JP5235214B2 - プラズマディスプレイパネルの製造方法、成膜装置 - Google Patents
プラズマディスプレイパネルの製造方法、成膜装置 Download PDFInfo
- Publication number
- JP5235214B2 JP5235214B2 JP2010517878A JP2010517878A JP5235214B2 JP 5235214 B2 JP5235214 B2 JP 5235214B2 JP 2010517878 A JP2010517878 A JP 2010517878A JP 2010517878 A JP2010517878 A JP 2010517878A JP 5235214 B2 JP5235214 B2 JP 5235214B2
- Authority
- JP
- Japan
- Prior art keywords
- metal oxide
- film
- vacuum chamber
- panel
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000010408 film Substances 0.000 claims description 256
- 230000001681 protective effect Effects 0.000 claims description 85
- 229910044991 metal oxide Inorganic materials 0.000 claims description 82
- 150000004706 metal oxides Chemical class 0.000 claims description 82
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 74
- 230000015572 biosynthetic process Effects 0.000 claims description 63
- 238000001704 evaporation Methods 0.000 claims description 59
- 230000008020 evaporation Effects 0.000 claims description 47
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 43
- 239000001301 oxygen Substances 0.000 claims description 43
- 229910052760 oxygen Inorganic materials 0.000 claims description 43
- 238000010894 electron beam technology Methods 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 23
- 238000000151 deposition Methods 0.000 claims description 18
- 230000008021 deposition Effects 0.000 claims description 18
- 230000032258 transport Effects 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 14
- 230000008859 change Effects 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 30
- 239000000395 magnesium oxide Substances 0.000 description 30
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 30
- 239000000463 material Substances 0.000 description 24
- 239000013078 crystal Substances 0.000 description 18
- 239000007789 gas Substances 0.000 description 18
- 230000003068 static effect Effects 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 239000011777 magnesium Substances 0.000 description 7
- 230000002829 reductive effect Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000036961 partial effect Effects 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 238000000635 electron micrograph Methods 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 102100033668 Cartilage matrix protein Human genes 0.000 description 1
- 101001018382 Homo sapiens Cartilage matrix protein Proteins 0.000 description 1
- -1 MgO or SrO Chemical class 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/081—Oxides of aluminium, magnesium or beryllium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010517878A JP5235214B2 (ja) | 2008-06-16 | 2009-06-11 | プラズマディスプレイパネルの製造方法、成膜装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008157119 | 2008-06-16 | ||
JP2008157119 | 2008-06-16 | ||
PCT/JP2009/060680 WO2009154130A1 (ja) | 2008-06-16 | 2009-06-11 | プラズマディスプレイパネルの製造方法、成膜装置 |
JP2010517878A JP5235214B2 (ja) | 2008-06-16 | 2009-06-11 | プラズマディスプレイパネルの製造方法、成膜装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2009154130A1 JPWO2009154130A1 (ja) | 2011-12-01 |
JP5235214B2 true JP5235214B2 (ja) | 2013-07-10 |
Family
ID=41434045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010517878A Active JP5235214B2 (ja) | 2008-06-16 | 2009-06-11 | プラズマディスプレイパネルの製造方法、成膜装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5235214B2 (ko) |
