 2014-02-19

Family

ID=39537436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008094894A Expired - Fee Related JP5422138B2 (ja) 2007-04-06 2008-04-01 半導体装置の作製方法

Country Status (3)

Country Link
US (1) US8353459B2 (enExample)
EP (1) EP1978472A3 (enExample)
JP (1) JP5422138B2 (enExample)

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USD645029S1 (en) * 2008-05-09 2011-09-13 Semiconductor Energy Laboratory Co., Ltd. Antenna
US20110073357A1 (en) * 2008-06-02 2011-03-31 Nxp B.V. Electronic device and method of manufacturing an electronic device
USD605642S1 (en) * 2008-09-10 2009-12-08 Semiconductor Energy Laboratory Co., Ltd. Contactless data carrier
US9016585B2 (en) 2008-11-25 2015-04-28 Thin Film Electronics Asa Printed antennas, methods of printing an antenna, and devices including the printed antenna
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US8164190B2 (en) * 2009-06-25 2012-04-24 International Business Machines Corporation Structure of power grid for semiconductor devices and method of making the same
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JP2012049338A (ja) * 2010-08-27 2012-03-08 Hitachi Ltd ヒータ配線付き半導体チップ
DE102013006624B3 (de) 2013-04-18 2014-05-28 Forschungszentrum Jülich GmbH Hochfrequenzleiter mit verbesserter Leitfähigkeit und Verfahren seiner Herstellung
JP6402017B2 (ja) 2013-12-26 2018-10-10 株式会社半導体エネルギー研究所 半導体装置
USD850424S1 (en) * 2016-12-14 2019-06-04 AQ Corporation Flexible PCB dual antenna module for use in smartphone
FR3073307B1 (fr) * 2017-11-08 2021-05-28 Oberthur Technologies Dispositif de securite tel qu'une carte a puce
US11437331B2 (en) * 2019-10-17 2022-09-06 Taiwan Semiconductor Manufacturing Co., Ltd. Chip structure and method for forming the same
USD896208S1 (en) * 2019-10-22 2020-09-15 Avery Dennison Retail Information Services, Llc Antenna
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US11303011B2 (en) 2019-11-27 2022-04-12 AQ Corporation Smartphone antenna in flexible PCB
JP6985477B1 (ja) * 2020-09-25 2021-12-22 アオイ電子株式会社 半導体装置および半導体装置の製造方法
KR20220169152A (ko) * 2021-06-18 2022-12-27 삼성전자주식회사 반도체 장치

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Also Published As

Publication number Publication date
EP1978472A3 (en) 2015-04-22
JP2008277798A (ja) 2008-11-13
US20080245880A1 (en) 2008-10-09
US8353459B2 (en) 2013-01-15
EP1978472A2 (en) 2008-10-08

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