JP5216446B2 - プラズマcvd装置及び表示装置の作製方法 - Google Patents
プラズマcvd装置及び表示装置の作製方法 Download PDFInfo
- Publication number
- JP5216446B2 JP5216446B2 JP2008172141A JP2008172141A JP5216446B2 JP 5216446 B2 JP5216446 B2 JP 5216446B2 JP 2008172141 A JP2008172141 A JP 2008172141A JP 2008172141 A JP2008172141 A JP 2008172141A JP 5216446 B2 JP5216446 B2 JP 5216446B2
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- layer
- semiconductor layer
- gas
- processing chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
- H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Nonlinear Science (AREA)
- Analytical Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Plasma Technology (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008172141A JP5216446B2 (ja) | 2007-07-27 | 2008-07-01 | プラズマcvd装置及び表示装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007196189 | 2007-07-27 | ||
| JP2007196189 | 2007-07-27 | ||
| JP2008172141A JP5216446B2 (ja) | 2007-07-27 | 2008-07-01 | プラズマcvd装置及び表示装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009054996A JP2009054996A (ja) | 2009-03-12 |
| JP2009054996A5 JP2009054996A5 (https=) | 2011-08-04 |
| JP5216446B2 true JP5216446B2 (ja) | 2013-06-19 |
Family
ID=40295760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008172141A Expired - Fee Related JP5216446B2 (ja) | 2007-07-27 | 2008-07-01 | プラズマcvd装置及び表示装置の作製方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8178398B2 (https=) |
| JP (1) | JP5216446B2 (https=) |
| KR (1) | KR101512758B1 (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4719184B2 (ja) * | 2007-06-01 | 2011-07-06 | 株式会社サイアン | 大気圧プラズマ発生装置およびそれを用いるワーク処理装置 |
| JP5058084B2 (ja) * | 2007-07-27 | 2012-10-24 | 株式会社半導体エネルギー研究所 | 光電変換装置の作製方法及びマイクロ波プラズマcvd装置 |
| JP5572307B2 (ja) | 2007-12-28 | 2014-08-13 | 株式会社半導体エネルギー研究所 | 光電変換装置の製造方法 |
| US8803245B2 (en) * | 2008-06-30 | 2014-08-12 | Mcafee, Inc. | Method of forming stacked trench contacts and structures formed thereby |
| JP5632654B2 (ja) * | 2009-05-29 | 2014-11-26 | 株式会社半導体エネルギー研究所 | 表示装置 |
| JP5752447B2 (ja) * | 2010-03-15 | 2015-07-22 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US8440548B2 (en) | 2010-08-06 | 2013-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of microcrystalline silicon film and manufacturing method of thin film transistor |
| US9553195B2 (en) * | 2011-06-30 | 2017-01-24 | Applied Materials, Inc. | Method of IGZO and ZNO TFT fabrication with PECVD SiO2 passivation |
| US20120175667A1 (en) * | 2011-10-03 | 2012-07-12 | Golle Aaron J | Led light disposed on a flexible substrate and connected with a printed 3d conductor |
| KR102377794B1 (ko) * | 2015-07-06 | 2022-03-23 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| JP6899693B2 (ja) * | 2017-04-14 | 2021-07-07 | 東京エレクトロン株式会社 | プラズマ処理装置及び制御方法 |
| JP7724661B2 (ja) * | 2021-08-30 | 2025-08-18 | 東京エレクトロン株式会社 | 成膜方法および成膜装置 |
Family Cites Families (52)
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| JPS6029295B2 (ja) * | 1979-08-16 | 1985-07-10 | 舜平 山崎 | 非単結晶被膜形成法 |
| US5091334A (en) * | 1980-03-03 | 1992-02-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JPS56122123A (en) * | 1980-03-03 | 1981-09-25 | Shunpei Yamazaki | Semiamorphous semiconductor |
| JPS5771126A (en) | 1980-10-21 | 1982-05-01 | Semiconductor Energy Lab Co Ltd | Semiamorhous semiconductor |
| JPS5972781A (ja) | 1982-10-20 | 1984-04-24 | Semiconductor Energy Lab Co Ltd | 光電変換半導体装置 |
| JPS61241921A (ja) * | 1985-04-19 | 1986-10-28 | Hitachi Ltd | プラズマ処理装置 |
| JPS6262073A (ja) | 1985-09-11 | 1987-03-18 | Ishikawajima Harima Heavy Ind Co Ltd | ポペツト弁の温度制御装置 |
| US4760008A (en) * | 1986-01-24 | 1988-07-26 | Semiconductor Energy Laboratory Co., Ltd. | Electrophotographic photosensitive members and methods for manufacturing the same using microwave radiation in magnetic field |
| US4988642A (en) * | 1988-05-25 | 1991-01-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method, and system |
| JPH0253941A (ja) | 1988-08-17 | 1990-02-22 | Tsudakoma Corp | 織機の運転装置 |
| JP2876318B2 (ja) * | 1989-01-20 | 1999-03-31 | 三洋電機株式会社 | 薄膜形成方法 |
| US7115902B1 (en) * | 1990-11-20 | 2006-10-03 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
| US5514879A (en) * | 1990-11-20 | 1996-05-07 | Semiconductor Energy Laboratory Co., Ltd. | Gate insulated field effect transistors and method of manufacturing the same |
