JP5297418B2 - 異方性導電材料及びその製造方法、並びに実装体及びその製造方法 - Google Patents
異方性導電材料及びその製造方法、並びに実装体及びその製造方法 Download PDFInfo
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- JP5297418B2 JP5297418B2 JP2010140502A JP2010140502A JP5297418B2 JP 5297418 B2 JP5297418 B2 JP 5297418B2 JP 2010140502 A JP2010140502 A JP 2010140502A JP 2010140502 A JP2010140502 A JP 2010140502A JP 5297418 B2 JP5297418 B2 JP 5297418B2
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- resin
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- vinyl acetate
- film
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- 239000004020 conductor Substances 0.000 title claims description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 title description 14
- 229920005989 resin Polymers 0.000 claims description 55
- 239000011347 resin Substances 0.000 claims description 55
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 38
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 38
- 239000000853 adhesive Substances 0.000 claims description 37
- 230000001070 adhesive effect Effects 0.000 claims description 37
- 239000002245 particle Substances 0.000 claims description 28
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 23
- 239000000155 melt Substances 0.000 claims description 16
- 239000007870 radical polymerization initiator Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 14
- 229920000728 polyester Polymers 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 9
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 8
- 150000002978 peroxides Chemical class 0.000 claims description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 239000012933 diacyl peroxide Substances 0.000 claims description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 2
- 150000002432 hydroperoxides Chemical class 0.000 claims description 2
- 125000005634 peroxydicarbonate group Chemical group 0.000 claims description 2
- 229920006287 phenoxy resin Polymers 0.000 claims description 2
- 239000013034 phenoxy resin Substances 0.000 claims description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 229920005749 polyurethane resin Polymers 0.000 claims description 2
- 150000004979 silylperoxides Chemical class 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 25
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- 239000000047 product Substances 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 13
- 238000003786 synthesis reaction Methods 0.000 description 11
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 10
- 239000007787 solid Substances 0.000 description 7
- -1 methacryloxy Chemical group 0.000 description 6
- 239000012046 mixed solvent Substances 0.000 description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
