WO2018207396A1 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
WO2018207396A1
WO2018207396A1 PCT/JP2017/044514 JP2017044514W WO2018207396A1 WO 2018207396 A1 WO2018207396 A1 WO 2018207396A1 JP 2017044514 W JP2017044514 W JP 2017044514W WO 2018207396 A1 WO2018207396 A1 WO 2018207396A1
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WIPO (PCT)
Prior art keywords
base plate
thickness
bonding
semiconductor device
semiconductor chip
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PCT/JP2017/044514
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English (en)
French (fr)
Inventor
浩史 野津
久人 道越
Original Assignee
住友電気工業株式会社
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Publication date
Application filed by 住友電気工業株式会社 filed Critical 住友電気工業株式会社
Priority to JP2019516888A priority Critical patent/JP7127641B2/ja
Priority to US16/608,345 priority patent/US11043465B2/en
Publication of WO2018207396A1 publication Critical patent/WO2018207396A1/ja

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • H01L2924/30—Technical effects
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    • H01L2924/351—Thermal stress

Definitions

  • the present disclosure relates to a semiconductor device.
  • the semiconductor When electrically connecting the surface electrode of the semiconductor chip and the circuit pattern on the surface of the insulating substrate by a copper plate, the semiconductor having a structure in which the surface electrode of the semiconductor chip and the copper plate are bonded via a solder bonding layer having a thickness of 100 ⁇ m or more.
  • An apparatus is known (for example, Patent Document 1). According to this semiconductor device, thermal stress and strain generated in the solder bonding layer due to the difference in coefficient of linear expansion between the semiconductor chip and the copper plate can be reduced, and the reliability of bonding between the semiconductor chip and the copper plate can be improved. .
  • a semiconductor chip formed of a material containing silicon carbide, a base plate in which a metal layer is formed on both surfaces of a plate-like insulator portion, and one surface of the base plate And a bonding material for bonding the semiconductor chip.
  • the bonding material is formed of a metal material having a melting point of 773 ° C. or higher after bonding, the thickness of the bonding material is 50 ⁇ m or less, the thickness of the base plate is 500 ⁇ m or more, and the insulator portion
  • the value of t I / t M is 4.3 or more, where t is the thickness of t 1 and the thickness of the metal layer is t M.
  • FIG. 1 is a model diagram of a semiconductor device used for examining the thickness of the bonding layer.
  • FIG. 2 is a correlation diagram of the deformation amount of the bonding layer with respect to the thickness of the bonding layer and the deformation amount of the base plate.
  • FIG. 3 is a model diagram of the semiconductor device used for conducting the temperature increase / decrease test.
  • FIG. 4 is a correlation diagram between the number of heating / cooling cycles and the bonding area in the bonding layer.
  • FIG. 5 is a correlation diagram between Cu strain and stress.
  • FIG. 6 is a structural diagram of a base plate used in the semiconductor device according to one embodiment of the present disclosure.
  • FIG. 7 is a correlation diagram (1) between the volume ratio of the insulator portion to the metal layer in the base plate and the linear expansion coefficient.
  • FIG. 8 is a correlation diagram (2) between the volume ratio of the insulator portion to the metal layer in the base plate and the linear expansion coefficient.
  • FIG. 9 is an explanatory diagram of the power module of the semiconductor device according to one embodiment of the present disclosure.
  • FIG. 10 is an explanatory diagram of a power module of a semiconductor device used for comparison.
  • FIG. 11 is a correlation diagram between the number of heating / cooling cycles and the amount of change in thermal resistance.
  • FIG. 12 is a correlation diagram between the number of heating / cooling cycles and the amount of change in on-resistance.
  • FIG. 13 is an explanatory diagram of a semiconductor device according to another aspect of the present disclosure.
  • a high thermal conductivity and high electrical conductivity bonding layer generally has a large linear expansion coefficient (for example, 17 to 25 ppm / K). For this reason, the thermal stress caused by the difference between the linear expansion coefficient of silicon (Si) or silicon carbide (SiC) constituting the semiconductor chip or the semiconductor element and the linear expansion coefficient of the bonding layer is generated. Cracks and peeling easily occur. In particular, in the case of a semiconductor device using SiC as a semiconductor material, such a tendency is likely to occur because many of the devices corresponding to high output are likely to become high temperature.
  • a highly reliable semiconductor device using SiC can be provided.
  • a semiconductor device includes a semiconductor chip formed of a material containing silicon carbide, a base plate in which a metal layer is formed on both surfaces of a plate-like insulator, and the base A bonding material for bonding the semiconductor chip to one surface of the plate, and the bonding material is formed of a metal material having a melting point of 773 ° C. or higher after bonding, and the thickness of the bonding material is , 50 ⁇ m or less, the thickness of the base plate is 500 ⁇ m or more, t I / t M , where t I is the thickness of the insulator and t M is the thickness of the metal layer. The value of is 4.3 or more.
  • the inventor of the present application is a base plate that is bonded to a semiconductor chip formed of a material containing silicon carbide via a bonding material.
  • the bonding material is a metal material having a melting point of 773 ° C. or higher after bonding, and has a thickness of
  • the thickness of the base plate is 500 ⁇ m or more
  • the thickness of the insulator portion in the base plate is t I
  • the thickness of the metal layer is t M , t I / t
  • the insulator portion is made of a material containing silicon nitride, and the metal layer is made of a material containing copper.
  • the bonding material is formed of a metal material having a melting point of 773 ° C. or higher after bonding, the thickness of the bonding material is 50 ⁇ m or less, and the thickness of the base plate is 500 ⁇ m or more.
  • the linear expansion coefficient of the base plate is 2.9 ppm / K or more and 5.1 ppm / K or less.
  • the thickness of the base plate is 2 mm or less.
  • the base plate is a first base plate, and the first base plate is bonded to one surface of the semiconductor chip, and the other surface of the semiconductor chip is bonded to the other surface.
  • a second base plate is joined by a material, and the second base plate has the same structure as the first base plate.
  • the present embodiment an embodiment of the present disclosure (hereinafter referred to as “the present embodiment”) will be described in detail, but the present embodiment is not limited thereto.
  • the semiconductor chip 20 is made of SiC having a size of 5 mm ⁇ 5 mm and a thickness of 0.2 mm to 0.3 mm.
  • SiC has a linear expansion coefficient of 4 ppm / K and a Young's modulus of 440 GPa.
  • the base plate 10 is assumed to have a size of 50 mm ⁇ 50 mm and a thickness of 1.0 mm, a linear expansion coefficient of 5 ppm / K, and a Young's modulus of 240 GPa. Since the bonding layer 30 uses copper (Cu) and bonds the semiconductor chip 20, the size is the same as that of the semiconductor chip 20, and the thickness is changed. The linear expansion coefficient of Cu is 17 ppm / K, and the Young's modulus is 130 GPa. In the present application, the bonding layer 30 may be described as a bonding material.
