WO2009051004A1 - 電子部品の実装装置及び実装方法 - Google Patents

電子部品の実装装置及び実装方法 Download PDF

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Publication number
WO2009051004A1
WO2009051004A1 PCT/JP2008/067755 JP2008067755W WO2009051004A1 WO 2009051004 A1 WO2009051004 A1 WO 2009051004A1 JP 2008067755 W JP2008067755 W JP 2008067755W WO 2009051004 A1 WO2009051004 A1 WO 2009051004A1
Authority
WO
WIPO (PCT)
Prior art keywords
tcp
cassette
substrate
mounting
driving source
Prior art date
Application number
PCT/JP2008/067755
Other languages
English (en)
French (fr)
Inventor
Takeshi Aoyama
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Priority to CN2008801121275A priority Critical patent/CN101828256B/zh
Priority to KR1020107010530A priority patent/KR101056100B1/ko
Publication of WO2009051004A1 publication Critical patent/WO2009051004A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Liquid Crystal (AREA)

Abstract

　搬送手段（２）のテーブル用Ｚ駆動源７によって上下方向に駆動され下降方向に駆動されたときにバックアップツール（１４）によって下面が支持された基板の側辺部に貼着されたＴＣＰを加圧加熱して実装する圧着ツール（１５）と、カセット用Ｚ駆動源（２３）によって上下方向に駆動され圧着ツールによってＴＣＰを実装するときに基板の側辺部の上面と圧着ツールとの間に介在するシートを有するカセット（２５）と、圧着ツールによってＴＣＰを基板に実装した後、Ｚ・θ駆動源によって圧着ツールを上昇させてから、カセット用Ｚ駆動源によってカセットを上昇させるとともに、Ｚ・θ駆動源によって基板をカセットよりも遅い速度で上昇させ、ＴＣＰの実装時に異方性導電部材のＴＣＰから露出した部分に貼着したシートを剥離させる制御装置を具備する。
PCT/JP2008/067755 2007-10-19 2008-09-30 電子部品の実装装置及び実装方法 WO2009051004A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008801121275A CN101828256B (zh) 2007-10-19 2008-09-30 电子部件的安装装置及安装方法
KR1020107010530A KR101056100B1 (ko) 2007-10-19 2008-09-30 전자 부품 실장 장치 및 실장 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-272990 2007-10-19
JP2007272990A JP5324769B2 (ja) 2007-10-19 2007-10-19 電子部品の実装装置及び実装方法

Publications (1)

Publication Number Publication Date
WO2009051004A1 true WO2009051004A1 (ja) 2009-04-23

Family

ID=40567277

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067755 WO2009051004A1 (ja) 2007-10-19 2008-09-30 電子部品の実装装置及び実装方法

Country Status (4)

Country Link
JP (1) JP5324769B2 (ja)
KR (1) KR101056100B1 (ja)
CN (1) CN101828256B (ja)
WO (1) WO2009051004A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102229053B (zh) * 2011-06-09 2014-04-09 苏州光宝康电子有限公司 一种lcd工作台
FR2990071B1 (fr) * 2012-04-27 2014-05-02 Labinal Procede de connexion de conducteurs d'une nappe souple de liaison equipotentielle, ainsi que outil de sertissage, connecteurs et harnais equipe de tels connecteurs
JP7182036B2 (ja) * 2018-06-28 2022-12-02 パナソニックＩｐマネジメント株式会社 部品圧着装置、シート設置ユニットおよびシート設置ユニットの取付け方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003209145A (ja) * 2002-01-17 2003-07-25 Matsushita Electric Ind Co Ltd 電子部品の熱圧着装置および熱圧着方法
JP2003234373A (ja) * 2002-02-06 2003-08-22 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法、接着材料の貼付装置及び貼付方法
JP2007165571A (ja) * 2005-12-14 2007-06-28 Matsushita Electric Ind Co Ltd 電子部品実装装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW559963B (en) * 2001-06-08 2003-11-01 Shibaura Mechatronics Corp Pressuring apparatus of electronic device and its method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003209145A (ja) * 2002-01-17 2003-07-25 Matsushita Electric Ind Co Ltd 電子部品の熱圧着装置および熱圧着方法
JP2003234373A (ja) * 2002-02-06 2003-08-22 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法、接着材料の貼付装置及び貼付方法
JP2007165571A (ja) * 2005-12-14 2007-06-28 Matsushita Electric Ind Co Ltd 電子部品実装装置

Also Published As

Publication number Publication date
JP5324769B2 (ja) 2013-10-23
CN101828256A (zh) 2010-09-08
CN101828256B (zh) 2012-06-20
KR20100077198A (ko) 2010-07-07
KR101056100B1 (ko) 2011-08-11
JP2009105092A (ja) 2009-05-14

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