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- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
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- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- 239000003999 initiator Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000005026 oriented polypropylene Substances 0.000 description 2
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- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- NLSFWPFWEPGCJJ-UHFFFAOYSA-N 2-methylprop-2-enoyloxysilicon Chemical compound CC(=C)C(=O)O[Si] NLSFWPFWEPGCJJ-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 101100389815 Caenorhabditis elegans eva-1 gene Proteins 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 101000969770 Homo sapiens Myelin protein zero-like protein 2 Proteins 0.000 description 1
- 102100021272 Myelin protein zero-like protein 2 Human genes 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- BNMMXDHVMLZQGP-UHFFFAOYSA-N phosphono prop-2-eneperoxoate Chemical compound OP(O)(=O)OOC(=O)C=C BNMMXDHVMLZQGP-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 150000005691 triesters Chemical class 0.000 description 1
- KBMBVTRWEAAZEY-UHFFFAOYSA-N trisulfane Chemical compound SSS KBMBVTRWEAAZEY-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- Polymers & Plastics (AREA)
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- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Description
1.異方性導電材料及びその製造方法
2.実装体及びその製造方法
3.実施例
本発明の具体例として示す異方性導電材料は、ラジカル系接着剤組成物に導電性粒子を分散させて構成される。また、異方性導電材料はペースト又はフィルム形状であり、目的に応じて適宜選択することができる。
次に、上述した異方性導電フィルムを用いた電子部品の実装方法について説明する。本実施の形態における電子部品の実装方法は、絶縁性基板の電極上に、膜形成樹脂と、メルトフローレートが400g/10min以上であるエチレン−酢酸ビニル共重合樹脂と、ラジカル重合性樹脂と、ラジカル重合開始剤とを含有する接着剤組成物に導電性粒子が分散された異方性導電フィルム、電子部品を順に配置し、電子部品の上面から熱圧着ヘッドにて押圧し、絶縁性基板の電極と電子部品の電極とを導電性粒子を介して接続するとともに、異方性導電フィルムを硬化させるものである。これにより、接着剤組成物に分散された導電性粒子を介して絶縁性基板の電極と電子部品の電極とが接続された実装体が得られる。
以下、本発明の実施例について説明する。ここでは、先ず、比較例1〜4及び実施例1〜9の異方性導電フィルムを作製し、この異方性導電フィルムを用いて接合条件が異なる第1の実装体及び第2の実装体を完成させた。そして、第1の実装体及び第2の実装体の接続抵抗及び接着強度を測定した。なお、本発明はこれらの実施例に限定されるものではない。
フィルム形成材としてポリエステルウレタン樹脂(品名:UR8200、東洋紡績社製、メチルエチルケトン/トルエン=50/50の混合溶媒にて20質量%に溶解したもの)を固形分換算で60質量部、ラジカル重合性樹脂(品名:EB−600、ダイセル・サイテック社製)を34質量部、シランカップリング剤(品名:KBM−503、信越化学社製)を1質量部、リン酸アクリレート(品名:P−1M、共栄社化学社製)を1質量部、及びラジカル重合開始剤(品名:パーヘキサC、日本油脂社製)を4質量部として構成された全体が100質量部の接着剤組成物に対して導電性粒子(品名:AUL704、積水化学工業社製)の平均粒子密度が10000個/mm2になるように分散させた。この異方性導電接続材料をPETフィルム上にバーコーターを用いて塗布し、オーブンで乾燥させ、厚さ15μmの比較例1の異方性導電フィルムを作製した。
フィルム形成材としてポリエステルウレタン樹脂(品名:UR8200、東洋紡績社製、メチルエチルケトン/トルエン=50/50の混合溶媒にて20質量%に溶解したもの)を固形分換算で50質量部、応力緩和成分としてアクリルゴム(品名:SG−600LB、ナガセケムテックス社製)を10質量部とした以外は、比較例1と同様にして比較例2の異方性導電フィルムを作製した。
フィルム形成材としてポリエステルウレタン樹脂(品名:UR8200、東洋紡績社製、メチルエチルケトン/トルエン=50/50の混合溶媒にて20質量%に溶解したもの)を固形分換算で50質量部、上述した合成により得られたMFR=150、VA=19%のEVA1を10質量部とした以外は、比較例1と同様にして比較例3の異方性導電フィルムを作製した。