  • FIG. 2 shows the result of simulation for a model having such a structure by changing the temperature in a temperature range of 175 ° C.
  • the horizontal axis in FIG. 2 is the thickness of the sintered copper, which is the thickness of the bonding layer 30, and the vertical axis is the value of the deformation amount of the bonding layer 30 relative to the deformation amount of the base plate 10, that is, the (deformation amount of the bonding layer). ) / (Deformation amount of base plate).
  • the bonding layer 30 when the thickness of the bonding layer 30 is 0.05 mm (50 ⁇ m), the value of (deformation amount of the bonding layer 30) / (deformation amount of the base plate 10) is approximately 1, and the bonding layer 30 When the thickness of the bonding layer 30 is 0.05 mm or less, the bonding layer 30 deforms substantially following the deformation of the base plate 10.
  • Examples of the material for forming the bonding layer 30 include Cu having a linear expansion coefficient of 17 ppm / K, and sintered bodies such as silver (Ag), Cu—Sn alloy, and Ni.
  • the linear expansion coefficient of Ag is 19 ppm / K
  • the linear expansion coefficient of the Cu—Sn alloy is 21 ppm / K or more
  • the linear expansion coefficient of Ni is 12.8 ppm / K.
  • Ni has lower thermal conductivity and higher resistance than Cu and Ag.
  • Cu or Ag is preferable as a material for forming the bonding layer 30.
  • Cu has a lower coefficient of linear expansion than Ag and is inexpensive, so Cu is more preferable from this viewpoint.
  • the melting point of Ag is 961 ° C.
  • the melting point of Cu is 1083 ° C.
  • the bonding layer 30 has a higher density, and the density is preferably 96% or more.
  • the semiconductor device In the semiconductor device according to the present embodiment, consider a case where the semiconductor chip 20 is formed of SiC and the operating temperature region is ⁇ 50 ° C. to 250 ° C. (the change in temperature is 300 ° C.). It is known that a metal material undergoes a phenomenon called creep deformation at a high temperature and does not elastically deform even with a small amount of strain, resulting in a decrease in life. The effect of creep deformation appears at about 1/2 of the melting point at absolute temperature. Therefore, by using a material having a melting point of 1046 K (773 ° C.) or more, which is twice the absolute temperature of 523 K at 250 ° C., the influence of creep deformation is suppressed, and deformation within the elastic region is achieved. Decline can be prevented.
  • the thickness of the base plate 10 is 3 mm, and the bonding layer 30 is formed of sintered copper having a thickness of 50 ⁇ m. It carried out in the state put in the gel 70.
  • FIG. The base plate 10 is originally formed with a metal film or the like on the surface of the insulator substrate, but for the sake of convenience, it is made of a metal material.
  • sample 3A has base plate 10 made of molybdenum (Mo)
  • sample 3B has base plate 10 made of Cu-85Mo
  • sample 3C has base plate 10 made of Cu-60Mo. ing.
  • the linear expansion coefficient of Mo is 5.1 ppm / K
  • the linear expansion coefficient of Cu-85Mo is 7.0 ppm / K
  • the linear expansion coefficient of Cu-60Mo is 8.4 ppm / K.
  • a cycle in which the temperature is raised to ⁇ 40 ° C. for 30 minutes, then raised to 200 ° C., then lowered to 200 ° C. for 30 minutes, and then lowered to ⁇ 40 ° C. is defined as one cycle.
  • the bonding area in the bonding layer 30 were examined. The bonding area in the bonding layer 30 was measured using a SAT (Scanning / Acoustic / Tomograph).
  • the bonding area in the bonding layer 30 is about 98% of the initial, and the bonding area in the bonding layer 30 is It was about 95% or more, and the reliability of bonding was high.
  • FIG. 5 is a diagram showing the relationship between Cu strain and stress. From this figure, the yield point of Cu is about 0.052%.
  • the distortion of the base plate 10 with respect to the semiconductor chip 20 when the temperature is raised from ⁇ 40 ° C. to 200 ° C. is about 0.03% for the sample 3A, about 0.07% for the sample 3B, and about 0.07% for the sample 3C. 0.11%.
  • the deformation is within the range below the Cu yield point, and in the samples 3B and 3C, the deformation exceeds the Cu yield point. For this reason, in samples 3B and 3C, the deformation exceeding the yield point of Cu was repeated due to the temperature rise and fall, so the bonding area was greatly reduced, but in sample 3A, the deformation was in a range not exceeding the yield point of Cu. It is presumed that there is almost no decrease in the bonding area even when the temperature is raised or lowered. When the temperature change is from ⁇ 50 ° C. to 250 ° C., the temperature change is 300 ° C. In this case, the strain of the sample A is about 0.033, and the deformation does not exceed the Cu yield point. It becomes.
  • the difference between the linear expansion coefficient of the base plate 10 and the linear expansion coefficient of SiC which is the semiconductor chip 20 ⁇ 300 ° C. is within the elastic region of the bonding material, and the deformation is within the elastic region of the bonding material. Considering deformation in the range of the yield point, it is preferably 6.0 ppm / K or less.
  • the joint area does not decrease even if many deformations due to temperature increase and decrease are repeated.
  • the difference in the coefficient of linear expansion of SiC is preferably 1.1 ppm / K or less.
  • the linear expansion coefficient of the base plate 10 be in the range of the linear expansion coefficient of the semiconductor chip 20 ⁇ 1.1 ppm / K or more and the linear expansion coefficient of the semiconductor chip 20 +1.1 ppm / K or less. Therefore, when the semiconductor chip 20 is SiC, the linear expansion coefficient of SiC is 4 ppm / K, and therefore the linear expansion coefficient of the base plate 10 is in the range of 2.9 ppm / K or more and 5.1 ppm / K or less. Is preferred.
  • the base plate 10 is actually formed with metal layers 12 and 13 on both surfaces of a plate-like insulator portion 11 formed of an insulator, as shown in FIG.
  • the material and thickness forming the metal layers 12 and 13 are important.
  • the metal material for forming the metal layers 12 and 13 is required to have high conductivity. For example, copper or a material containing copper is preferable. High metal materials generally have a large coefficient of linear expansion.
  • the insulator part 11 forming the base plate 10 is made of an insulating material and has a low linear expansion coefficient.