| KR950013784B1 (ko) * | 1990-11-20 | 1995-11-16 | 가부시키가이샤 한도오따이 에네루기 겐큐쇼 | 반도체 전계효과 트랜지스터 및 그 제조방법과 박막트랜지스터 |
| US5849601A (en) * | 1990-12-25 | 1998-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
| US7098479B1 (en) * | 1990-12-25 | 2006-08-29 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
| US7576360B2 (en) * | 1990-12-25 | 2009-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device which comprises thin film transistors and method for manufacturing the same |
| JPH0613329A (ja) * | 1992-06-25 | 1994-01-21 | Canon Inc | 半導体装置及び半導体製造装置及び製造方法 |
| US5946587A (en) * | 1992-08-06 | 1999-08-31 | Canon Kabushiki Kaisha | Continuous forming method for functional deposited films |
| US6835523B1 (en) * | 1993-05-09 | 2004-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus for fabricating coating and method of fabricating the coating |
| US5932302A (en) * | 1993-07-20 | 1999-08-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for fabricating with ultrasonic vibration a carbon coating |
| JPH11103082A (ja) | 1997-09-26 | 1999-04-13 | Canon Inc | 光起電力素子及びその作製方法 |
| JP2000277439A (ja) | 1999-03-25 | 2000-10-06 | Kanegafuchi Chem Ind Co Ltd | 結晶質シリコン系薄膜のプラズマcvd方法およびシリコン系薄膜光電変換装置の製造方法 |
| EP1115147A4 (en) * | 1999-05-26 | 2007-05-02 | Tadahiro Ohmi | DEVICE FOR PLASMA TREATMENT |
| JP2000353666A (ja) | 1999-06-11 | 2000-12-19 | Matsushita Electric Ind Co Ltd | 半導体薄膜およびその製造方法 |
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| TW521540B (en) * | 2001-10-03 | 2003-02-21 | Hau-Ran Ni | An ECR plasma reactor system with multiple exciters |
| JP4173679B2 (ja) * | 2002-04-09 | 2008-10-29 | エム・イー・エス・アフティ株式会社 | Ecrプラズマ源およびecrプラズマ装置 |
| JP2004014958A (ja) | 2002-06-11 | 2004-01-15 | Fuji Electric Holdings Co Ltd | 薄膜多結晶太陽電池とその製造方法 |
| JP2004336019A (ja) * | 2003-04-18 | 2004-11-25 | Advanced Lcd Technologies Development Center Co Ltd | 成膜方法、半導体素子の形成方法、半導体素子、表示装置の形成方法及び表示装置 |
| JP4748954B2 (ja) | 2003-07-14 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
| JP4480968B2 (ja) * | 2003-07-18 | 2010-06-16 | 株式会社半導体エネルギー研究所 | 表示装置 |
| TWI336921B (en) * | 2003-07-18 | 2011-02-01 | Semiconductor Energy Lab | Method for manufacturing semiconductor device |
| US7211454B2 (en) * | 2003-07-25 | 2007-05-01 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of a light emitting device including moving the source of the vapor deposition parallel to the substrate |
| JP2005050905A (ja) * | 2003-07-30 | 2005-02-24 | Sharp Corp | シリコン薄膜太陽電池の製造方法 |
| US7601994B2 (en) * | 2003-11-14 | 2009-10-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
| JP4393844B2 (ja) * | 2003-11-19 | 2010-01-06 | 東京エレクトロン株式会社 | プラズマ成膜装置及びプラズマ成膜方法 |
| JP4659377B2 (ja) | 2004-03-19 | 2011-03-30 | 株式会社 液晶先端技術開発センター | 絶縁膜の形成方法 |
| JP5013393B2 (ja) * | 2005-03-30 | 2012-08-29 | 東京エレクトロン株式会社 | プラズマ処理装置と方法 |
| JP2006294422A (ja) * | 2005-04-11 | 2006-10-26 | Tokyo Electron Ltd | プラズマ処理装置およびスロットアンテナおよびプラズマ処理方法 |
| TWI408734B (zh) * | 2005-04-28 | 2013-09-11 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| US7608490B2 (en) * | 2005-06-02 | 2009-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP4597792B2 (ja) | 2005-06-27 | 2010-12-15 | 東京エレクトロン株式会社 | 処理ガス供給構造およびプラズマ処理装置 |
| JP4777717B2 (ja) | 2005-08-10 | 2011-09-21 | 東京エレクトロン株式会社 | 成膜方法、プラズマ処理装置および記録媒体 |
| US7301215B2 (en) * | 2005-08-22 | 2007-11-27 | Canon Kabushiki Kaisha | Photovoltaic device |
| US7692610B2 (en) * | 2005-11-30 | 2010-04-06 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP5068458B2 (ja) * | 2006-01-18 | 2012-11-07 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理方法 |
| JP4978985B2 (ja) * | 2006-03-30 | 2012-07-18 | 東京エレクトロン株式会社 | プラズマ処理方法 |
| JP5364293B2 (ja) * | 2007-06-01 | 2013-12-11 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法およびプラズマcvd装置 |
| US8207010B2 (en) * | 2007-06-05 | 2012-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing photoelectric conversion device |
-
2008
- 2008-07-01 JP JP2008172141A patent/JP5216446B2/ja not_active Expired - Fee Related
- 2008-07-18 US US12/219,244 patent/US8178398B2/en not_active Expired - Fee Related
- 2008-07-21 KR KR1020080070707A patent/KR101512758B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090012094A (ko) | 2009-02-02 |
| KR101512758B1 (ko) | 2015-04-16 |
| US20090029498A1 (en) | 2009-01-29 |
| US8178398B2 (en) | 2012-05-15 |
| JP2009054996A (ja) | 2009-03-12 |
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