上述した合成により得られたMFR=150、VA=28%のEVA2を10質量部とした以外は、比較例3と同様にして比較例4の異方性導電フィルムを作製した。
上述した合成により得られたMFR=400、VA=19%のEVA3を10質量部とした以外は比較例3と同様にして実施例1の異方性導電フィルムを作製した。
上述した合成により得られたMFR=800、VA=19%のEVA4を10質量部とした以外は、比較例3と同様にして実施例2の異方性導電フィルムを作製した。
上述した合成により得られたMFR=400、VA=25%のEVA5を10質量部とした以外は、比較例3と同様にして実施例3の異方性導電フィルムを作製した。
上述した合成により得られたMFR=400、VA=28%のEVA6を10質量部とした以外は、比較例3と同様にして実施例4の異方性導電フィルムを作製した。
上述した合成により得られたMFR=400、VA=33%のEVA7を10質量部とした以外は、比較例3と同様にして実施例5の異方性導電フィルムを作製した。
上述した合成により得られたMFR=800、VA=28%のEVA8を10質量部とした以外は、比較例3と同様にして実施例6の異方性導電フィルムを作製した。
上述した合成により得られたMFR=1000、VA=28%のEVA9を10質量部とした以外は、比較例3と同様にして実施例7の異方性導電フィルムを作製した。
ポリエステルウレタン樹脂(品名:UR8200、東洋紡績社製、メチルエチルケトン/トルエン=50/50の混合溶媒にて20質量%に溶解したもの)を固形分換算で57質量部、上述した合成により得られたMFR=400、VA=25%のEVA5を3質量部とした以外は、比較例3と同様にして実施例8の異方性導電フィルムを作製した。
ポリエステルウレタン樹脂(品名:UR8200、東洋紡績社製、メチルエチルケトン/トルエン=50/50の混合溶媒にて20質量%に溶解したもの)を固形分換算で55質量部、上述した合成により得られたMFR=400、VA=25%のEVA5を5質量部とした以外は、比較例3と同様にして実施例9の異方性導電フィルムを作製した。
比較例1〜4及び実施例1〜9を用いて、COF(Chip On Film)の接合を行った、COF(50μmP、Cu8μmt−Snメッキ、38μmt、品名:Sperflex、住友金属鉱山社製)と、IZO(Indium Zinc Oxide)コーティングガラス(全表面IZOコート、ガラス厚0.7mm)との接合を行った。
第1の実装体及び第2の実装体について、初期(Initial)の抵抗と、温度85℃、湿度85%RH、500時間のTHテスト(Thermal Humidity Test)後の抵抗を測定した。測定は、デジタルマルチメータ(デジタルマルチメータ7555、横河電機社製)を用いて4端子法にて電流1mAを流したときの接続抵抗を測定した。
第1の実装体及び第2の実装体について、初期(Initial)の接着強度と、温度85℃、湿度85%RH、500時間のTHテスト(Thermal Humidity Test)後の接着強度を測定した。接着強度は、引張り試験機(品番:RTC1201、AND社製)を用いて測定速度50mm/secでCOFを引き上げたときの接着強度を測定した。
Claims (9)
- 膜形成樹脂と、エチレン−酢酸ビニル共重合樹脂と、ラジカル重合性樹脂と、ラジカル重合開始剤とを含有する接着剤組成物に導電性粒子が分散され、
前記エチレン−酢酸ビニル共重合樹脂のメルトフローレートが、400g/10min以上である異方性導電材料。 - 前記エチレン−酢酸ビニル共重合樹脂は、酢酸ビニルの含有率が25wt%以上である請求項1記載の異方性導電材料。
- 前記膜形成樹脂は、ポリエステルウレタン樹脂、ポリエステル樹脂、ポリウレタン樹脂、フェノキシ樹脂、アクリル樹脂、ポリイミド樹脂、ブチラール樹脂からなる群から選択される少なくとも1以上である請求項1又は2に記載の異方性導電材料。
- 前記ラジカル重合性樹脂は、エポキシアクリレート、ウレタンアクリレート、ポリエステルアクリレートからなる群から選択される少なくとも1以上である請求項1乃至3のいずれかに記載の異方性導電材料。
- 前記ラジカル重合開始剤は、パーオキシケタール、ジアシルパーオキサイド、パーオキシジカーボネート、パーオキシエステル、ジアルキルパーオキサイド、ハイドロパーオキサイド、シリルパーオキサイドからなる群から選択される少なくとも1以上である請求項1乃至4のいずれかに記載の異方性導電材料。
- 前記異方性導電材料は、フィルム形状である請求項1乃至5のいずれかに記載の異方性導電材料。
- 膜形成樹脂と、メルトフローレートが400g/10min以上であるエチレン−酢酸ビニル共重合樹脂と、ラジカル重合性樹脂と、ラジカル重合開始剤とを含有する接着剤組成物に導電性粒子を分散させる異方性導電材料の製造方法。
- 膜形成樹脂と、メルトフローレートが400g/10min以上であるエチレン−酢酸ビニル共重合樹脂と、ラジカル重合性樹脂と、ラジカル重合開始剤とを含有する接着剤組成物に分散された導電性粒子を介して絶縁性基板の電極と電子部品の電極とが接続された実装体。
- 絶縁性基板の電極上に、膜形成樹脂と、メルトフローレートが400g/10min以上であるエチレン−酢酸ビニル共重合樹脂と、ラジカル重合性樹脂と、ラジカル重合開始剤とを含有する接着剤組成物に導電性粒子が分散された異方性導電材料、電子部品を順に配置し、
前記電子部品の上面から熱圧着ヘッドにて押圧し、
前記絶縁性基板の電極と前記電子部品の電極とを導電性粒子を介して接続するとともに、前記異方性導電材料を硬化させる実装体の製造方法。
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PCT/JP2011/064159 WO2011162256A1 (ja) | 2010-06-21 | 2011-06-21 | 異方性導電材料及びその製造方法、並びに実装体及びその製造方法 |
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CN201180030875.0A CN102947893B (zh) | 2010-06-21 | 2011-06-21 | 各向异性导电材料和其制造方法、以及安装体和其制造方法 |
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