  • the material for forming the insulator portion 11 include aluminum nitride (AlN), aluminum oxide (Al 2 O 3 ), and silicon nitride (Si 3 N 4 ). These linear expansion coefficients are 4.6 ppm / K for AlN, 7.2 ppm / K for Al 2 O 3 , and 2.7 ppm / K for Si 3 N 4 . Therefore, among these, Si 3 N 4 has the lowest linear expansion coefficient, which is preferable as a material for forming the insulator portion 11 of the base plate 10 in the present embodiment.
  • the relationship between the thickness of the insulator 11 and the thickness of the metal layers 12 and 13 is such that the linear expansion coefficient of the base plate 10 is 2.9 ppm / It was investigated whether it would be in the range of K to 5.1 ppm / K. Specifically, the linear expansion coefficient ⁇ AMB of the base plate 10 was calculated and examined based on the following equation (1).
  • the insulator portion 11 is made of Si 3 N 4 and the metal layers 12 and 13 are made of copper.
  • ⁇ Cu is a linear expansion coefficient of copper of 17 ppm / K
  • ⁇ SiN is a linear expansion coefficient of Si 3 N 4 of 2.7 ppm / K.
  • E Cu is the Young's modulus of copper and 130 GPa
  • E SiN is the Young's modulus of Si 3 N 4 and is 290 GPa.
  • V Cu is the volume of each copper on one side and the other side
  • V SiN is the volume of Si 3 N 4 . Since the metal layer 12 and the metal layer 13 are formed so as to have the same volume and are formed on both surfaces of the insulator part 11, the volume of copper in the base plate 10 is 2V Cu .
  • FIGS. 7 is a diagram in which the value of V SiN / V Cu is from 0 to 100
  • FIG. 8 is a diagram in which the value of V SiN / V Cu is from 0 to 10.
  • the linear expansion coefficient ⁇ AMB of the base plate 10 is 5.1 ppm / K when the value of V SiN / V Cu is 4.3.
  • the coefficient ⁇ AMB is 2.9 ppm / K when the value of V SiN / V Cu is 80. Therefore, the range of the value of V SiN / V Cu in the base plate 10 is preferably 4.3 or more and 80 or less.
  • the value of V SiN / V Cu is a ratio of thickness.
  • the range of the thickness t I of the insulator portion 11 relative to the thickness t M of the metal layers 12 and 13 in the base plate 10, that is, the range of the value of t I / t M is 4.3 or more and 80 or less. preferable.
  • the linear expansion coefficient ⁇ AMB of the base plate 10 is 5.1 ppm / K or less, and is preferably 4 ppm / K or more, which is the same as the linear expansion coefficient of SiC.
  • the linear expansion coefficient ⁇ AMB of the base plate 10 is 4 ppm / K when the value of V SiN / V Cu is 9.2. Therefore, the range of the value of V SiN / V Cu in the base plate 10 is preferably 4.3 or more and 9.2 or less.
  • the range of the thickness t I of the insulator portion 11 relative to the thickness t M of the metal layers 12 and 13 in the base plate 10, that is, the range of the value of t I / t M is 4.3 or more, 9.2 The following is preferred.
  • the semiconductor chip 20 is bonded to the base plate 10 by the bonding layer 30.
  • the bonding layer 30 in order for the influence of the base plate 10 to be dominant, the bonding layer It is preferable that the base plate 10 is sufficiently thicker than 30. Therefore, when the thickness of the bonding layer 30 is 50 ⁇ m, the thickness of the base plate 10 is preferably 500 ⁇ m or more.
  • the thickness of the base plate 10 is preferably 2 mm or less. Further, in order to sufficiently secure the conductivity in the metal layers 12 and 13, when the metal layers 12 and 13 are formed of Cu, the thickness of the metal layers 12 and 13 needs to be 100 ⁇ m or more. Therefore, when the thickness of the base plate 10 is 2 mm (2000 ⁇ m) and the thickness t M of the metal layers 12 and 13 is 100 ⁇ m, the thickness t I of the insulator portion 11 of the base plate 10 is 1800 ⁇ m. .
  • the thickness t I of the insulator portion 11 with respect to the thickness t M of the metal layers 12 and 13 in the base plate 10, that is, the value of t I / t M is 18. Therefore, t I / t M is preferably 18 or less.
  • FIG. 9 shows a power module of the semiconductor device according to this embodiment.
  • a semiconductor chip 20 made of SiC is bonded to one surface of a base plate 10 by a bonding layer 30, and a heat dissipation plate 40 is connected to a heat dissipation plate bonding layer 41 on the other surface of the base plate 10. It is joined by.
  • the electrode terminals formed by the electrode terminals on the upper surface of the semiconductor chip 20 and the metal layer of the base plate 10, or the electrode terminals formed by the metal layer of the base plate 10 are connected by bonding wires 51, 52 and 53. Yes.
  • the base plate 10 and the semiconductor chip 20 on the heat radiating plate 40 are covered with a resin case 60, and the resin case 60 is provided with connection wirings 71, 72, 73 for connection to the outside. ing.
  • a sealing material 61 is placed inside the resin case 60.
  • the bonding layer 30 is formed of sintered copper having a thickness of 50 ⁇ m.
  • the insulator portion 11 is made of Si 3 N 4 having a thickness of 650 ⁇ m, and the metal layers 12 and 13 are made of Cu each having a thickness of 150 ⁇ m, and the linear expansion coefficient is about 5.1 ppm / K. is there.
  • the heat sink 40 is made of AlSiC, which is a metal composite material. The value of V SiN / V Cu is 4.33, and the linear expansion coefficient is about 7.5 ppm / K.
  • the heat sink bonding layer 41 is formed of a Sn-5Sb solder material formed of Sn and antimony (Sb).
  • the bonding wires 51, 52 and 53 are made of aluminum (Al)
  • the resin case 60 is made of a resin material
  • the sealing material 61 is made of, for example, silicone gel.
  • FIG. 10 shows a power module 10A of a semiconductor device used for comparison.
  • a semiconductor chip 20 made of SiC is bonded to one surface of a base plate 910 by a bonding layer 930, and a heat radiating plate 940 is connected to the heat radiating plate bonding layer 41 on the other surface of the base plate 910. It is joined by.
  • the electrode terminals formed by the electrode terminals on the upper surface of the semiconductor chip 20 and the metal layer of the base plate 10, or the electrode terminals formed by the metal layer of the base plate 10 are connected by bonding wires 51, 52 and 53. Yes.
  • the base plate 10 and the semiconductor chip 20 on the heat radiating plate 40 are covered with a resin case 60, and the resin case 60 is provided with connection wirings 71, 72, 73 for connection to the outside. ing.
  • a sealing material 61 is placed inside the resin case 60.
  • the bonding layer 930 is made of Sn-10Sb having a thickness of 100 ⁇ m, and the linear expansion coefficient is 21 ppm / K.
