WO2008120528A1 - 電子部品の実装装置 - Google Patents
電子部品の実装装置 Download PDFInfo
- Publication number
- WO2008120528A1 WO2008120528A1 PCT/JP2008/053992 JP2008053992W WO2008120528A1 WO 2008120528 A1 WO2008120528 A1 WO 2008120528A1 JP 2008053992 W JP2008053992 W JP 2008053992W WO 2008120528 A1 WO2008120528 A1 WO 2008120528A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- movable body
- press
- support body
- fitting force
- mounting apparatus
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Moving Of Heads (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800050747A CN101611485B (zh) | 2007-03-29 | 2008-03-05 | 电子部件的安装装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007089635A JP5068571B2 (ja) | 2007-03-29 | 2007-03-29 | 電子部品の実装装置 |
JP2007-089635 | 2007-03-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008120528A1 true WO2008120528A1 (ja) | 2008-10-09 |
Family
ID=39808112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/053992 WO2008120528A1 (ja) | 2007-03-29 | 2008-03-05 | 電子部品の実装装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5068571B2 (ja) |
KR (1) | KR101027739B1 (ja) |
CN (1) | CN101611485B (ja) |
WO (1) | WO2008120528A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010131680A (ja) * | 2008-12-02 | 2010-06-17 | Ueno Seiki Kk | 保持手段駆動装置 |
JP5308892B2 (ja) * | 2009-04-01 | 2013-10-09 | 三星ダイヤモンド工業株式会社 | 集積型薄膜太陽電池の製造装置 |
JP4880055B2 (ja) * | 2010-06-04 | 2012-02-22 | 株式会社新川 | 電子部品実装装置及びその方法 |
JP5828943B1 (ja) * | 2014-08-11 | 2015-12-09 | 株式会社新川 | 電子部品の実装装置 |
CH714351A1 (de) * | 2017-11-17 | 2019-05-31 | Besi Switzerland Ag | Bondkopf für die Montage von Bauelementen. |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10163273A (ja) * | 1996-11-28 | 1998-06-19 | Matsushita Electric Ind Co Ltd | チップの圧着装置 |
JP2004082183A (ja) * | 2002-08-28 | 2004-03-18 | Seiko Epson Corp | 加圧装置、加圧方法、電子部品の圧着方法および電気光学装置の製造方法 |
JP2004342662A (ja) * | 2003-05-13 | 2004-12-02 | Olympus Corp | 半導体接合装置 |
JP2005252138A (ja) * | 2004-03-08 | 2005-09-15 | Sony Corp | 電子部品接合装置 |
JP2006228780A (ja) * | 2005-02-15 | 2006-08-31 | Matsushita Electric Ind Co Ltd | 電子部品の実装方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0936592A (ja) * | 1995-07-24 | 1997-02-07 | Matsushita Electric Ind Co Ltd | 電子部品装着装置 |
JP3759837B2 (ja) | 1998-05-11 | 2006-03-29 | 松下電器産業株式会社 | 電子部品実装装置及びその方法 |
JP4367740B2 (ja) | 2000-07-26 | 2009-11-18 | 芝浦メカトロニクス株式会社 | 電子部品圧着装置 |
-
2007
- 2007-03-29 JP JP2007089635A patent/JP5068571B2/ja active Active
-
2008
- 2008-03-05 KR KR1020097021275A patent/KR101027739B1/ko active IP Right Grant
- 2008-03-05 WO PCT/JP2008/053992 patent/WO2008120528A1/ja active Application Filing
- 2008-03-05 CN CN2008800050747A patent/CN101611485B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10163273A (ja) * | 1996-11-28 | 1998-06-19 | Matsushita Electric Ind Co Ltd | チップの圧着装置 |
JP2004082183A (ja) * | 2002-08-28 | 2004-03-18 | Seiko Epson Corp | 加圧装置、加圧方法、電子部品の圧着方法および電気光学装置の製造方法 |
JP2004342662A (ja) * | 2003-05-13 | 2004-12-02 | Olympus Corp | 半導体接合装置 |
JP2005252138A (ja) * | 2004-03-08 | 2005-09-15 | Sony Corp | 電子部品接合装置 |
JP2006228780A (ja) * | 2005-02-15 | 2006-08-31 | Matsushita Electric Ind Co Ltd | 電子部品の実装方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101611485B (zh) | 2011-01-19 |
KR20090119787A (ko) | 2009-11-19 |
KR101027739B1 (ko) | 2011-04-07 |
CN101611485A (zh) | 2009-12-23 |
JP5068571B2 (ja) | 2012-11-07 |
JP2008251727A (ja) | 2008-10-16 |
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