JP5288987B2 - レーザ加工装置 - Google Patents

レーザ加工装置 Download PDF

Info

Publication number
JP5288987B2
JP5288987B2 JP2008271364A JP2008271364A JP5288987B2 JP 5288987 B2 JP5288987 B2 JP 5288987B2 JP 2008271364 A JP2008271364 A JP 2008271364A JP 2008271364 A JP2008271364 A JP 2008271364A JP 5288987 B2 JP5288987 B2 JP 5288987B2
Authority
JP
Japan
Prior art keywords
laser processing
correction
workpiece
positional deviation
command
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008271364A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010099674A (ja
Inventor
昌裕 竹内
充弘 金田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2008271364A priority Critical patent/JP5288987B2/ja
Priority to TW098135555A priority patent/TW201024012A/zh
Priority to CN2009102071015A priority patent/CN101722363B/zh
Priority to KR1020090100176A priority patent/KR101103926B1/ko
Publication of JP2010099674A publication Critical patent/JP2010099674A/ja
Application granted granted Critical
Publication of JP5288987B2 publication Critical patent/JP5288987B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B1/00—Comparing elements, i.e. elements for effecting comparison directly or indirectly between a desired value and existing or anticipated values
    • G05B1/01—Comparing elements, i.e. elements for effecting comparison directly or indirectly between a desired value and existing or anticipated values electric
    • G05B1/04—Comparing elements, i.e. elements for effecting comparison directly or indirectly between a desired value and existing or anticipated values electric with sensing of the position of the pointer of a measuring instrument
    • G05B1/08—Comparing elements, i.e. elements for effecting comparison directly or indirectly between a desired value and existing or anticipated values electric with sensing of the position of the pointer of a measuring instrument stepwise sensing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)
  • Numerical Control (AREA)
JP2008271364A 2008-10-21 2008-10-21 レーザ加工装置 Active JP5288987B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008271364A JP5288987B2 (ja) 2008-10-21 2008-10-21 レーザ加工装置
TW098135555A TW201024012A (en) 2008-10-21 2009-10-21 Laser processing apparatus
CN2009102071015A CN101722363B (zh) 2008-10-21 2009-10-21 激光加工装置
KR1020090100176A KR101103926B1 (ko) 2008-10-21 2009-10-21 레이저 가공 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008271364A JP5288987B2 (ja) 2008-10-21 2008-10-21 レーザ加工装置

Publications (2)

Publication Number Publication Date
JP2010099674A JP2010099674A (ja) 2010-05-06
JP5288987B2 true JP5288987B2 (ja) 2013-09-11

Family

ID=42218986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008271364A Active JP5288987B2 (ja) 2008-10-21 2008-10-21 レーザ加工装置

Country Status (4)

