JP5341087B2 - 半導体デバイスの応力緩和 - Google Patents

半導体デバイスの応力緩和 Download PDF

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Publication number
JP5341087B2
JP5341087B2 JP2010520024A JP2010520024A JP5341087B2 JP 5341087 B2 JP5341087 B2 JP 5341087B2 JP 2010520024 A JP2010520024 A JP 2010520024A JP 2010520024 A JP2010520024 A JP 2010520024A JP 5341087 B2 JP5341087 B2 JP 5341087B2
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Japan
Prior art keywords
crack prevention
corner
crack
chip
distance
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English (en)
Japanese (ja)
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JP2010536174A5 (enExample
JP2010536174A (ja
Inventor
ディン ボ、ナット
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NXP USA Inc
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NXP USA Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Dicing (AREA)
JP2010520024A 2007-08-08 2008-06-24 半導体デバイスの応力緩和 Expired - Fee Related JP5341087B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/835,680 US7960814B2 (en) 2007-08-08 2007-08-08 Stress relief of a semiconductor device
US11/835,680 2007-08-08
PCT/US2008/068023 WO2009020713A1 (en) 2007-08-08 2008-06-24 Stress relief of a semiconductor device

Publications (3)

Publication Number Publication Date
JP2010536174A JP2010536174A (ja) 2010-11-25
JP2010536174A5 JP2010536174A5 (enExample) 2011-08-11
JP5341087B2 true JP5341087B2 (ja) 2013-11-13

Family

ID=40341625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010520024A Expired - Fee Related JP5341087B2 (ja) 2007-08-08 2008-06-24 半導体デバイスの応力緩和

Country Status (6)

Country Link
US (1) US7960814B2 (enExample)
JP (1) JP5341087B2 (enExample)
KR (1) KR101462063B1 (enExample)
CN (1) CN101779286B (enExample)
TW (1) TWI433222B (enExample)
WO (1) WO2009020713A1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8013425B2 (en) 2008-05-13 2011-09-06 United Microelectronics Corp. Scribe line structure for wafer dicing and method of making the same
US8912076B2 (en) * 2008-11-05 2014-12-16 Texas Instruments Incorporated Crack deflector structure for improving semiconductor device robustness against saw-induced damage
US8125053B2 (en) * 2009-02-04 2012-02-28 Texas Instruments Incorporated Embedded scribe lane crack arrest structure for improved IC package reliability of plastic flip chip devices
US8124448B2 (en) 2009-09-18 2012-02-28 Advanced Micro Devices, Inc. Semiconductor chip with crack deflection structure
DE102010029528A1 (de) * 2010-05-31 2011-12-01 GLOBALFOUNDRIES Dresden Module One Ltd. Liability Company & Co. KG Halbleiterbauelement mit einer Chipumrandung mit gradueller Strukturdichte
US8692392B2 (en) * 2010-10-05 2014-04-08 Infineon Technologies Ag Crack stop barrier and method of manufacturing thereof
US20120286397A1 (en) * 2011-05-13 2012-11-15 Globalfoundries Inc. Die Seal for Integrated Circuit Device
US8940618B2 (en) * 2012-03-13 2015-01-27 Taiwan Semiconductor Manufacturing Company, Ltd. Method and device for cutting semiconductor wafers
KR101984736B1 (ko) * 2012-10-09 2019-06-03 삼성디스플레이 주식회사 플렉서블 디스플레이 장치용 어레이 기판
US8896102B2 (en) * 2013-01-22 2014-11-25 Freescale Semiconductor, Inc. Die edge sealing structures and related fabrication methods
US20140342471A1 (en) * 2013-05-20 2014-11-20 Varian Semiconductor Equipment Associates, Inc. Variable Doping Of Solar Cells
TWI467757B (zh) * 2013-08-02 2015-01-01 Chipbond Technology Corp 半導體結構
CN106464162B (zh) 2014-06-20 2019-02-19 通用电气公司 用于对多逆变器功率变换器的控制的装置及方法
US20160268166A1 (en) * 2015-03-12 2016-09-15 Kabushiki Kaisha Toshiba Semiconductor memory device and method of manufacturing the same
KR102611982B1 (ko) 2016-05-25 2023-12-08 삼성전자주식회사 반도체 장치
KR102633112B1 (ko) 2016-08-05 2024-02-06 삼성전자주식회사 반도체 소자
CN109950208A (zh) * 2017-12-21 2019-06-28 成都海存艾匹科技有限公司 适合划片且能避免裂痕的半导体晶粒
KR102599050B1 (ko) * 2018-08-20 2023-11-06 삼성전자주식회사 반도체 칩의 제조 방법
JP7443097B2 (ja) 2020-03-09 2024-03-05 キオクシア株式会社 半導体ウェハおよび半導体チップ
US11652069B2 (en) * 2020-12-08 2023-05-16 Globalfoundries Singapore Pte. Ltd. Crackstop structures
US20230290684A1 (en) * 2022-03-09 2023-09-14 Micron Technology, Inc. Structures and methods for dicing semiconductor devices
DE102022128335A1 (de) 2022-10-26 2024-05-02 Infineon Technologies Ag Chip mit Rissleitstruktur kombiniert mit Rissstoppstruktur
CN115376905B (zh) * 2022-10-27 2023-01-31 山东中清智能科技股份有限公司 一种半导体晶片的切割工艺
CN116314041A (zh) * 2023-05-24 2023-06-23 深圳和美精艺半导体科技股份有限公司 承载基板、应用其的封装结构及封装元件

