JP5368977B2 - 電子部品の実装装置及び実装方法 - Google Patents

電子部品の実装装置及び実装方法 Download PDF

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Publication number
JP5368977B2
JP5368977B2 JP2009516214A JP2009516214A JP5368977B2 JP 5368977 B2 JP5368977 B2 JP 5368977B2 JP 2009516214 A JP2009516214 A JP 2009516214A JP 2009516214 A JP2009516214 A JP 2009516214A JP 5368977 B2 JP5368977 B2 JP 5368977B2
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JP
Japan
Prior art keywords
sheet
feeding
electronic component
motor
winding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2009516214A
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English (en)
Japanese (ja)
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JPWO2008146539A1 (ja
Inventor
睦 小木曽
和仁 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2009516214A priority Critical patent/JP5368977B2/ja
Publication of JPWO2008146539A1 publication Critical patent/JPWO2008146539A1/ja
Application granted granted Critical
Publication of JP5368977B2 publication Critical patent/JP5368977B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
JP2009516214A 2007-05-25 2008-04-07 電子部品の実装装置及び実装方法 Active JP5368977B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009516214A JP5368977B2 (ja) 2007-05-25 2008-04-07 電子部品の実装装置及び実装方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007139506 2007-05-25
JP2007139506 2007-05-25
PCT/JP2008/056897 WO2008146539A1 (ja) 2007-05-25 2008-04-07 電子部品の実装装置及び実装方法
JP2009516214A JP5368977B2 (ja) 2007-05-25 2008-04-07 電子部品の実装装置及び実装方法

Publications (2)

Publication Number Publication Date
JPWO2008146539A1 JPWO2008146539A1 (ja) 2010-08-19
JP5368977B2 true JP5368977B2 (ja) 2013-12-18

Family

ID=40074810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009516214A Active JP5368977B2 (ja) 2007-05-25 2008-04-07 電子部品の実装装置及び実装方法

Country Status (5)

Country Link
JP (1) JP5368977B2 (zh)
KR (1) KR101095189B1 (zh)
CN (1) CN101681856B (zh)
TW (1) TWI404179B (zh)
WO (1) WO2008146539A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI391574B (zh) * 2010-04-26 2013-04-01 Kuo Chung Wang Fixing device assembly method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06295940A (ja) * 1993-04-08 1994-10-21 Matsushita Electron Corp 半導体製造装置
JP2004289084A (ja) * 2003-03-25 2004-10-14 Matsushita Electric Ind Co Ltd 部品圧着装置および部品圧着方法
JP2006261343A (ja) * 2005-03-16 2006-09-28 Shibaura Mechatronics Corp 電子部品の本圧着装置及び本圧着方法
JP2007073897A (ja) * 2005-09-09 2007-03-22 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2157134Y (zh) * 1993-03-19 1994-02-23 张仁和 电子零件成型带包装装置
US5894982A (en) * 1995-09-29 1999-04-20 Kabushiki Kaisha Toshiba Connecting apparatus
US6926796B1 (en) * 1999-01-29 2005-08-09 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting method and device therefor
TW559963B (en) * 2001-06-08 2003-11-01 Shibaura Mechatronics Corp Pressuring apparatus of electronic device and its method
JP4133926B2 (ja) * 2004-05-26 2008-08-13 芝浦メカトロニクス株式会社 実装装置
JP4262168B2 (ja) * 2004-08-13 2009-05-13 芝浦メカトロニクス株式会社 実装装置
JP4664366B2 (ja) * 2005-08-24 2011-04-06 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06295940A (ja) * 1993-04-08 1994-10-21 Matsushita Electron Corp 半導体製造装置
JP2004289084A (ja) * 2003-03-25 2004-10-14 Matsushita Electric Ind Co Ltd 部品圧着装置および部品圧着方法
JP2006261343A (ja) * 2005-03-16 2006-09-28 Shibaura Mechatronics Corp 電子部品の本圧着装置及び本圧着方法
JP2007073897A (ja) * 2005-09-09 2007-03-22 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法

Also Published As

Publication number Publication date
WO2008146539A1 (ja) 2008-12-04
KR101095189B1 (ko) 2011-12-16
JPWO2008146539A1 (ja) 2010-08-19
TW200849528A (en) 2008-12-16
TWI404179B (zh) 2013-08-01
KR20090125215A (ko) 2009-12-03
CN101681856A (zh) 2010-03-24
CN101681856B (zh) 2011-05-04

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