JPWO2023204054A1 - - Google Patents

Info

Publication number
JPWO2023204054A1
JPWO2023204054A1 JP2024516191A JP2024516191A JPWO2023204054A1 JP WO2023204054 A1 JPWO2023204054 A1 JP WO2023204054A1 JP 2024516191 A JP2024516191 A JP 2024516191A JP 2024516191 A JP2024516191 A JP 2024516191A JP WO2023204054 A1 JPWO2023204054 A1 JP WO2023204054A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024516191A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023204054A1 publication Critical patent/JPWO2023204054A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Ceramic Products (AREA)
JP2024516191A 2022-04-18 2023-04-07 Pending JPWO2023204054A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022067982 2022-04-18
PCT/JP2023/014392 WO2023204054A1 (ja) 2022-04-18 2023-04-07 セラミックス回路基板、半導体装置、セラミックス回路基板の製造方法、及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
JPWO2023204054A1 true JPWO2023204054A1 (https=) 2023-10-26

Family

ID=88419910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024516191A Pending JPWO2023204054A1 (https=) 2022-04-18 2023-04-07

Country Status (5)

Country Link
US (1) US20240304516A1 (https=)
EP (1) EP4513547A4 (https=)
JP (1) JPWO2023204054A1 (https=)
CN (1) CN118402060A (https=)
WO (1) WO2023204054A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786703A (ja) * 1993-09-10 1995-03-31 Toshiba Corp セラミックス回路基板
JP2013042165A (ja) * 2005-08-29 2013-02-28 Hitachi Metals Ltd 回路基板及びこれを用いた半導体モジュール、回路基板の製造方法
JP6430382B2 (ja) * 2013-08-08 2018-11-28 株式会社東芝 回路基板および半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4557398B2 (ja) 2000-09-07 2010-10-06 株式会社東芝 電子素子
JP6341822B2 (ja) * 2014-09-26 2018-06-13 三菱電機株式会社 半導体装置
WO2018021473A1 (ja) * 2016-07-28 2018-02-01 株式会社 東芝 回路基板および半導体モジュール

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786703A (ja) * 1993-09-10 1995-03-31 Toshiba Corp セラミックス回路基板
JP2013042165A (ja) * 2005-08-29 2013-02-28 Hitachi Metals Ltd 回路基板及びこれを用いた半導体モジュール、回路基板の製造方法
JP6430382B2 (ja) * 2013-08-08 2018-11-28 株式会社東芝 回路基板および半導体装置

Also Published As

Publication number Publication date
EP4513547A4 (en) 2026-04-29
WO2023204054A1 (ja) 2023-10-26
US20240304516A1 (en) 2024-09-12
EP4513547A1 (en) 2025-02-26
CN118402060A (zh) 2024-07-26

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