  • the insulator portion 911 is made of Si 3 N 4 with a thickness of 320 ⁇ m, and the metal layers 912 and 913 are made of Cu with a thickness of 300 ⁇ m.
  • the value of V SiN / V Cu is 1.
  • the linear expansion coefficient is 9 ppm / K.
  • the heat sink 940 is made of Cu.
  • FIGS. 11 and 12 show the results of a temperature increase / decrease test performed on the power module of the semiconductor device shown in FIG. 9 and the power module of the semiconductor device used for comparison shown in FIG. 11 and 12, three power modules 9A of the semiconductor device in the present embodiment and three power modules 10A of the semiconductor device used for comparison were manufactured and measured.
  • the solid line in FIGS. 11 and 12 is the characteristic of the power module 9A of the semiconductor device in the present embodiment, and the broken line is the characteristic of the power module 10A of the semiconductor device used for comparison.
  • FIG. 11 shows the change in thermal resistance in each power module.
  • Rth (T 1 ⁇ T 2 )
  • the vertical axis indicates the amount of change in the value of the thermal resistance Rth calculated by / P.
  • the power module 9A of the semiconductor device in the present embodiment and the power module 10A of the semiconductor device used for comparison do not change much.
  • the temperature increase / decrease cycle exceeds 500 times and reaches about 1000 times
  • the amount of change in thermal resistance in the power module 10A of the semiconductor device used for comparison increases rapidly.
  • the power module 9A of the semiconductor device in this embodiment there is not much change and the change amount is 10% or less.
  • FIG. 12 shows the change in on-resistance in each power module, and shows the amount of change in on-resistance relative to the initial on-resistance on the vertical axis.
  • the current that flows when the applied voltage is 2 V is 100 A
  • the initial on-resistance is 2 m ⁇ .
  • the power module 9A of the semiconductor device in the present embodiment and the power module 10A of the semiconductor device used for comparison do not change much.
  • the amount of change in on-resistance in the power module 10A of the semiconductor device used for comparison increases rapidly.
  • the power module 9A of the semiconductor device in this embodiment there is not much change and the change amount is 10% or less.
  • the amount of change in thermal resistance and the amount of change in on-resistance in the power module 10 ⁇ / b> A of the semiconductor device used for comparison increase rapidly because the bonding area in the bonding layer decreases. It is guessed.
  • the power module 9A of the semiconductor device according to the present embodiment since the junction area in the junction layer is hardly reduced, the amount of change in thermal resistance and on-resistance is not much changed.
  • the semiconductor chip may have a structure in which base plates are provided on both sides. Specifically, as shown in FIG. 13, the first base plate 111 is bonded to one surface 20a of the semiconductor chip 20 by the first bonding layer 131, and the second bonding layer 132 is bonded to the other surface 20b. Therefore, the second base plate 112 may be joined.
