JP5221734B2 - 加工機 - Google Patents
加工機 Download PDFInfo
- Publication number
- JP5221734B2 JP5221734B2 JP2011232181A JP2011232181A JP5221734B2 JP 5221734 B2 JP5221734 B2 JP 5221734B2 JP 2011232181 A JP2011232181 A JP 2011232181A JP 2011232181 A JP2011232181 A JP 2011232181A JP 5221734 B2 JP5221734 B2 JP 5221734B2
- Authority
- JP
- Japan
- Prior art keywords
- processing
- mold
- guide plate
- light guide
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003754 machining Methods 0.000 claims description 19
- 230000003287 optical effect Effects 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 230000006870 function Effects 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/004—Scattering dots or dot-like elements, e.g. microbeads, scattering particles, nanoparticles
- G02B6/0043—Scattering dots or dot-like elements, e.g. microbeads, scattering particles, nanoparticles provided on the surface of the light guide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21K—MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES, RIVETS, BOLTS OR WHEELS
- B21K5/00—Making tools or tool parts, e.g. pliers
- B21K5/20—Making working faces of dies, either recessed or outstanding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00663—Production of light guides
- B29D11/00673—Supports for light guides
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0058—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide
- G02B6/0061—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide to provide homogeneous light output intensity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0065—Manufacturing aspects; Material aspects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Ophthalmology & Optometry (AREA)
- Laser Beam Processing (AREA)
- Planar Illumination Modules (AREA)
Description
1…加工装置(レーザ照射装置)
11、12…ガルバノスキャナ
2…移送装置
3…被加工物(金型)
32…穴
51…加工パターン記憶部
52…制御部
6…導光板
L…レーザビーム
Claims (6)
- 被加工物の加工対象範囲の一部をなす加工領域に対して多数の穴を形成する加工を行うことができる加工装置と、
被加工物の加工対象範囲のある領域に前記加工がなされた後、被加工物を前記加工装置に対して相対的に移動させ、既に加工がなされた領域に隣接する未加工の領域を加工装置による新たな加工領域として位置づける移送装置と、
前記加工装置が被加工物の加工対象範囲に形成する穴の配置位置を規定する情報を記憶する加工パターン記憶部と、
前記加工パターン記憶部に記憶している情報により規定される個々の穴の位置に、各穴毎にランダムな位置補正量を加えて各穴毎の目標加工位置を決定し、その目標加工位置に穴を形成するよう加工装置に指令する制御部と
を具備する加工機。 - 前記加工装置が、前記制御部により指令された位置にレーザ光を照射するレーザ照射装置である請求項1記載の加工機。
- 前記加工装置が、照射するレーザビームの光軸の向きを変化させるガルバノスキャナを備えている請求項2記載の加工機。
- 金型となる被加工物の一面に加工対象範囲を設定し、当該加工対象範囲の全域に多数の穴を形成することで、導光板成形用の金型を作製するためのものである請求項1、2または3記載の加工機。
- 請求項4記載の加工機を使用して作製される導光板成形用の金型。
- 請求項4記載の加工機を使用して作製される導光板成形用の金型を用いて成形される導光板。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011232181A JP5221734B2 (ja) | 2011-10-21 | 2011-10-21 | 加工機 |
US13/816,213 US20140029270A1 (en) | 2011-10-21 | 2012-07-26 | Processing machine |
PCT/JP2012/068936 WO2013057995A1 (ja) | 2011-10-21 | 2012-07-26 | 加工機 |
KR1020137004677A KR101429865B1 (ko) | 2011-10-21 | 2012-07-26 | 가공기 |
EP12820841.0A EP2769801A4 (en) | 2011-10-21 | 2012-07-26 | TREATMENT MACHINE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011232181A JP5221734B2 (ja) | 2011-10-21 | 2011-10-21 | 加工機 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013086174A JP2013086174A (ja) | 2013-05-13 |
JP5221734B2 true JP5221734B2 (ja) | 2013-06-26 |
Family
ID=48140652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011232181A Active JP5221734B2 (ja) | 2011-10-21 | 2011-10-21 | 加工機 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20140029270A1 (ja) |
EP (1) | EP2769801A4 (ja) |
JP (1) | JP5221734B2 (ja) |
KR (1) | KR101429865B1 (ja) |
WO (1) | WO2013057995A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102632484B1 (ko) * | 2016-11-17 | 2024-02-05 | 삼성디스플레이 주식회사 | 백라이트 유닛, 그것의 제조 방법, 및 그것을 포함하는 표시 장치 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08309565A (ja) * | 1995-05-16 | 1996-11-26 | Toppan Printing Co Ltd | レーザ描画装置 |
JP3402138B2 (ja) * | 1996-09-27 | 2003-04-28 | 株式会社日立製作所 | 液晶表示装置 |
JP2001052519A (ja) | 1999-08-06 | 2001-02-23 | Nissha Printing Co Ltd | 面発光装置、導光板成形用金型およびその製造方法 |
JP3785093B2 (ja) * | 2001-12-28 | 2006-06-14 | アルプス電気株式会社 | 導光板、その製造方法、照明装置、及び液晶表示装置 |
JP4268479B2 (ja) * | 2003-08-26 | 2009-05-27 | Towa株式会社 | 導光板成形用金型の加工方法及び加工装置 |
JP4008466B2 (ja) * | 2005-10-05 | 2007-11-14 | ファナック株式会社 | 加工装置 |
TWI320348B (en) * | 2007-05-17 | 2010-02-11 | Hortek Crystal Co Ltd | Combination method for multiple etching areas and article irradiated by processing machine |
GB0802289D0 (en) * | 2008-02-07 | 2008-03-12 | Rumsby Philip T | Method and appartus for making a partially transparent solar panel |
JP5519123B2 (ja) | 2008-06-10 | 2014-06-11 | 株式会社片岡製作所 | レーザ加工機 |
JP5288987B2 (ja) * | 2008-10-21 | 2013-09-11 | 三菱電機株式会社 | レーザ加工装置 |
JP5306374B2 (ja) * | 2008-12-17 | 2013-10-02 | 三菱電機株式会社 | レーザ加工装置、レーザ加工方法、および光起電力装置の製造方法 |
JP4962508B2 (ja) * | 2009-02-24 | 2012-06-27 | パルステック工業株式会社 | レーザ加工装置およびレーザ加工装置におけるレーザ駆動用パルス信号出力方法 |
JP2010201501A (ja) * | 2009-03-06 | 2010-09-16 | Sony Corp | 光加工方法およびマスク |
MX2011011369A (es) * | 2009-04-27 | 2012-01-20 | Echelon Laser Systems Lp | Sistema grafico de linea grabada con laser escalonada, metodo y articulos de fabricacion. |
-
2011
- 2011-10-21 JP JP2011232181A patent/JP5221734B2/ja active Active
-
2012
- 2012-07-26 KR KR1020137004677A patent/KR101429865B1/ko active IP Right Grant
- 2012-07-26 EP EP12820841.0A patent/EP2769801A4/en not_active Withdrawn
- 2012-07-26 WO PCT/JP2012/068936 patent/WO2013057995A1/ja active Application Filing
- 2012-07-26 US US13/816,213 patent/US20140029270A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20140029270A1 (en) | 2014-01-30 |
WO2013057995A1 (ja) | 2013-04-25 |
EP2769801A1 (en) | 2014-08-27 |
JP2013086174A (ja) | 2013-05-13 |
KR20130071465A (ko) | 2013-06-28 |
EP2769801A4 (en) | 2015-08-12 |
KR101429865B1 (ko) | 2014-08-13 |
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