JP5214288B2 - 高電圧垂直トランジスタで集積された検知トランジスタ - Google Patents
高電圧垂直トランジスタで集積された検知トランジスタ Download PDFInfo
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- JP5214288B2 JP5214288B2 JP2008064892A JP2008064892A JP5214288B2 JP 5214288 B2 JP5214288 B2 JP 5214288B2 JP 2008064892 A JP2008064892 A JP 2008064892A JP 2008064892 A JP2008064892 A JP 2008064892A JP 5214288 B2 JP5214288 B2 JP 5214288B2
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- 239000004065 semiconductor Substances 0.000 claims description 33
- 210000000746 body region Anatomy 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 9
- 230000005669 field effect Effects 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 24
- 229910052710 silicon Inorganic materials 0.000 description 24
- 239000010703 silicon Substances 0.000 description 24
- 235000012431 wafers Nutrition 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000000638 solvent extraction Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7815—Vertical DMOS transistors, i.e. VDMOS transistors with voltage or current sensing structure, e.g. emulator section, overcurrent sensing cell
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
- H01L29/407—Recessed field plates, e.g. trench field plates, buried field plates
Description
14a、14b N+ソース領域
15a、15b 誘電(酸化物)領域
16a、16b P+領域
17 シリコンピラー
18a、18b ゲート部材
19a、19b フィールドプレート
20a、20b ゲート酸化物層
24 N+領域
Claims (12)
- メイン垂直トランジスタ及び検知トランジスタを備える半導体デバイスであって、
a)前記メイン垂直トランジスタが、
第1の導電型の基板と、
前記基板上に配置され、幅及び第1の横方向に延びる長さを有する半導体ピラーであって、
該ピラーの上面又はその近傍に配置された前記第1の導電型の1つ又はそれ以上の領域と前記ピラーの上面又はその近傍に配置された第2の導電型の1つ又はそれ以上の領域とを含み、前記第1の導電型の前記1つ又はそれ以上の領域の各々が、前記第2の導電型の前記1つ又はそれ以上の領域の一つに隣接するように、前記第1及び第2の導電型の前記1つ又はそれ以上の領域が前記第1の横方向で配列されたN+領域とP+領域の交互パターンを形成している前記第1及び第2の導電型の第1のソース領域と、
前記第1のソース領域の真下の内部に配置された第2の導電型のボディ領域と、
前記ボディ領域の真下の内部に配置された前記第1の導電型の拡張ドレイン領域と、を有する前記半導体のピラーと、
前記ピラーの両側にそれぞれ配置された、前記ピラーによって横方向に囲まれた第1の誘電領域及び前記ピラーを横方向に囲む第2の誘電領域と、
前記第1及び第2の誘電領域内にそれぞれ配置された第1及び第2のフィールドプレートと、
前記ボディ領域に隣接する前記ピラーの上面又はその近傍で前記第1及び第2の誘電領域内にそれぞれ配置され、第1の厚みを有するゲート酸化物によって前記ボディ領域から分離された第1及び第2のゲート部材と、
を含み、
b)前記検知トランジスタが更に、
前記ピラーの前記上面又はその近傍で配置された前記第1の導電型の第2のソース領域を備え、
前記第2のソース領域が、前記ピラーの上面に延びる前記ボディ領域の区域によって前記第1のソース領域を構成する前記N+領域とP+領域の交互パターンから前記第1の横方向で分離され、
検知トランジスタが、前記メイン垂直トランジスタ内に流れる電流の小部分をサンプリングするように動作可能である、
ことを特徴とする半導体デバイス。 - 前記ピラーがレーストラックレイアウトで配列されている、
ことを特徴とする請求項1に記載の半導体デバイス。 - 前記1つ又はそれ以上の第1のソース領域に電気的に接触するソース電極と、
前記第2のソース領域に電気的に接触する検知ソース電極と、
前記基板の下面に電気的に接触するドレイン電極と、
を更に備える、
ことを特徴とする請求項1に記載の半導体デバイス。 - 前記ボディ領域の真下の前記ピラー内に配置された拡張ドレイン領域を更に備える、
ことを特徴とする請求項1に記載の半導体デバイス。 - 前記第1の横方向の前記長さが前記幅よりも少なくとも30倍大きい、
ことを特徴とする請求項1に記載の半導体デバイス。 - 前記第1及び第2のゲート部材が、前記第1及び第2のフィールドプレートから絶縁されている、
ことを特徴とする請求項1に記載の半導体デバイス。 - メイン垂直電界効果トランジスタ(FET)と、