Country Link
JP (1) JP5288987B2 (ko)
KR (1) KR101103926B1 (ko)
CN (1) CN101722363B (ko)
TW (1) TW201024012A (ko)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5221734B2 (ja) * 2011-10-21 2013-06-26 株式会社片岡製作所 加工機
JP5385356B2 (ja) * 2011-10-21 2014-01-08 株式会社片岡製作所 レーザ加工機
KR101298706B1 (ko) * 2011-11-04 2013-08-26 주식회사 케이랩 레이저 마킹 시스템의 마킹 보정 방법
KR101501900B1 (ko) * 2013-07-04 2015-03-12 주식회사 케이랩 레이저 마킹 시스템의 마킹 보정 방법 및 장치
WO2015198398A1 (ja) * 2014-06-24 2015-12-30 三菱電機株式会社 レーザ加工装置、加工制御装置およびレーザ加工方法
JP5952875B2 (ja) * 2014-09-30 2016-07-13 株式会社片岡製作所 レーザ加工機、レーザ加工機のワーク歪補正方法
CN104439726B (zh) * 2014-11-19 2017-01-25 苏州德龙激光股份有限公司 激光实时纠偏装置及其纠偏方法
JP2017100168A (ja) * 2015-12-03 2017-06-08 キヤノン株式会社 レーザ加工装置、部品の製造方法、プログラム及び記録媒体
CN106881525B (zh) * 2015-12-15 2019-06-18 新代科技股份有限公司 激光加工控制系统及其控制方法
JP6601285B2 (ja) * 2016-03-15 2019-11-06 オムロン株式会社 レーザ加工システムおよび加工制御方法
CN106181024A (zh) * 2016-08-25 2016-12-07 关键应用科技股份有限公司 镭射校正方法
WO2018096669A1 (ja) * 2016-11-28 2018-05-31 三菱電機株式会社 レーザ加工装置、レーザ加工方法、及びレーザ加工プログラム
JP6559377B2 (ja) * 2017-03-02 2019-08-14 三菱電機株式会社 重畳位置補正装置及び重畳位置補正方法
WO2018216281A1 (ja) * 2017-05-25 2018-11-29 三菱電機株式会社 レーザ加工装置
DE102017213001A1 (de) 2017-07-27 2019-01-31 Bayerische Motoren Werke Aktiengesellschaft Verfahren und Steuereinheit zur Ansteuerung einer Fügestation
JP7066368B2 (ja) * 2017-10-24 2022-05-13 住友重機械工業株式会社 レーザ加工機の制御装置、レーザ加工方法、及びレーザ加工機
CN109967893B (zh) * 2017-12-27 2021-02-19 大族激光科技产业集团股份有限公司 一种激光切割补偿方法及激光切割系统
CN108247200A (zh) * 2018-02-01 2018-07-06 西安中科微精光子制造科技有限公司 用于激光微孔加工的光束扫描系统和光束扫描方法
JP6632781B1 (ja) * 2019-04-01 2020-01-22 三菱電機株式会社 レーザ加工装置、レーザ加工方法、および誤差調整方法
JP7237432B2 (ja) * 2019-07-26 2023-03-13 株式会社ディスコ 比較方法及びレーザー加工装置
KR102324548B1 (ko) * 2019-12-31 2021-11-10 (주)미래컴퍼니 레이저 가공 시스템 및 레이저 가공 방법
CN115087512A (zh) * 2020-02-10 2022-09-20 三菱电机株式会社 激光加工方法及激光加工装置
JP7307024B2 (ja) * 2020-03-31 2023-07-11 東レエンジニアリング株式会社 転写装置および転写装置の位置補正方法
CN117716316A (zh) * 2021-12-01 2024-03-15 株式会社片冈制作所 光学仪器用载物台装置
CN114515795B (zh) * 2022-01-28 2024-01-23 香港生产力促进局 一种基于视觉误差补偿的激光辅助校正方法及装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0158728B1 (ko) * 1993-12-27 1999-01-15 마사카주 카키모토 천공장치
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
EP1852209B1 (en) * 1996-11-20 2013-08-14 Ibiden Co., Ltd. Laser machining apparatus for manufacturing a multilayered printed wiring board
JPH10301052A (ja) * 1997-05-02 1998-11-13 Sumitomo Heavy Ind Ltd レーザ加工装置の加工位置ずれ補正方式
JP3233080B2 (ja) * 1997-10-01 2001-11-26 松下電器産業株式会社 レーザ加工における補正情報の取得方法およびレーザ照射位置の補正方法
JP3614680B2 (ja) 1998-09-01 2005-01-26 松下電器産業株式会社 レーザ加工方法及び装置
JP3420956B2 (ja) * 1998-12-18 2003-06-30 松下電器産業株式会社 光走査装置及びこれを用いた画像読取装置と画像形成装置
JP3855684B2 (ja) * 2001-06-05 2006-12-13 松下電器産業株式会社 レーザ加工装置およびレーザ加工方法
JP3666434B2 (ja) * 2001-09-28 2005-06-29 松下電器産業株式会社 レーザ加工装置とその加工方法
JP2003245785A (ja) * 2002-02-22 2003-09-02 Sumitomo Heavy Ind Ltd ビーム加工方法及び装置
JP2004322149A (ja) * 2003-04-24 2004-11-18 Matsushita Electric Ind Co Ltd レーザ加工装置およびその制御方法と生産設備
JP2004358550A (ja) * 2003-06-09 2004-12-24 Sumitomo Heavy Ind Ltd レーザ加工方法およびレーザ加工装置
JP2008010620A (ja) * 2006-06-29 2008-01-17 Hitachi High-Tech Instruments Co Ltd Ｘｙ方向移動装置及びｘｙ方向移動方法
WO2008038385A1 (fr) * 2006-09-28 2008-04-03 Mitsubishi Electric Corporation Appareil d'usinage laser
KR100846259B1 (ko) * 2007-06-04 2008-07-18 미쓰비시덴키 가부시키가이샤 레이저 가공 장치

Also Published As

Publication number Publication date
CN101722363A (zh) 2010-06-09
TWI367799B (ko) 2012-07-11
KR20100044133A (ko) 2010-04-29
KR101103926B1 (ko) 2012-01-12
CN101722363B (zh) 2013-08-14
TW201024012A (en) 2010-07-01
JP2010099674A (ja) 2010-05-06

Similar Documents

Publication Publication Date Title
JP5288987B2 (ja) レーザ加工装置
JP5089827B1 (ja) レーザ加工方法およびレーザ加工装置
JP6594545B2 (ja) 基板計測装置およびレーザ加工システム
US20180299260A1 (en) Laser processing system having measurement function
TWI667090B (zh) 雷射加工裝置
JP2020131282A (ja) 機械学習装置、レーザ加工装置及びレーザ加工システム
TWI787595B (zh) 雷射加工裝置、雷射加工方法及誤差調整方法
TWI392551B (zh) 雷射加工裝置及雷射加工方法
JP3662542B2 (ja) レーザ加工装置、及びそれにおけるずれ補正方法
JP2004276101A (ja) レーザ加工方法及びレーザ加工装置
JP2010274267A (ja) レーザー加工機
KR101067996B1 (ko) 선폭 측정 장치의 검사 방법
JP2001330430A (ja) 平面度測定方法および平面度測定装置
JP4291313B2 (ja) ヘッド作動制御装置及び制御方法及びステージ装置
US8149383B2 (en) Method for determining the systematic error in the measurement of positions of edges of structures on a substrate resulting from the substrate topology
JP2006263803A (ja) レーザ加工方法及びレーザ加工装置
JP2000326082A (ja) レーザ加工機
JP2003233424A (ja) Ｘｙステージの位置補正方法、装置、及び、これを用いた位置決め方法、装置
JP5440593B2 (ja) レーザ照射位置の補正方法、及び、レーザ加工装置
WO2024190277A1 (ja) 位置計測装置、位置計測方法、及び、位置計測プログラム
JP2018015834A (ja) ロボットアームの移動方法
JP2001159515A (ja) 平面度測定方法および平面度測定装置
JP2024034308A (ja) 位置決め装置、加工装置、形状測定装置、位置決め方法、及び物品の製造方法
JP2008119717A (ja) レーザ加工装置
JPH07105324B2 (ja) レ−ザミラ−の位置変位補正方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110506

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121019

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121030

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121219

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130507

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130604

R150 Certificate of patent or registration of utility model

Ref document number: 5288987

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250