KR (1) | KR101128744B1 (ko) |
CN (1) | CN102067266B (ko) |
WO (1) | WO2009154130A1 (ko) |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62107060A (ja) * | 1985-10-31 | 1987-05-18 | Shimadzu Corp | 電子ビ−ム蒸着装置 |
JP2000260750A (ja) * | 1999-03-08 | 2000-09-22 | Denshi Kagaku Kk | 昇温脱離ガス分析装置 |
JP2000290062A (ja) * | 1999-04-05 | 2000-10-17 | Mitsubishi Materials Corp | MgO蒸着材及びその製造方法 |
JP2000297367A (ja) * | 1999-04-12 | 2000-10-24 | Canon Inc | 金属酸化物薄膜の成膜方法 |
JP2001026867A (ja) * | 1999-07-16 | 2001-01-30 | Teijin Ltd | 透明導電積層体の製造方法 |
JP2002194539A (ja) * | 2000-12-26 | 2002-07-10 | Matsushita Electric Ind Co Ltd | 薄膜形成方法及び装置 |
JP2006172859A (ja) * | 2004-12-15 | 2006-06-29 | Matsushita Electric Ind Co Ltd | プラズマディスプレイパネルおよびその製造方法 |
JP2007051326A (ja) * | 2005-08-17 | 2007-03-01 | Ulvac Japan Ltd | 電子ビーム蒸着装置、当該装置を用いて行う基板の表面への蒸着被膜の形成方法、ピアス式電子銃、および、ピアス式電子銃のビーム状態のモニタ方法 |
JP2007107092A (ja) * | 2005-09-13 | 2007-04-26 | Matsushita Electric Ind Co Ltd | 保護膜形成方法および保護膜形成装置 |
JP2007119831A (ja) * | 2005-10-27 | 2007-05-17 | Ulvac Japan Ltd | 成膜装置、パネルの製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2663909B2 (ja) * | 1995-04-11 | 1997-10-15 | 日本電気株式会社 | プラズマディスプレイパネルの製造方法 |
JP3836184B2 (ja) * | 1996-05-01 | 2006-10-18 | 中外炉工業株式会社 | 酸化マグネシウム膜の製造方法 |
JPH10106441A (ja) * | 1996-10-02 | 1998-04-24 | Fujitsu Ltd | プラズマディスプレイパネル |
-
2009
- 2009-06-11 KR KR1020107028164A patent/KR101128744B1/ko active IP Right Grant
- 2009-06-11 JP JP2010517878A patent/JP5235214B2/ja active Active
- 2009-06-11 CN CN200980122380.3A patent/CN102067266B/zh not_active Expired - Fee Related
- 2009-06-11 WO PCT/JP2009/060680 patent/WO2009154130A1/ja active Application Filing
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62107060A (ja) * | 1985-10-31 | 1987-05-18 | Shimadzu Corp | 電子ビ−ム蒸着装置 |
JP2000260750A (ja) * | 1999-03-08 | 2000-09-22 | Denshi Kagaku Kk | 昇温脱離ガス分析装置 |
JP2000290062A (ja) * | 1999-04-05 | 2000-10-17 | Mitsubishi Materials Corp | MgO蒸着材及びその製造方法 |
JP2000297367A (ja) * | 1999-04-12 | 2000-10-24 | Canon Inc | 金属酸化物薄膜の成膜方法 |
JP2001026867A (ja) * | 1999-07-16 | 2001-01-30 | Teijin Ltd | 透明導電積層体の製造方法 |
JP2002194539A (ja) * | 2000-12-26 | 2002-07-10 | Matsushita Electric Ind Co Ltd | 薄膜形成方法及び装置 |
JP2006172859A (ja) * | 2004-12-15 | 2006-06-29 | Matsushita Electric Ind Co Ltd | プラズマディスプレイパネルおよびその製造方法 |
JP2007051326A (ja) * | 2005-08-17 | 2007-03-01 | Ulvac Japan Ltd | 電子ビーム蒸着装置、当該装置を用いて行う基板の表面への蒸着被膜の形成方法、ピアス式電子銃、および、ピアス式電子銃のビーム状態のモニタ方法 |
JP2007107092A (ja) * | 2005-09-13 | 2007-04-26 | Matsushita Electric Ind Co Ltd | 保護膜形成方法および保護膜形成装置 |
JP2007119831A (ja) * | 2005-10-27 | 2007-05-17 | Ulvac Japan Ltd | 成膜装置、パネルの製造方法 |
Non-Patent Citations (1)
Title |
---|
JPN7009003198; Sung Hee Hong, et al.: 'Characteristics of MgO Protective Layer with Deposition Rate in AC-PDPs' Proceedings of The 14th International Display Workshops Volume 1, 20071205, Page 195-198, Society for Information Display * |
Also Published As
Publication number | Publication date |
---|---|
CN102067266B (zh) | 2013-02-06 |
JPWO2009154130A1 (ja) | 2011-12-01 |
KR101128744B1 (ko) | 2012-03-27 |
WO2009154130A1 (ja) | 2009-12-23 |
CN102067266A (zh) | 2011-05-18 |
KR20110009240A (ko) | 2011-01-27 |
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