WO2008120528A1 - 電子部品の実装装置 - Google Patents

電子部品の実装装置 Download PDF

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Publication number
WO2008120528A1
WO2008120528A1 PCT/JP2008/053992 JP2008053992W WO2008120528A1 WO 2008120528 A1 WO2008120528 A1 WO 2008120528A1 JP 2008053992 W JP2008053992 W JP 2008053992W WO 2008120528 A1 WO2008120528 A1 WO 2008120528A1
Authority
WO
WIPO (PCT)
Prior art keywords
movable body
press
support body
fitting force
mounting apparatus
Prior art date
Application number
PCT/JP2008/053992
Other languages
English (en)
French (fr)
Inventor
Yukihiro Ikeya
Masanori Hashimoto
Yuichi Sato
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Priority to CN2008800050747A priority Critical patent/CN101611485B/zh
Publication of WO2008120528A1 publication Critical patent/WO2008120528A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Moving Of Heads (AREA)

Abstract

　ボイスコイルモータ（２２）によって可動体（１６）を上昇方向に付勢して可動体に設けられた軸部材（１９）の上端を支持体（１１）に当接した状態で駆動源（２）によって支持体を下降させることで、半導体チップ（２５）を基板（２７）に第１の圧着力で実装し、軸部材（１９）に設けられたフランジ（２１）による可動体の支持体に対する係合保持状態が解除された状態で、ボイスコイルモータによって可動体に下降方向の付勢力を付与することで、半導体チップ基板に第１の圧着力よりも小さな第２の圧着力で実装する。
PCT/JP2008/053992 2007-03-29 2008-03-05 電子部品の実装装置 WO2008120528A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008800050747A CN101611485B (zh) 2007-03-29 2008-03-05 电子部件的安装装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007089635A JP5068571B2 (ja) 2007-03-29 2007-03-29 電子部品の実装装置
JP2007-089635 2007-03-29

Publications (1)

Publication Number Publication Date
WO2008120528A1 true WO2008120528A1 (ja) 2008-10-09

Family

ID=39808112

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053992 WO2008120528A1 (ja) 2007-03-29 2008-03-05 電子部品の実装装置

Country Status (4)

Country Link
JP (1) JP5068571B2 (ja)
KR (1) KR101027739B1 (ja)
CN (1) CN101611485B (ja)
WO (1) WO2008120528A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010131680A (ja) * 2008-12-02 2010-06-17 Ueno Seiki Kk 保持手段駆動装置
JP5308892B2 (ja) * 2009-04-01 2013-10-09 三星ダイヤモンド工業株式会社 集積型薄膜太陽電池の製造装置
JP4880055B2 (ja) * 2010-06-04 2012-02-22 株式会社新川 電子部品実装装置及びその方法
JP5828943B1 (ja) * 2014-08-11 2015-12-09 株式会社新川 電子部品の実装装置
CH714351A1 (de) * 2017-11-17 2019-05-31 Besi Switzerland Ag Bondkopf für die Montage von Bauelementen.

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10163273A (ja) * 1996-11-28 1998-06-19 Matsushita Electric Ind Co Ltd チップの圧着装置
JP2004082183A (ja) * 2002-08-28 2004-03-18 Seiko Epson Corp 加圧装置、加圧方法、電子部品の圧着方法および電気光学装置の製造方法
JP2004342662A (ja) * 2003-05-13 2004-12-02 Olympus Corp 半導体接合装置
JP2005252138A (ja) * 2004-03-08 2005-09-15 Sony Corp 電子部品接合装置
JP2006228780A (ja) * 2005-02-15 2006-08-31 Matsushita Electric Ind Co Ltd 電子部品の実装方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0936592A (ja) * 1995-07-24 1997-02-07 Matsushita Electric Ind Co Ltd 電子部品装着装置
JP3759837B2 (ja) 1998-05-11 2006-03-29 松下電器産業株式会社 電子部品実装装置及びその方法
JP4367740B2 (ja) 2000-07-26 2009-11-18 芝浦メカトロニクス株式会社 電子部品圧着装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10163273A (ja) * 1996-11-28 1998-06-19 Matsushita Electric Ind Co Ltd チップの圧着装置
JP2004082183A (ja) * 2002-08-28 2004-03-18 Seiko Epson Corp 加圧装置、加圧方法、電子部品の圧着方法および電気光学装置の製造方法
JP2004342662A (ja) * 2003-05-13 2004-12-02 Olympus Corp 半導体接合装置
JP2005252138A (ja) * 2004-03-08 2005-09-15 Sony Corp 電子部品接合装置
JP2006228780A (ja) * 2005-02-15 2006-08-31 Matsushita Electric Ind Co Ltd 電子部品の実装方法

Also Published As

Publication number Publication date
CN101611485B (zh) 2011-01-19
KR20090119787A (ko) 2009-11-19
KR101027739B1 (ko) 2011-04-07
CN101611485A (zh) 2009-12-23
JP5068571B2 (ja) 2012-11-07
JP2008251727A (ja) 2008-10-16

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