JP5313366B2 - 基板用塗布装置及び基板塗布方法 - Google Patents
基板用塗布装置及び基板塗布方法 Download PDFInfo
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- JP5313366B2 JP5313366B2 JP2011547351A JP2011547351A JP5313366B2 JP 5313366 B2 JP5313366 B2 JP 5313366B2 JP 2011547351 A JP2011547351 A JP 2011547351A JP 2011547351 A JP2011547351 A JP 2011547351A JP 5313366 B2 JP5313366 B2 JP 5313366B2
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- 239000000758 substrate Substances 0.000 title claims description 98
- 238000000576 coating method Methods 0.000 title claims description 59
- 239000011248 coating agent Substances 0.000 title claims description 51
- 238000011144 upstream manufacturing Methods 0.000 claims description 29
- 239000007788 liquid Substances 0.000 claims description 19
- 238000004140 cleaning Methods 0.000 claims description 15
- 230000003028 elevating effect Effects 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims 2
- 230000037452 priming Effects 0.000 description 18
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
- B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0283—Flat jet coaters, i.e. apparatus in which the liquid or other fluent material is projected from the outlet as a cohesive flat jet in direction of the work
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Spray Control Apparatus (AREA)
Description
2−サブフレーム
3−第1上流側コンベア
4−第2上流側コンベア
5−第1下流側コンベア
6−第2下流側コンベア
7−精密ステージ
8−ノズル
9−プライミングローラ
10−基板用塗布装置
100−制御部
W−基板
Claims (6)
- 基板を載置する載置面を水平にして備え、搬送方向に沿って所定範囲内で往復移動自在にされたステージと、
塗布液を下方に吐出するスリットであって前記搬送方向に直交するスリットを備えたノズルと、
基板を表面が水平面内に位置するように前記搬送方向に沿って前記載置面を経由して搬送し、少なくとも前記所定範囲の長さの中間部が昇降自在にされたコンベアと、
前記ステージを前記所定範囲内の上流端と下流端との間に往復移動させるステージ移動手段と、
前記コンベアの中間部を、搬送面が前記載置面に一致する搬送位置と搬送面が前記載置面より下方の非搬送位置との間に昇降させるコンベア昇降手段と、
前記コンベアによって搬送された基板を前記載置面に載置した前記ステージが前記上流端から前記下流端に移動する間に、基板の表面に対して前記ノズルから塗布液が吐出されるように、前記ステージ移動手段及び前記コンベア昇降手段の動作を制御するように構成された制御部と、を備えた基板用塗布装置。 - 前記制御部は、
前記ステージを、前記載置面に基板を載置して前記上流端から前記下流端に向けて往動させ、前記載置面に基板を載置せずに前記下流端から前記上流端に復動させるように、前記ステージ移動手段の動作を制御し、
前記コンベアの中間部を、前記上流端に位置している前記ステージの上方に基板が到達した時に前記非搬送位置に下降させ、前記載置面に基板を載置した前記ステージが前記下流端に到達した時に前記搬送位置に上昇させるように、前記コンベア昇降手段の動作を制御する、請求項1に記載の基板用塗布装置。 - 前記ノズルは、前記ステージの上方で上下方向に往復移動自在にされ、
前記ノズルを、前記載置面に載置された基板の表面に対する塗布液の吐出に最適な吐出位置とより上方の退避位置との間に昇降させるノズル昇降手段を備え、
前記制御部は、前記ノズルを、前記コンベアの中間部が前記非搬送位置に下降した後に前記吐出位置に下降させ、前記載置面に基板を載置した前記ステージが前記下流端に到達した時に前記退避位置に上昇させるように、前記ノズル昇降手段の動作を制御する請求項2に記載の基板用塗布装置。 - 前記ノズルのスリットを清掃する清掃手段であって前記搬送方向に沿って往復移動自在にされた清掃部材と、前記清掃部材を前記ノズルに当接する清掃位置と当接しない待機位置との間に移動させる清掃部材移動手段と、をさらに備え、
前記制御部は、前記清掃部材を、前記ノズルが前記塗布位置から前記退避位置まで上昇した時に前記清掃位置に移動させ、前記ノズルが前記退避位置から前記塗布位置に移動する前に前記待機位置に位置するように、前記清掃部材移動手段を動作させる請求項3に記載の基板用塗布装置。 - 前記コンベアは、基板における搬送方向に平行な2側面の近傍に接触する請求項1乃至4の何れかに記載の基板用塗布装置。
- コンベアを介して基板を所定の搬送方向に沿って水平に搬送し、ノズルから吐出した塗布液を基板の表面に塗布する基板塗布方法であって、
基板を載置する載置面を水平にして備え、搬送方向に沿って上流端と下流端との間で往復移動自在にされたステージと、基板を表面が水平面内に位置するように前記搬送方向に沿って前記載置面を経由して搬送し、少なくとも前記所定範囲の長さの中間部が搬送面の高さを前記載置面に一致する搬送位置とより下方の非搬送位置との間で昇降自在にされたコンベアと、を準備し、
前記コンベアによって搬送された第1の基板が前記上流端に位置する前記ステージの載置面上に到達した時に、前記コンベアの中間部を前記搬送位置から前記非搬送位置に下降させる工程と、
前記第1の基板を搭載した前記ステージを前記上流端から前記下流端に移動させつつ、前記第1の基板の表面に対して前記ノズルから塗布液を吐出する工程と、
前記ステージが前記下流端に達した後に、前記コンベアの中間部を前記非搬送位置から前記搬送位置に上昇させる工程と、
前記コンベアによって搬送された第2の基板が前記上流端に達する前に、前記ステージを前記下流端から前記上流端に復動させる工程と、
を含む基板塗布方法。
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JP2011547351A JP5313366B2 (ja) | 2009-12-28 | 2010-06-03 | 基板用塗布装置及び基板塗布方法 |
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PCT/JP2010/059429 WO2011080933A1 (ja) | 2009-12-28 | 2010-06-03 | 基板用塗布装置及び基板塗布方法 |
JP2011547351A JP5313366B2 (ja) | 2009-12-28 | 2010-06-03 | 基板用塗布装置及び基板塗布方法 |
