JP5216807B2 - 半導体レーザ装置 - Google Patents

半導体レーザ装置 Download PDF

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Publication number
JP5216807B2
JP5216807B2 JP2010111768A JP2010111768A JP5216807B2 JP 5216807 B2 JP5216807 B2 JP 5216807B2 JP 2010111768 A JP2010111768 A JP 2010111768A JP 2010111768 A JP2010111768 A JP 2010111768A JP 5216807 B2 JP5216807 B2 JP 5216807B2
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JP
Japan
Prior art keywords
semiconductor laser
electrode
laser element
terminal
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010111768A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010183111A5 (zh
JP2010183111A (ja
Inventor
靖之 別所
雅幸 畑
大二朗 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2010111768A priority Critical patent/JP5216807B2/ja
Publication of JP2010183111A publication Critical patent/JP2010183111A/ja
Publication of JP2010183111A5 publication Critical patent/JP2010183111A5/ja
Application granted granted Critical
Publication of JP5216807B2 publication Critical patent/JP5216807B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Semiconductor Lasers (AREA)
JP2010111768A 2004-03-30 2010-05-14 半導体レーザ装置 Expired - Fee Related JP5216807B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010111768A JP5216807B2 (ja) 2004-03-30 2010-05-14 半導体レーザ装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004101490 2004-03-30
JP2004101490 2004-03-30
JP2010111768A JP5216807B2 (ja) 2004-03-30 2010-05-14 半導体レーザ装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004288973A Division JP4583128B2 (ja) 2004-03-30 2004-09-30 半導体レーザ装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010253606A Division JP2011029677A (ja) 2004-03-30 2010-11-12 半導体レーザ装置

Publications (3)

Publication Number Publication Date
JP2010183111A JP2010183111A (ja) 2010-08-19
JP2010183111A5 JP2010183111A5 (zh) 2011-01-06
JP5216807B2 true JP5216807B2 (ja) 2013-06-19

Family

ID=40838764

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010111768A Expired - Fee Related JP5216807B2 (ja) 2004-03-30 2010-05-14 半導体レーザ装置
JP2010253606A Pending JP2011029677A (ja) 2004-03-30 2010-11-12 半導体レーザ装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010253606A Pending JP2011029677A (ja) 2004-03-30 2010-11-12 半導体レーザ装置

Country Status (2)

Country Link
JP (2) JP5216807B2 (zh)
CN (1) CN101478116B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112582874B (zh) * 2019-09-29 2021-10-01 山东华光光电子股份有限公司 一种激光光灸用复合激光器及封装方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63287085A (ja) * 1987-05-19 1988-11-24 Omron Tateisi Electronics Co マルチビ−ム光源
JP3419930B2 (ja) * 1994-12-21 2003-06-23 三菱電機株式会社 半導体レーザ装置とこの半導体レーザ装置を備えた光ディスク装置
JPH11112091A (ja) * 1997-09-30 1999-04-23 Victor Co Of Japan Ltd 半導体レーザ装置
JP3486900B2 (ja) * 2000-02-15 2004-01-13 ソニー株式会社 発光装置およびそれを用いた光装置
JP2002109774A (ja) * 2000-10-02 2002-04-12 Ricoh Co Ltd 光ピックアップ
JP2002232061A (ja) * 2001-02-01 2002-08-16 Mitsubishi Electric Corp 半導体レーザ装置の製造方法および半導体レーザ装置
JP2004022717A (ja) * 2002-06-14 2004-01-22 Sharp Corp 多波長レーザ装置
JP2004111446A (ja) * 2002-09-13 2004-04-08 Fuji Xerox Co Ltd 半導体レーザ素子の実装方法及びその実装方法を用いた半導体レーザ装置並びに光学モジュール
JP3928583B2 (ja) * 2003-05-06 2007-06-13 ソニー株式会社 発光装置の製造方法

Also Published As

Publication number Publication date
JP2011029677A (ja) 2011-02-10
CN101478116A (zh) 2009-07-08
CN101478116B (zh) 2012-01-25
JP2010183111A (ja) 2010-08-19

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