  • the first base plate 111 and the second base plate 112 have the same structure as the base plate 10 shown in FIG. 6, and metal layers 12 and 13 are formed on both surfaces of the insulator portion 11. Yes. Further, the first bonding layer 131 and the second bonding layer 132 are formed of the same material as the bonding layer 30.

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Abstract

半導体装置は、炭化珪素を含む材料により形成されている半導体チップと、板状の絶縁体部の両面に、金属層が形成されたベース板と、ベース板の一方の面に、前記半導体チップを接合する接合材と、を有し、接合材は、接合後の融点が７７３℃以上の金属材料により形成されており、接合材の厚さは、５０μｍ以下であり、ベース板の厚さは、５００μｍ以上であり、絶縁体部の厚さをｔＩとし、金属層の厚さをｔＭとした場合に、ｔＩ／ｔＭの値は、４．３以上である。

Description

半導体装置
　本開示は、半導体装置に関するものである。
　本出願は、２０１７年５月１１日出願の日本特許出願第２０１７－０９４３５８号に基づく優先権を主張し、前記日本特許出願に記載された全ての記載内容を援用するものである。
　半導体チップの表面電極と絶縁基板の表面の回路パターンとを銅板により電気的に接続するに際し、半導体チップの表面電極と銅板とを１００μｍ以上の厚さの半田接合層を介して接合した構造の半導体装置が知られている（例えば、特許文献１）。この半導体装置によれば、半導体チップと銅板との線膨張係数差に起因して半田接合層に発生する熱応力と歪みが低減され、半導体チップと銅板との接合の信頼性を高めることができる。
特開２００５－１２９８８６号公報
　本実施形態の一観点によれば、炭化珪素を含む材料により形成されている半導体チップと、板状の絶縁体部の両面に、金属層が形成されたベース板と、ベース板の一方の面に、半導体チップを接合する接合材と、を有している。また、接合材は、接合後の融点が７７３℃以上の金属材料により形成されており、接合材の厚さは、５０μｍ以下であり、ベース板の厚さは、５００μｍ以上であり、絶縁体部の厚さをｔＩとし、金属層の厚さをｔＭとした場合に、ｔＩ／ｔＭの値は、４．３以上である。
図１は、接合層の膜厚を調べるために用いた半導体装置のモデル図である。 図２は、接合層の厚さとベース板の変形量に対する接合層の変形量の相関図である。 図３は、昇降温試験を行うために用いた半導体装置のモデル図である。 図４は、昇降温サイクルの回数と接合層における接合面積との相関図である。 図５は、Ｃｕの歪みと応力の相関図である。 図６は、本開示の一態様に係る半導体装置に用いられるベース板の構造図である。 図７は、ベース板における金属層に対する絶縁体部の体積比と線膨張係数との相関図（１）である。 図８は、ベース板における金属層に対する絶縁体部の体積比と線膨張係数との相関図（２）である。 図９は、本開示の一態様に係る半導体装置のパワーモジュールの説明図である。 図１０は、比較に用いた半導体装置のパワーモジュールの説明図である。 図１１は、昇降温サイクルの回数と熱抵抗の変化量との相関図である。 図１２は、昇降温サイクルの回数とオン抵抗の変化量との相関図である。 図１３は、本開示の他の一態様に係る半導体装置の説明図である。
　［本開示が解決しようとする課題］
　ところで、高熱伝導、高電気伝導の接合層は一般的に線膨張係数が大きい（例えば、１７～２５ｐｐｍ／Ｋ）。このため、半導体チップあるいは半導体素子を構成する珪素（Ｓｉ）や炭化珪素（ＳｉＣ）の線膨張係数と接合層の線膨張係数の差に起因する熱応力が発生するため、温度サイクルストレスにより接合層に亀裂や剥離が生じやすい。特に、半導体材料としてＳｉＣを用いた半導体装置の場合、高出力に対応するものが多く高温になりやすいことから、このような傾向は生じやすい。
　このため、ＳｉＣ等を用いた半導体装置において、信頼性の高い半導体装置が求められている。
　［本開示の効果］
　本開示によれば、ＳｉＣを用いた信頼性の高い半導体装置を提供することができる。
　実施するための形態について、以下に説明する。
　［本開示の実施形態の説明］
　最初に本開示の実施態様を列記して説明する。以下の説明では、同一または対応する要素には同一の符号を付し、それらについて同じ説明は繰り返さない。
　〔１〕　本開示の一態様に係る半導体装置は、炭化珪素を含む材料により形成されている半導体チップと、板状の絶縁体部の両面に、金属層が形成されたベース板と、前記ベース板の一方の面に、前記半導体チップを接合する接合材と、を有し、前記接合材は、接合後の融点が７７３℃以上の金属材料により形成されており、前記接合材の厚さは、５０μｍ以下であり、前記ベース板の厚さは、５００μｍ以上であり、前記絶縁体部の厚さをｔＩとし、前記金属層の厚さをｔＭとした場合に、ｔＩ／ｔＭの値は、４．３以上である。
　本願発明者は、炭化珪素を含む材料により形成されている半導体チップに接合材を介し接合されるベース板において、接合材は、接合後の融点が７７３℃以上の金属材料であって、厚さを５０μｍ以下で形成し、ベース板の厚さを５００μｍ以上で形成し、ベース板における絶縁体部の厚さをｔＩとし、金属層の厚さをｔＭとした場合に、ｔＩ／ｔＭの値を４．３以上にすることにより、接合強度が高く、信頼性が向上することを見出した。これにより、ＳｉＣを用いた信頼性の高い半導体装置を提供することができる。尚、特許文献１の方法では、大きな熱応力を緩和するには半田接合層をより厚くする必要があるが、この場合、半田接合層を介した放熱が良好ではなくなる。
　〔２〕　前記絶縁体部は、窒化珪素を含む材料により形成されており、前記金属層は、銅を含む材料により形成されている。
　〔３〕　ｔＩ／ｔＭの値は、１８以下である。
　〔４〕　ｔＩ／ｔＭの値は、９．２以下である。
　〔５〕　炭化珪素を含む材料により形成されている半導体チップと、絶縁体部の両面に金属層が形成されたベース板と、前記ベース板の一方の面に前記半導体チップを接合する接合材と、を有し、前記接合材は、接合後の融点が７７３℃以上の金属材料により形成されており、前記接合材の厚さは、５０μｍ以下であり、前記ベース板の厚さは、５００μｍ以上であり、前記ベース板の線膨張係数は、２．９ｐｐｍ／Ｋ以上、５．１ｐｐｍ／Ｋ以下である。
