WO2008146539A1 - 電子部品の実装装置及び実装方法 - Google Patents

電子部品の実装装置及び実装方法 Download PDF

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Publication number
WO2008146539A1
WO2008146539A1 PCT/JP2008/056897 JP2008056897W WO2008146539A1 WO 2008146539 A1 WO2008146539 A1 WO 2008146539A1 JP 2008056897 W JP2008056897 W JP 2008056897W WO 2008146539 A1 WO2008146539 A1 WO 2008146539A1
Authority
WO
WIPO (PCT)
Prior art keywords
sheet
pressure
take
supply
tcp
Prior art date
Application number
PCT/JP2008/056897
Other languages
English (en)
French (fr)
Inventor
Mutsumi Ogiso
Kazuhito Ikeda
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Priority to JP2009516214A priority Critical patent/JP5368977B2/ja
Priority to CN2008800173164A priority patent/CN101681856B/zh
Priority to KR1020097022570A priority patent/KR101095189B1/ko
Publication of WO2008146539A1 publication Critical patent/WO2008146539A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)

Abstract

基板のＴＣＰが圧着される部分の下面を支持するバックアップ部材６と、基板のバックアップ部材によって支持された部分の上面にＴＣＰ５を加圧して圧着する圧着ツール７と、シートが装着され繰り出しモータによって回転駆動されてシートを繰り出す繰り出し軸２３及び巻き取りモータによって回転駆動され繰り出し軸から繰り出されたシートを巻き取る巻き取り体２５を有し、装置本体に着脱可能に設けられ圧着ツールによってＴＣＰを基板に圧着するときにシートの繰り出し軸２３と巻き取り体２５との間に位置する部分をＴＣＰと圧着ツールとの間に介在させるカセット１２と、繰り出しモータを作動させてシートを繰り出し軸から所定量繰り出させてから巻き取りモータを作動させてシートの繰り出し軸から繰り出された分を巻き取らせる制御装置を具備する。
PCT/JP2008/056897 2007-05-25 2008-04-07 電子部品の実装装置及び実装方法 WO2008146539A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009516214A JP5368977B2 (ja) 2007-05-25 2008-04-07 電子部品の実装装置及び実装方法
CN2008800173164A CN101681856B (zh) 2007-05-25 2008-04-07 电子零件的安装装置以及安装方法
KR1020097022570A KR101095189B1 (ko) 2007-05-25 2008-04-07 전자 부품의 실장 장치 및 실장 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007139506 2007-05-25
JP2007-139506 2007-05-25

Publications (1)

Publication Number Publication Date
WO2008146539A1 true WO2008146539A1 (ja) 2008-12-04

Family

ID=40074810

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056897 WO2008146539A1 (ja) 2007-05-25 2008-04-07 電子部品の実装装置及び実装方法

Country Status (5)

Country Link
JP (1) JP5368977B2 (ja)
KR (1) KR101095189B1 (ja)
CN (1) CN101681856B (ja)
TW (1) TWI404179B (ja)
WO (1) WO2008146539A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI391574B (zh) * 2010-04-26 2013-04-01 Kuo Chung Wang Fixing device assembly method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06295940A (ja) * 1993-04-08 1994-10-21 Matsushita Electron Corp 半導体製造装置
JP2007073897A (ja) * 2005-09-09 2007-03-22 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2157134Y (zh) * 1993-03-19 1994-02-23 张仁和 电子零件成型带包装装置
US5894982A (en) * 1995-09-29 1999-04-20 Kabushiki Kaisha Toshiba Connecting apparatus
US6926796B1 (en) * 1999-01-29 2005-08-09 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting method and device therefor
TW559963B (en) * 2001-06-08 2003-11-01 Shibaura Mechatronics Corp Pressuring apparatus of electronic device and its method
JP3744503B2 (ja) * 2003-03-25 2006-02-15 松下電器産業株式会社 部品圧着装置および部品圧着方法
JP4133926B2 (ja) * 2004-05-26 2008-08-13 芝浦メカトロニクス株式会社 実装装置
JP4262168B2 (ja) * 2004-08-13 2009-05-13 芝浦メカトロニクス株式会社 実装装置
JP4272634B2 (ja) * 2005-03-16 2009-06-03 芝浦メカトロニクス株式会社 電子部品の本圧着装置
KR101014292B1 (ko) * 2005-08-24 2011-02-16 시바우라 메카트로닉스 가부시키가이샤 전자 부품의 실장 장치 및 실장 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06295940A (ja) * 1993-04-08 1994-10-21 Matsushita Electron Corp 半導体製造装置
JP2007073897A (ja) * 2005-09-09 2007-03-22 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法

Also Published As

Publication number Publication date
CN101681856B (zh) 2011-05-04
CN101681856A (zh) 2010-03-24
KR20090125215A (ko) 2009-12-03
JP5368977B2 (ja) 2013-12-18
KR101095189B1 (ko) 2011-12-16
JPWO2008146539A1 (ja) 2010-08-19
TWI404179B (zh) 2013-08-01
TW200849528A (en) 2008-12-16

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