JP5326278B2 - 回路基板及びこれを用いた半導体モジュール、回路基板の製造方法 - Google Patents

回路基板及びこれを用いた半導体モジュール、回路基板の製造方法 Download PDF

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Publication number
JP5326278B2
JP5326278B2 JP2007533174A JP2007533174A JP5326278B2 JP 5326278 B2 JP5326278 B2 JP 5326278B2 JP 2007533174 A JP2007533174 A JP 2007533174A JP 2007533174 A JP2007533174 A JP 2007533174A JP 5326278 B2 JP5326278 B2 JP 5326278B2
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Prior art keywords
circuit board
ceramic substrate
metal
insulating ceramic
fracture toughness
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JP2007533174A
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English (en)
Japanese (ja)
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JPWO2007026547A1 (ja
Inventor
洋一郎 加賀
寿之 今村
純一 渡辺
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Proterial Ltd
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Hitachi Metals Ltd
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Priority to JP2007533174A priority Critical patent/JP5326278B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Ceramic Products (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2007533174A 2005-08-29 2006-08-17 回路基板及びこれを用いた半導体モジュール、回路基板の製造方法 Active JP5326278B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007533174A JP5326278B2 (ja) 2005-08-29 2006-08-17 回路基板及びこれを用いた半導体モジュール、回路基板の製造方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2005247301 2005-08-29
JP2005247301 2005-08-29
JP2006091408 2006-03-29
JP2006091408 2006-03-29
JP2007533174A JP5326278B2 (ja) 2005-08-29 2006-08-17 回路基板及びこれを用いた半導体モジュール、回路基板の製造方法
PCT/JP2006/316154 WO2007026547A1 (ja) 2005-08-29 2006-08-17 回路基板及びこれを用いた半導体モジュール、回路基板の製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2012131557A Division JP2012169678A (ja) 2005-08-29 2012-06-11 回路基板及びこれを用いた半導体モジュール、回路基板の製造方法
JP2012231919A Division JP5598522B2 (ja) 2005-08-29 2012-10-19 回路基板及びこれを用いた半導体モジュール、回路基板の製造方法

Publications (2)

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JPWO2007026547A1 JPWO2007026547A1 (ja) 2009-03-05
JP5326278B2 true JP5326278B2 (ja) 2013-10-30

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JP2007533174A Active JP5326278B2 (ja) 2005-08-29 2006-08-17 回路基板及びこれを用いた半導体モジュール、回路基板の製造方法
JP2012131557A Pending JP2012169678A (ja) 2005-08-29 2012-06-11 回路基板及びこれを用いた半導体モジュール、回路基板の製造方法
JP2012231919A Active JP5598522B2 (ja) 2005-08-29 2012-10-19 回路基板及びこれを用いた半導体モジュール、回路基板の製造方法

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JP2012131557A Pending JP2012169678A (ja) 2005-08-29 2012-06-11 回路基板及びこれを用いた半導体モジュール、回路基板の製造方法
JP2012231919A Active JP5598522B2 (ja) 2005-08-29 2012-10-19 回路基板及びこれを用いた半導体モジュール、回路基板の製造方法

Country Status (4)

Country Link
US (1) US8563869B2 (https=)
EP (1) EP1921675B1 (https=)
JP (3) JP5326278B2 (https=)
WO (1) WO2007026547A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10515868B2 (en) 2015-09-28 2019-12-24 Kabushiki Kaisha Toshiba Circuit substrate and semiconductor device