　〔６〕　前記ベース板の厚さは、２ｍｍ以下である。
　〔７〕　前記ベース板は第１のベース板であり、前記半導体チップの一方の面に前記第１のベース板が接合されているものであって、前記半導体チップの他方の面には、接合材により第２のベース板が接合されており、前記第２のベース板は、前記第１のベース板と、同じ構造のものである。
　［本開示の実施形態の詳細］
　以下、本開示の一実施形態（以下「本実施形態」と記す）について詳細に説明するが、本実施形態はこれらに限定されるものではない。
　最初に、発明者が行ったＳｉＣを用いた半導体装置に関するシミュレーションの結果について説明する。まず、図１に示す構造のベース板１０の上に半導体チップ２０が接合層３０により接合されているモデルについて、接合層３０の膜厚と、ベース板１０に対する接合層３０の変形量との関係について調べた。半導体チップ２０は、大きさが５ｍｍ×５ｍｍ、厚さが０．２ｍｍ～０．３ｍｍのＳｉＣにより形成されている。ＳｉＣの線膨張係数は４ｐｐｍ／Ｋであり、ヤング率は４４０ＧＰａである。ベース板１０は、大きさが５０ｍｍ×５０ｍｍ、厚さが１．０ｍｍで形成されており、線膨張係数は５ｐｐｍ／Ｋであり、ヤング率は２４０ＧＰａとなるものを想定している。接合層３０には銅（Ｃｕ）を用いており、半導体チップ２０を接合するものであるため、大きさは半導体チップ２０と同じであり、厚さを変化させている。Ｃｕの線膨張係数は１７ｐｐｍ／Ｋであり、ヤング率は１３０ＧＰａである。尚、本願においては、接合層３０を接合材と記載する場合がある。
　このような構造のモデルについて、１７５℃の温度範囲で温度変化をさせてシミュレーションを行った結果を図２に示す。図２の横軸は接合層３０の厚さとなる焼結銅の厚さであり、縦軸は、ベース板１０の変形量に対する接合層３０の変形量の値、即ち、（接合層の変形量）／（ベース板の変形量）の値を示す。図２に示されるように、接合層３０の厚さが０．０５ｍｍ（５０μｍ）で、（接合層３０の変形量）／（ベース板１０の変形量）の値は略１となり、接合層３０の厚さが０．０５ｍｍ以下では、接合層３０はベース板１０の変形に略追随して変形する。
　接合層３０を形成するための材料としては、線膨張係数が１７ｐｐｍ／ＫであるＣｕの他、銀（Ａｇ）、Ｃｕ－Ｓｎ合金、Ｎｉ等の焼結体が挙げられる。Ａｇの線膨張係数は１９ｐｐｍ／Ｋであり、Ｃｕ－Ｓｎ合金の線膨張係数は２１ｐｐｍ／Ｋ以上であり、Ｎｉの線膨張係数は１２．８ｐｐｍ／Ｋである。ＮｉはＣｕやＡｇに比べて熱伝導率が低く、抵抗も高い。従って、接合層３０を形成する材料としてはＣｕまたはＡｇが好ましい。更には、ＣｕはＡｇに比べて線膨張係数が低く、値段も安価であることから、この観点からは、Ｃｕがより好ましい。尚、Ａｇの融点は９６１℃であり、Ｃｕの融点は１０８３℃である。また、接合層３０において高い接合強度を得るためには、接合層３０の緻密度が高い方が好ましく、緻密度が９６％以上であることが好ましい。
　本実施形態における半導体装置において、半導体チップ２０はＳｉＣにより形成されており、動作温度領域を－５０℃～２５０℃（温度変化の変化量は３００℃）とした場合について考える。金属材料は、高温になるとクリープ変形という現象が発生し、小さな歪み量であっても、弾性変形せず、寿命が低下することが知られている。クリープ変形の影響が現れるのは、絶対温度で融点の約１／２である。従って、融点が、２５０℃の絶対温度５２３Ｋの２倍となる１０４６Ｋ（７７３℃）以上となる材料を接合層３０に用いることにより、クリープ変形の影響が抑制され、弾性域内における変形となり、寿命の低下を防ぐことができる。
　次に、ベース板１０を形成している材料が異なる試料を複数作製して実験を行った。尚、この実験では、図３に示されるように、ベース板１０の厚さは３ｍｍであり、接合層３０は、厚さが５０μｍの焼結銅により形成されており、このような試料をシリコーンゲル７０内に入れた状態で行った。ベース板１０は、本来は絶縁体基板の表面等に金属膜等が形成されているが、便宜上、金属材料により形成したものを用いている。この実験では、試料３Ａはベース板１０がモリブデン（Ｍｏ）により形成されており、試料３Ｂはベース板１０がＣｕ－８５Ｍｏにより形成されており、試料３Ｃはベース板１０がＣｕ－６０Ｍｏにより形成されている。
　また、Ｍｏの線膨張係数は５．１ｐｐｍ／Ｋ、Ｃｕ－８５Ｍｏの線膨張係数は７．０ｐｐｍ／Ｋ、Ｃｕ－６０Ｍｏの線膨張係数は８．４ｐｐｍ／Ｋである。これらの試料３Ａ、３Ｂ、３Ｃにおいて、－４０℃で３０分、その後２００℃まで昇温し、２００℃で３０分、その後－４０℃まで降温するサイクルを１サイクルとし、この昇降温サイクルの回数と接合層３０における接合面積との関係について調べた。尚、接合層３０における接合面積は、ＳＡＴ（Scanning Acoustic Tomograph：超音波映像装置）を用いて測定を行った。
　この結果を図４に示す。図４に示されるように、ベース板１０がＣｕ－６０Ｍｏにより形成されている試料３Ｃでは、昇降温サイクルを１０００回行った時点で、接合層３０における接合面積が当初の７２％となったため測定を中止した。また、ベース板１０がＣｕ－８５Ｍｏにより形成されている試料３Ｂでは、昇降温サイクルを１０００回行った結果、接合層３０における接合面積が当初の約９０％、２０００回行った結果、接合層３０における接合面積が約８６％であった。これに対し、ベース板１０がＭｏにより形成されている試料３Ａでは、昇降温サイクルを２０００回行った結果、接合層３０における接合面積は当初の約９８％であり、接合層３０における接合面積が約９５％以上であり、接合の信頼性は高かった。
　次に、図４において得られた結果と接合層３０を形成しているＣｕの歪みと応力との関係について検討を行った。図５は、Ｃｕの歪みと応力の関係を示す図である。この図より、Ｃｕの降伏点は約０．０５２％である。－４０℃から２００℃まで昇降温させた場合における半導体チップ２０に対するベース板１０の歪みは、試料３Ａでは約０．０３％であり、試料３Ｂでは約０．０７％であり、試料３Ｃでは約０．１１％である。
　従って、試料３ＡではＣｕの降伏点以下の範囲内における変形であり、試料３Ｂ及び３ＣではＣｕの降伏点を超える変形である。このため、試料３Ｂ及び３Ｃでは、昇降温により、Ｃｕの降伏点を超える変形が繰り返されたため接合面積は大きく減少したが、試料３Ａでは、Ｃｕの降伏点を超えない範囲における変形であるため、昇降温を行っても接合面積の減少は殆どないものと推察される。尚、温度変化が－５０℃から２５０℃までの場合では、温度変化は３００℃であるが、この場合における試料Ａの歪みは約０．０３３であり、Ｃｕの降伏点を超えない範囲における変形となる。即ち、ベース板１０の線膨張係数と半導体チップ２０であるＳｉＣの線膨張係数の差×３００℃が接合材の弾性域の範囲内であり、変形が接合材の弾性域の範囲内にある。降伏点の範囲における変形を考えるならば、６．０ｐｐｍ／Ｋ以下であることが好ましい。
　また、降伏点の６割以下の範囲における変形であれば、昇降温による変形を多く繰り返しても、接合面積は減少することはないものと考えられているため、ベース板１０の線膨張係数とＳｉＣの線膨張係数の差が、１．１ｐｐｍ／Ｋ以下であることが好ましい。