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4922326A (en) 1988-07-18 1990-05-01 Motorola, Inc. Ceramic semiconductor package having crack arrestor patterns
US4976814A (en) 1988-07-18 1990-12-11 Motorola, Inc. Method of making a ceramic semiconductor package having crack arrestor patterns
AU7589196A (en) * 1996-11-21 1998-06-10 Hitachi Limited Semiconductor device and process for manufacturing the same
US5858882A (en) 1997-03-24 1999-01-12 Vanguard International Semiconductor Corporation In-situ low wafer temperature oxidized gas plasma surface treatment process
US6709954B1 (en) 2002-06-21 2004-03-23 Advanced Micro Devices, Inc. Scribe seal structure and method of manufacture
US6972209B2 (en) 2002-11-27 2005-12-06 International Business Machines Corporation Stacked via-stud with improved reliability in copper metallurgy
US7098676B2 (en) 2003-01-08 2006-08-29 International Business Machines Corporation Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor
US7126225B2 (en) 2003-04-15 2006-10-24 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling
US20050026397A1 (en) 2003-07-28 2005-02-03 International Business Machines Corporation Crack stop for low k dielectrics
US7180187B2 (en) 2004-06-22 2007-02-20 International Business Machines Corporation Interlayer connector for preventing delamination of semiconductor device
US7129566B2 (en) * 2004-06-30 2006-10-31 Freescale Semiconductor, Inc. Scribe street structure for backend interconnect semiconductor wafer integration
US7223673B2 (en) 2004-07-15 2007-05-29 Taiwan Semiconductor Manufacturing Company, Ltd. Method of manufacturing semiconductor device with crack prevention ring
JP4636839B2 (ja) * 2004-09-24 2011-02-23 パナソニック株式会社 電子デバイス
US7211500B2 (en) * 2004-09-27 2007-05-01 United Microelectronics Corp. Pre-process before cutting a wafer and method of cutting a wafer
JP2008066716A (ja) * 2006-08-10 2008-03-21 Matsushita Electric Ind Co Ltd 半導体装置
JP5175066B2 (ja) * 2006-09-15 2013-04-03 ルネサスエレクトロニクス株式会社 半導体装置

Also Published As

Publication number Publication date
CN101779286A (zh) 2010-07-14
KR20100050489A (ko) 2010-05-13
WO2009020713A1 (en) 2009-02-12
CN101779286B (zh) 2012-01-11
TWI433222B (zh) 2014-04-01
JP2010536174A (ja) 2010-11-25
US20090039470A1 (en) 2009-02-12
TW200913041A (en) 2009-03-16
KR101462063B1 (ko) 2014-11-17
US7960814B2 (en) 2011-06-14

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