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JP5313366B2 true JP5313366B2 (ja) | 2013-10-09 |
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US (1) | US9067234B2 (ja) |
JP (1) | JP5313366B2 (ja) |
KR (1) | KR101371912B1 (ja) |
CN (1) | CN102687240B (ja) |
TW (1) | TWI432266B (ja) |
WO (1) | WO2011080933A1 (ja) |
Families Citing this family (12)
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JP5529673B2 (ja) * | 2010-08-16 | 2014-06-25 | 中外炉工業株式会社 | 両面塗工装置 |
CN104512742A (zh) * | 2013-09-27 | 2015-04-15 | 北大方正集团有限公司 | 一种传输装置及具有该传输装置的涂布机 |
US20150128856A1 (en) * | 2013-11-14 | 2015-05-14 | Illinois Tool Works Inc. | Dispensing apparatus having transport system and method for transporting a substrate within the dispensing apparatus |
US9357686B2 (en) | 2013-11-14 | 2016-05-31 | Illinois Tool Works Inc. | Dispensing apparatus having substrate inverter system and clamping system, and method for dispensing a viscous material on a substrate |
JP6272138B2 (ja) * | 2014-05-22 | 2018-01-31 | 東京エレクトロン株式会社 | 塗布処理装置 |
US9662675B2 (en) | 2014-07-31 | 2017-05-30 | Illinois Tool Works Inc. | External inverter system for variable substrate thickness and method for rotating a substrate |
CN106881240A (zh) * | 2017-04-05 | 2017-06-23 | 石狮市鑫跃精密科技有限公司 | 一种自动上料的边框转角连接件点胶机及其使用方法 |
DE102018205157A1 (de) | 2018-04-05 | 2019-10-10 | Ekra Automatisierungssysteme Gmbh | Druckvorrichtung |
DE102018205944A1 (de) * | 2018-04-18 | 2019-10-24 | Ekra Automatisierungssysteme Gmbh | Drucksystem zum Bedrucken von Substraten, Verfahren zum Betreiben des Drucksystems |
CN111203367B (zh) * | 2020-02-27 | 2020-10-27 | 浙江海鸿工业产品设计有限公司 | 一种生产led灯时的自动化注胶设备 |
CN112114500A (zh) * | 2020-10-23 | 2020-12-22 | 江苏迪盛智能科技有限公司 | 一种曝光机 |
CN113210202B (zh) * | 2021-05-14 | 2022-04-29 | 深圳源明杰科技股份有限公司 | 一种广泛应用的电子标签生产点胶机 |
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JPS61220752A (ja) * | 1985-03-25 | 1986-10-01 | Agency Of Ind Science & Technol | 接着剤定着布の製造装置 |
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JP2004298775A (ja) * | 2003-03-31 | 2004-10-28 | Dainippon Printing Co Ltd | 塗布装置及び塗布方法 |
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-
2010
- 2010-06-03 US US13/519,212 patent/US9067234B2/en active Active
- 2010-06-03 WO PCT/JP2010/059429 patent/WO2011080933A1/ja active Application Filing
- 2010-06-03 JP JP2011547351A patent/JP5313366B2/ja active Active
- 2010-06-03 CN CN201080059809.1A patent/CN102687240B/zh active Active
- 2010-06-03 KR KR1020127019205A patent/KR101371912B1/ko active IP Right Grant
- 2010-06-08 TW TW99118527A patent/TWI432266B/zh active
Patent Citations (5)
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JPS61220752A (ja) * | 1985-03-25 | 1986-10-01 | Agency Of Ind Science & Technol | 接着剤定着布の製造装置 |
JPH09192597A (ja) * | 1996-01-19 | 1997-07-29 | Nichiha Corp | 建築板の塗装方法および塗装装置 |
JP2004298775A (ja) * | 2003-03-31 | 2004-10-28 | Dainippon Printing Co Ltd | 塗布装置及び塗布方法 |
JP2007173365A (ja) * | 2005-12-20 | 2007-07-05 | Tokyo Electron Ltd | 塗布乾燥処理システム及び塗布乾燥処理方法 |
JP2008166478A (ja) * | 2006-12-28 | 2008-07-17 | Tokyo Electron Ltd | レジスト液供給装置及び基板処理システム |
Also Published As
Publication number | Publication date |
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CN102687240A (zh) | 2012-09-19 |
JPWO2011080933A1 (ja) | 2013-05-09 |
TWI432266B (zh) | 2014-04-01 |
US20120288635A1 (en) | 2012-11-15 |
KR20120091461A (ko) | 2012-08-17 |
CN102687240B (zh) | 2015-08-26 |
US9067234B2 (en) | 2015-06-30 |
WO2011080933A1 (ja) | 2011-07-07 |
KR101371912B1 (ko) | 2014-03-07 |
TW201121662A (en) | 2011-07-01 |
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