　以上より、ベース板１０の線膨張係数は、半導体チップ２０の線膨張係数－１．１ｐｐｍ／Ｋ以上、半導体チップ２０の線膨張係数＋１．１ｐｐｍ／Ｋ以下の範囲であることが好ましい。従って、半導体チップ２０がＳｉＣの場合、ＳｉＣの線膨張係数は４ｐｐｍ／Ｋであるため、ベース板１０の線膨張係数は、２．９ｐｐｍ／Ｋ以上、５．１ｐｐｍ／Ｋ以下の範囲であることが好ましい。
　ところで、ベース板１０は、実際には、図６に示されるように、絶縁体により形成された板状の絶縁体部１１の両面に、金属層１２、１３が形成されている。このようなベース板１０において、線膨張係数が、２．９ｐｐｍ／Ｋ以上、５．１ｐｐｍ／Ｋ以下の範囲にするためには、ベース板１０を形成している絶縁体部１１の材料及び厚さ、金属層１２、１３を形成している材料及び厚さが重要になる。一般的に、金属層１２、１３を形成するための金属材料は、高い導電性を有すること等が求められており、例えば、銅、または、銅を含む材料が好ましく、このような導電性の高い金属材料は、一般的に線膨張係数が大きい。このため、ベース板１０を形成している絶縁体部１１は、絶縁性を有する材料であって、線膨張係数の低い材料を用いることが好ましい。絶縁体部１１を形成する材料としては、窒化アルミニウム（ＡｌＮ）、酸化アルミニウム（Ａｌ２Ｏ３）、窒化珪素（Ｓｉ３Ｎ４）等が挙げられる。これらの線膨張係数は、ＡｌＮが４．６ｐｐｍ／Ｋ、Ａｌ２Ｏ３が７．２ｐｐｍ／Ｋ、Ｓｉ３Ｎ４が２．７ｐｐｍ／Ｋである。よって、これらの中では、Ｓｉ３Ｎ４の線膨張係数が最も低く、本実施形態におけるベース板１０の絶縁体部１１を形成するための材料として好ましい。
　次に、図６に示す構造のベース板１０において、絶縁体部１１の厚さと金属層１２及び１３の厚さをどのような関係にしたら、ベース板１０の線膨張係数が、２．９ｐｐｍ／Ｋ以上、５．１ｐｐｍ／Ｋ以下の範囲となるか検討を行った。具体的には、下記の数１に示す式に基づきベース板１０の線膨張係数αＡＭＢを算出し検討を行った。
 
Figure JPOXMLDOC01-appb-M000001
 　尚、絶縁体部１１はＳｉ３Ｎ４により形成されており、金属層１２及び１３は銅により形成されているものとした。αＣｕは銅の線膨張係数であり１７ｐｐｍ／Ｋであり、αＳｉＮはＳｉ３Ｎ４の線膨張係数であり２．７ｐｐｍ／Ｋである。ＥＣｕは銅のヤング率であり１３０ＧＰａであり、ＥＳｉＮはＳｉ３Ｎ４のヤング率であり２９０ＧＰａである。ＶＣｕは一方の面及び他方の面における各々の銅の体積であり、ＶＳｉＮはＳｉ３Ｎ４の体積である。金属層１２と金属層１３は同じ体積になるように形成されており、絶縁体部１１の両面に形成されていることから、ベース板１０における銅の体積は、２ＶＣｕとなる。これらの値に基づきＶＳｉＮ／ＶＣｕの値を変化させた場合におけるベース板１０の線膨張係数αＡＭＢを算出した。この結果を図７及び図８に示す。図７は、ＶＳｉＮ／ＶＣｕの値が０から１００までの図であり、図８は、ＶＳｉＮ／ＶＣｕの値が０から１０までの図である。
　図７に示されるように、ベース板１０の線膨張係数αＡＭＢが５．１ｐｐｍ／Ｋとなるのは、ＶＳｉＮ／ＶＣｕの値が４．３の場合であり、ベース板１０の線膨張係数αＡＭＢが２．９ｐｐｍ／Ｋとなるのは、ＶＳｉＮ／ＶＣｕの値が８０の場合である。従って、ベース板１０におけるＶＳｉＮ／ＶＣｕの値の範囲は、４．３以上、８０以下が好ましい。ところで、絶縁体部１１と金属層１２及び１３の面積が同じであれば、ＶＳｉＮ／ＶＣｕの値は厚さの比となる。従って、ベース板１０における金属層１２及び１３の厚さｔＭに対する絶縁体部１１の厚さｔＩの範囲、即ち、ｔＩ／ｔＭの値の範囲は、４．３以上、８０以下が好ましい。
　また、ベース板１０において、絶縁体部１１が厚くなると放熱特性が低下するため、厚くなりすぎない方が好ましい。従って、ベース板１０の線膨張係数αＡＭＢは、５．１ｐｐｍ／Ｋ以下であって、ＳｉＣの線膨張係数と同じ４ｐｐｍ／Ｋ以上であることが好ましい。図８に示されるように、ベース板１０の線膨張係数αＡＭＢが４ｐｐｍ／Ｋとなるのは、ＶＳｉＮ／ＶＣｕの値が９．２の場合である。従って、ベース板１０におけるＶＳｉＮ／ＶＣｕの値の範囲は、４．３以上、９．２以下が好ましい。よって、ベース板１０における金属層１２及び１３の厚さｔＭに対する絶縁体部１１の厚さｔＩの範囲、即ち、ｔＩ／ｔＭの値の範囲は、４．３以上、９．２以下が好ましい。
　更に、本実施形態においては、半導体チップ２０は接合層３０によりベース板１０に接合されているが、図２に示されるように、ベース板１０の影響が支配的であるためには、接合層３０に対しベース板１０が十分厚いことが好ましい。従って、接合層３０の厚さが５０μｍである場合には、ベース板１０の厚さは５００μｍ以上であることが好ましい。
　また、ベース板１０が厚くなりすぎると、半導体装置が大きくなるため好ましくはないことから、ベース板１０の厚さは２ｍｍ以下が好ましい。また、金属層１２及び１３における導電性を十分に確保するためには、金属層１２及び１３をＣｕにより形成した場合には、金属層１２及び１３の厚さは１００μｍ以上必要である。これらのことから、ベース板１０の厚さが２ｍｍ（２０００μｍ）、金属層１２及び１３の厚さｔＭが１００μｍの場合では、ベース板１０の絶縁体部１１の厚さｔＩが１８００μｍとなる。この場合には、ベース板１０における金属層１２及び１３の厚さｔＭに対する絶縁体部１１の厚さｔＩ、即ち、ｔＩ／ｔＭの値は１８である。よって、ｔＩ／ｔＭは、１８以下であることが好ましい。
　次に、図９及び図１０に示すようなモジュールを作製し、昇降温サイクルの試験を行った結果について説明する。図９は、本実施形態における半導体装置のパワーモジュールである。このパワーモジュールは、ベース板１０の一方の面にＳｉＣにより形成された半導体チップ２０が接合層３０により接合されており、ベース板１０の他方の面には、放熱板４０が放熱板接合層４１により接合されている。半導体チップ２０の上面の電極端子とベース板１０の金属層により形成された電極端子、または、ベース板１０の金属層により形成された電極端子同士は、ボンディングワイヤ５１、５２、５３により接続されている。このパワーモジュールでは、放熱板４０の上のベース板１０及び半導体チップ２０は樹脂ケース６０により覆われており、樹脂ケース６０には外部との接続のための接続配線７１、７２、７３が設けられている。また、樹脂ケース６０の内部には、封止材６１が入れられている。
　図９に示す本実施形態における半導体装置のパワーモジュール９Ａでは、接合層３０は厚さが５０μｍの焼結銅により形成されている。ベース板１０は、絶縁体部１１が厚さ６５０μｍのＳｉ３Ｎ４と、金属層１２及び１３が各々の厚さ１５０μｍのＣｕにより形成されており、線膨張係数は約５．１ｐｐｍ／Ｋである。放熱板４０は、金属複合材であるＡｌＳｉＣにより形成されており、ＶＳｉＮ／ＶＣｕの値は、４．３３であり、線膨張係数は約７．５ｐｐｍ／Ｋである。放熱板接合層４１は、Ｓｎ及びアンチモン（Ｓｂ）により形成されるＳｎ－５Ｓｂはんだ材により形成されている。ボンディングワイヤ５１、５２、５３は、アルミニウム（Ａｌ）により形成されており、樹脂ケース６０は、樹脂材料により形成されており、封止材６１は、例えば、シリコーンゲルにより形成されている。