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JP5326278B2 (ja) * 2005-08-29 2013-10-30 日立金属株式会社 回路基板及びこれを用いた半導体モジュール、回路基板の製造方法
JP2009094264A (ja) * 2007-10-09 2009-04-30 Hitachi Metals Ltd 回路基板、半導体モジュール、半導体モジュールの設計方法
JP5070014B2 (ja) * 2007-11-21 2012-11-07 株式会社豊田自動織機 放熱装置
JP2009130060A (ja) * 2007-11-21 2009-06-11 Toyota Industries Corp 放熱装置
US8609993B2 (en) * 2008-05-16 2013-12-17 Mitsubishi Materials Corporation Power module substrate, power module, and method for manufacturing power module substrate
CN102132635A (zh) * 2008-06-20 2011-07-20 日立金属株式会社 陶瓷集合基板及其制造方法，陶瓷基板和陶瓷电路基板
DE102010039728A1 (de) * 2010-08-25 2012-03-01 Robert Bosch Gmbh Verfahren zur Herstellung einer elektrischen Schaltung und elektrischen Schaltung
EP2811513B1 (en) * 2012-02-01 2019-12-18 Mitsubishi Materials Corporation Method for producing substrate for power modules
CN102856266A (zh) * 2012-09-19 2013-01-02 张剑锋 一体化绝缘陶瓷基板
WO2015125907A1 (ja) * 2014-02-21 2015-08-27 電気化学工業株式会社 セラミックス回路基板
JP6341822B2 (ja) 2014-09-26 2018-06-13 三菱電機株式会社 半導体装置
CN105742268B (zh) * 2014-12-26 2019-01-22 株式会社东芝 布线基板以及包含布线基板的半导体封装
JP6462730B2 (ja) * 2015-01-29 2019-01-30 京セラ株式会社 回路基板および電子装置
JP6370257B2 (ja) 2015-04-27 2018-08-08 三菱電機株式会社 半導体装置
KR101708317B1 (ko) * 2015-06-17 2017-02-20 엘지전자 주식회사 스트레인 검사 소자 및 그 부착 방법
JP6829204B2 (ja) * 2015-09-28 2021-02-10 株式会社東芝 窒化珪素回路基板およびそれを用いた半導体モジュール
JP6137267B2 (ja) * 2015-10-08 2017-05-31 三菱マテリアル株式会社 ヒートシンク付きパワーモジュール用基板及びパワーモジュール
WO2018180965A1 (ja) * 2017-03-30 2018-10-04 株式会社 東芝 セラミックス銅回路基板およびそれを用いた半導体装置
WO2018207396A1 (ja) * 2017-05-11 2018-11-15 住友電気工業株式会社 半導体装置
KR102436225B1 (ko) * 2017-07-28 2022-08-25 삼성전기주식회사 인쇄회로기판
JPWO2019167942A1 (ja) * 2018-02-27 2020-04-16 三菱マテリアル株式会社 絶縁回路基板
DE102018104521B4 (de) * 2018-02-28 2022-11-17 Rogers Germany Gmbh Metall-Keramik-Substrate
WO2020203633A1 (ja) 2019-03-29 2020-10-08 デンカ株式会社 窒化珪素回路基板、及び、電子部品モジュール
CN110012597B (zh) * 2019-04-12 2020-11-27 中国科学院电工研究所 一种陶瓷覆铜电路板及其制备方法
WO2021039816A1 (ja) * 2019-08-29 2021-03-04 京セラ株式会社 電気回路基板及びパワーモジュール
WO2021187201A1 (ja) * 2020-03-18 2021-09-23 株式会社 東芝 接合体、セラミックス銅回路基板、接合体の製造方法、およびセラミックス銅回路基板の製造方法
JPWO2023204054A1 (https=) * 2022-04-18 2023-10-26

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JP2005026252A (ja) * 2003-06-30 2005-01-27 Ngk Spark Plug Co Ltd セラミック回路基板、放熱モジュール、および半導体装置

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JP2004080063A (ja) * 1996-08-27 2004-03-11 Dowa Mining Co Ltd 高信頼性半導体用基板
JP2004119568A (ja) * 2002-09-25 2004-04-15 Kyocera Corp セラミック回路基板
JP2005026252A (ja) * 2003-06-30 2005-01-27 Ngk Spark Plug Co Ltd セラミック回路基板、放熱モジュール、および半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10515868B2 (en) 2015-09-28 2019-12-24 Kabushiki Kaisha Toshiba Circuit substrate and semiconductor device
US10790214B2 (en) 2015-09-28 2020-09-29 Kabushiki Kaisha Toshiba Circuit substrate and semiconductor device

Also Published As

Publication number Publication date
JP2013042165A (ja) 2013-02-28
US20090101392A1 (en) 2009-04-23
EP1921675B1 (en) 2018-10-31
JP5598522B2 (ja) 2014-10-01
US8563869B2 (en) 2013-10-22
EP1921675A1 (en) 2008-05-14
JP2012169678A (ja) 2012-09-06
EP1921675A4 (en) 2010-09-22
WO2007026547A1 (ja) 2007-03-08
JPWO2007026547A1 (ja) 2009-03-05

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