JP5886259B2 - 非接触基板移送反転機 - Google Patents
非接触基板移送反転機 Download PDFInfo
- Publication number
- JP5886259B2 JP5886259B2 JP2013217059A JP2013217059A JP5886259B2 JP 5886259 B2 JP5886259 B2 JP 5886259B2 JP 2013217059 A JP2013217059 A JP 2013217059A JP 2013217059 A JP2013217059 A JP 2013217059A JP 5886259 B2 JP5886259 B2 JP 5886259B2
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- Prior art keywords
- substrate
- transfer
- contact
- reversing machine
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
- H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
Description
20 移送部材
22 ロータリモータ
25 減速機
30 基板支持部材
31 反転供給部
32 フレーム
33 空気吸入部
33a 空気吸入ファン
35 反転受取部
38 空気排出部
38a 空気吐出口
40 動力伝達部材
100 反転機
P 基板
Claims (7)
- ガイドレールに沿って移動する移送部材と、
前記移送部材に設けられて抗力と揚力により基板を非接触で支持する基板支持部材と、
前記基板支持部材に動力を提供して前記基板支持部材を回転させる動力伝達部材と、を含み、
前記基板支持部材は、フレームと、前記フレームに設けられて基板に吸着した異物を吸い込む空気吸入部と、所定角度傾斜して形成された空気吐出口を有し、前記フレームに設けられて空気排出による前記抗力と揚力により基板を非接触状態で支持する空気排出部と、を備える、非接触基板移送反転機。 - 前記ガイドレールには移送部材の移動距離を制限するリミットスイッチが設けられている、請求項1に記載の非接触基板移送反転機。
- 前記空気吸入部と空気排出部はそれぞれ交互に設けられている、請求項1に記載の非接触基板移送反転機。
- 前記基板支持部材は、移送部材の上側に一対で設けられてそれぞれ時計方向および反時計方向に回転する、請求項1に記載の非接触基板移送反転機。
- 前記一対の基板支持部材は、基板を非接触で移送する反転供給部と、前記反転供給部を介して供給される基板を受け取る反転受取部と、からなる、請求項4に記載の非接触基板移送反転機。
- 前記動力伝達部材は、前記基板支持部材が回転方向に沿って昇下降するように動力を提供するための機構を含み、前記機構は、回転力を発生するモータと、前記モータの回転数を減速する減速機と、当該減速した回転力が提供され、前記基板支持部材を回転させる回転ロータリモータと、を含む、請求項1または4に記載の非接触基板移送反転機。
- 前記移送部材は、リニアモータ、スクリュー、ベルト、チェーンのうちいずれか一つを適用してなる、請求項1に記載の非接触基板移送反転機。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130042382A KR101451506B1 (ko) | 2013-04-17 | 2013-04-17 | 비접촉 기판이송 반전기 |
KR10-2013-0042382 | 2013-04-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014210664A JP2014210664A (ja) | 2014-11-13 |
JP5886259B2 true JP5886259B2 (ja) | 2016-03-16 |
Family
ID=51705623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013217059A Expired - Fee Related JP5886259B2 (ja) | 2013-04-17 | 2013-10-18 | 非接触基板移送反転機 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20140314539A1 (ja) |
JP (1) | JP5886259B2 (ja) |
KR (1) | KR101451506B1 (ja) |
CN (1) | CN104108590B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107098160A (zh) * | 2017-04-26 | 2017-08-29 | 中国工程物理研究院化工材料研究所 | 一种柔性多孔薄型片材的抓取与传递装置 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105035755A (zh) * | 2015-08-11 | 2015-11-11 | 江苏安纳金机械有限公司 | 显示屏自动装载装置及方法 |
CN105501913B (zh) * | 2015-12-04 | 2017-08-29 | 宁波韵升股份有限公司 | 一种磁钢产品自动翻面装置及其翻面方法 |
CN105600389A (zh) * | 2016-02-06 | 2016-05-25 | 武汉人天包装自动化技术股份有限公司 | 一种高速转移翻转装置 |
CN105800312A (zh) * | 2016-05-04 | 2016-07-27 | 上海凯思尔电子有限公司 | 一种具有自适配功能的翻板输送机构 |
US10974902B2 (en) * | 2016-07-11 | 2021-04-13 | Sakai Display Products Corporation | Substrate inverting device |
KR101856653B1 (ko) * | 2016-10-17 | 2018-06-20 | 주식회사 이오테크닉스 | 기압을 이용한 마스크 고정모듈 |
CN108337822A (zh) * | 2017-12-27 | 2018-07-27 | 昆山遥矽微电子科技有限公司 | 印刷电路板的安装箱 |
CN109250494A (zh) * | 2018-10-19 | 2019-01-22 | 博众精工科技股份有限公司 | 快换吸气组装治具 |
TW202017830A (zh) * | 2018-11-09 | 2020-05-16 | 鴻騏新技股份有限公司 | 雙軌翻板機台 |
KR102199662B1 (ko) * | 2020-05-13 | 2021-01-07 | (주)킴스이노베이션 | 인쇄회로기판용 투웨이 불량검사장치 |
CN113772383B (zh) * | 2021-09-23 | 2023-10-27 | 珠海奇川精密设备有限公司 | 双面贴膜设备及方法 |
CN115846275B (zh) * | 2022-12-02 | 2023-06-23 | 上海瞻瞩电子科技有限公司 | 一种半导体元件清洗装置 |
CN117334617B (zh) * | 2023-10-31 | 2024-03-29 | 上海世禹精密设备股份有限公司 | 基板翻转装置 |
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JPH0750336A (ja) * | 1993-08-04 | 1995-02-21 | Hitachi Ltd | 差動排気型真空吸着治具 |
JPH0967020A (ja) * | 1995-08-31 | 1997-03-11 | Hitachi Kizai Kk | スクリューフィーダ |
JP3319564B2 (ja) * | 1996-03-15 | 2002-09-03 | 株式会社アドバンスト・ディスプレイ | 基板搬送装置 |
CN2444251Y (zh) * | 2000-09-29 | 2001-08-22 | 陈聪智 | 可供液晶显示基板持续传送的翻转装置 |
US6585478B1 (en) * | 2000-11-07 | 2003-07-01 | Asm America, Inc. | Semiconductor handling robot with improved paddle-type end effector |
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-
2013
- 2013-04-17 KR KR1020130042382A patent/KR101451506B1/ko active IP Right Grant
- 2013-10-09 US US14/049,778 patent/US20140314539A1/en not_active Abandoned
- 2013-10-18 JP JP2013217059A patent/JP5886259B2/ja not_active Expired - Fee Related
- 2013-11-26 CN CN201310608683.4A patent/CN104108590B/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107098160A (zh) * | 2017-04-26 | 2017-08-29 | 中国工程物理研究院化工材料研究所 | 一种柔性多孔薄型片材的抓取与传递装置 |
Also Published As
Publication number | Publication date |
---|---|
CN104108590A (zh) | 2014-10-22 |
JP2014210664A (ja) | 2014-11-13 |
US20140314539A1 (en) | 2014-10-23 |
CN104108590B (zh) | 2016-09-07 |
KR101451506B1 (ko) | 2014-10-17 |
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