　図１０は、比較に用いた半導体装置のパワーモジュール１０Ａである。このパワーモジュールは、ベース板９１０の一方の面にＳｉＣにより形成された半導体チップ２０が接合層９３０により接合されており、ベース板９１０の他方の面には、放熱板９４０が放熱板接合層４１により接合されている。半導体チップ２０の上面の電極端子とベース板１０の金属層により形成された電極端子、または、ベース板１０の金属層により形成された電極端子同士は、ボンディングワイヤ５１、５２、５３により接続されている。このパワーモジュールでは、放熱板４０の上のベース板１０及び半導体チップ２０は樹脂ケース６０により覆われており、樹脂ケース６０には外部との接続のための接続配線７１、７２、７３が設けられている。また、樹脂ケース６０の内部には、封止材６１が入れられている。
　図１０に示す半導体装置のパワーモジュールでは、接合層９３０は厚さが１００μｍのＳｎ－１０Ｓｂにより形成されており、この線膨張係数は、２１ｐｐｍ／Ｋである。ベース板９１０は、絶縁体部９１１が厚さ３２０μｍのＳｉ３Ｎ４と、金属層９１２及び９１３が各々の厚さ３００μｍのＣｕにより形成されており、ＶＳｉＮ／ＶＣｕの値は、１．０７であり、線膨張係数は９ｐｐｍ／Ｋである。放熱板９４０は、Ｃｕにより形成されている。
　図１１及び図１２は、図９に示され本実施形態における半導体装置のパワーモジュールと図１０に示される比較に用いた半導体装置のパワーモジュールについて昇降温試験を行った結果である。図１１及び図１２では、本実施形態における半導体装置のパワーモジュール９Ａ及び比較に用いた半導体装置のパワーモジュール１０Ａを各々３個作製して測定を行った。図１１及び図１２における実線は、本実施形態における半導体装置のパワーモジュール９Ａにおける特性であり、破線は比較に用いた半導体装置のパワーモジュール１０Ａにおける特性である。
　図１１は、各々のパワーモジュールにおける熱抵抗の変化を調べたものであり、初期温度をＴ１とし、消費電力Ｐを投入した場合の温度をＴ２とした場合、Ｒｔｈ＝（Ｔ１－Ｔ２）／Ｐにより算出される熱抵抗Ｒｔｈの値の変化量を縦軸にしたものである。昇降温サイクルが５００回程度までは、本実施形態における半導体装置のパワーモジュール９Ａも比較に用いた半導体装置のパワーモジュール１０Ａもあまり変化はない。しかしながら、昇降温サイクルが５００回を超え１０００回程度になると、比較に用いた半導体装置のパワーモジュール１０Ａにおける熱抵抗の変化量が急増する。一方、本実施形態における半導体装置のパワーモジュール９Ａでは、あまり変化がなく、変化量も１０％以下である。
　図１２は、各々のパワーモジュールにおけるオン抵抗の変化を調べたものであり、初期のオン抵抗に対するオン抵抗の変化量を縦軸にしたものである。尚、初期においては、印加電圧が２Ｖにおいて流れる電流は１００Ａであり、初期のオン抵抗は２ｍΩである。昇降温サイクルが５００回程度までは、本実施形態における半導体装置のパワーモジュール９Ａも比較に用いた半導体装置のパワーモジュール１０Ａもあまり変化はない。しかしながら、昇降温サイクルが５００回を超え１０００回程度になると、比較に用いた半導体装置のパワーモジュール１０Ａにおけるオン抵抗の変化量が急増する。一方、本実施形態における半導体装置のパワーモジュール９Ａでは、あまり変化がなく、変化量も１０％以下である。
　図１１及び図１２に示されるように、比較に用いた半導体装置のパワーモジュール１０Ａにおける熱抵抗の変化量やオン抵抗の変化量が急増するのは、接合層における接合面積が減少したことによるものと推察される。これに対し、本実施形態における半導体装置のパワーモジュール９Ａでは、接合層における接合面積の減少は殆どないため、熱抵抗やオン抵抗の変化量はあまり変わらない。
　また、本実施形態においては、半導体チップの両面にベース板を設けた構造のものであってもよい。具体的には、図１３に示されるように、半導体チップ２０の一方の面２０ａに第１の接合層１３１により第１のベース板１１１を接合し、他方の面２０ｂに第２の接合層１３２により第２のベース板１１２を接合した構造のものであってもよい。尚、第１のベース板１１１及び第２のベース板１１２は、図６に示されるベース板１０と同じ構造のものであり、絶縁体部１１の両面に、金属層１２、１３が形成されている。また、第１の接合層１３１及び第２の接合層１３２は、接合層３０と同じ材料により形成されている。
　以上、実施形態について詳述したが、特定の実施形態に限定されるものではなく、特許請求の範囲に記載された範囲内において、種々の変形及び変更が可能である。
１０　　　　ベース板
１１　　　　絶縁体部
１２　　　　金属層
１３　　　　金属層
２０　　　　半導体チップ
３０　　　　接合層

Claims (7)

  1. 　炭化珪素を含む材料により形成されている半導体チップと、
    　板状の絶縁体部の両面に、金属層が形成されたベース板と、
    　前記ベース板の一方の面に、前記半導体チップを接合する接合材と、
    　を有し、
    　前記接合材は、接合後の融点が７７３℃以上の金属材料により形成されており、
    　前記接合材の厚さは、５０μｍ以下であり、
    　前記ベース板の厚さは、５００μｍ以上であり、
    　前記絶縁体部の厚さをｔＩとし、前記金属層の厚さをｔＭとした場合に、ｔＩ／ｔＭの値は、４．３以上である半導体装置。
  2. 　前記絶縁体部は、窒化珪素を含む材料により形成されており、
    　前記金属層は、銅または銀を含む材料により形成されている請求項１に記載の半導体装置。
  3. 　ｔＩ／ｔＭの値は、１８以下である請求項１または２に記載の半導体装置。
  4. 　ｔＩ／ｔＭの値は、９．２以下である請求項１または２に記載の半導体装置。
  5. 　炭化珪素を含む材料により形成されている半導体チップと、
    　絶縁体部の両面に金属層が形成されたベース板と、
    　前記ベース板の一方の面に前記半導体チップを接合する接合材と、
    　を有し、
    　前記接合材は、接合後の融点が７７３℃以上の金属材料により形成されており、
    　前記接合材の厚さは、５０μｍ以下であり、
    　前記ベース板の厚さは、５００μｍ以上であり、
    　前記ベース板の線膨張係数は、２．９ｐｐｍ／Ｋ以上、５．１ｐｐｍ／Ｋ以下である半導体装置。
  6. 　前記ベース板の厚さは、２ｍｍ以下である請求項１から５のいずれかに記載の半導体装置。
  7. 　前記ベース板は第１のベース板であり、前記半導体チップの一方の面に前記第１のベース板が接合されているものであって、
    　前記半導体チップの他方の面には、接合材により第２のベース板が接合されており、
    　前記第２のベース板は、前記第１のベース板と、同じ構造のものである請求項１から６のいずれかに記載の半導体装置。
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