検知FETと、
を備える半導体デバイスであって、
前記メイン垂直FET及び前記検知FETが共に、第1の導電型の基板上に形成された半導体材料のピラー上に形成されて、前記ピラーが、幅及び第1の横方向に延びる長さと、前記ピラーの両側に配置された第1及び第2の誘電領域と、前記ピラーボディ領域の上面又はその近傍で前記第1及び第2の誘電領域内の前記ピラーに隣接してそれぞれ配置された第1及び第2のゲート部材とを有し、前記メイン垂直FET及び前記検知FET両方が、前記基板上で前記ピラー内に形成された前記第1の導電型の拡張ドレイン領域を共用しており、
前記第1及び第2のゲート部材がまた、前記メイン垂直FET及び前記検知FETにより共通して共有されており、
前記メイン垂直FETが更に、
前記拡張ドレイン領域の上で前記ピラー内に配置された第2の導電型の第1のボディ領域と、
前記ピラーの上面又はその近傍に配置された第1のソース領域と、
を含み、
前記ソース領域が前記第1のボディ領域によって前記拡張ドレイン領域から垂直方向に分離されており、
前記検知FETが更に、
前記拡張ドレイン領域の上で前記ピラー内に配置された第2の導電型の第2のボディ領域と、
前記ピラーの上面又はその近傍に配置された第2のソース領域と、
を含み、
前記第2のソース領域が、前記第2のボディ領域によって前記拡張ドレイン領域から垂直方向に分離され、前記第2のソース領域が、前記第1のソース領域から前記第1の横方向で分離され且つ電気的に絶縁されており、
前記検知FETが、前記メイン垂直FET内に流れる電流の小部分をサンプリングするように動作可能であり、前記拡張ドレイン領域の区域が、前記第1及び第2のボディ領域の間で前記ピラーの上面に延びる、
ことを特徴とする半導体デバイス。 - 前記第1及び第2の誘電領域内にそれぞれ配置された第1及び第2のフィールドプレートを更に備える、
ことを特徴とする請求項7に記載の半導体デバイス。 - 前記第1のソース領域に電気的に接触するソース電極と、
前記第2のソース領域に電気的に接触する検知ソース電極と、
前記基板の下面に電気的に接触するドレイン電極と、
を更に備える、
ことを特徴とする請求項8に記載の半導体デバイス。 - 前記ソース電極がまた、前記第1及び第2のフィールドプレートに電気的に接触する、
ことを特徴とする請求項9に記載の半導体デバイス。 - 前記第1のボディ領域が、前記第1の横方向において前記第1のソース領域の両側で前記ピラーの上面に延びており、前記第2のボディ領域が、前記第1の横方向において前記第2のソース領域の両側で前記ピラーの上面に延びている、
ことを特徴とする請求項7に記載の半導体デバイス。 - 前記ピラーがレーストラック形レイアウトで配列され、前記ピラーの長さが前記幅よりも少なくとも30倍大きい、
ことを特徴とする請求項7に記載の半導体デバイス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/707,586 US8653583B2 (en) | 2007-02-16 | 2007-02-16 | Sensing FET integrated with a high-voltage transistor |
US11/707,586 | 2007-02-16 |
Related Child Applications (1)
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JP2013036854A Division JP5638645B2 (ja) | 2007-02-16 | 2013-02-27 | 高電圧垂直トランジスタで集積された検知トランジスタ |
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JP2008205482A JP2008205482A (ja) | 2008-09-04 |
JP2008205482A5 JP2008205482A5 (ja) | 2012-05-17 |
JP5214288B2 true JP5214288B2 (ja) | 2013-06-19 |
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JP2013036854A Expired - Fee Related JP5638645B2 (ja) | 2007-02-16 | 2013-02-27 | 高電圧垂直トランジスタで集積された検知トランジスタ |
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Country Status (4)
Country | Link |
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US (1) | US8653583B2 (ja) |
EP (1) | EP1959499A3 (ja) |
JP (2) | JP5214288B2 (ja) |
CN (2) | CN102376768B (ja) |
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- 2008-02-18 CN CN201110349590.5A patent/CN102376768B/zh active Active
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US11276775B2 (en) | 2019-03-15 | 2022-03-15 | Kabushiki Kaisha Toshiba | Semiconductor device |
US11810975B2 (en) | 2019-03-15 | 2023-11-07 | Kabushiki Kaisha Toshiba | Semiconductor device |
US11322612B2 (en) | 2019-09-17 | 2022-05-03 | Kabushiki Kaisha Toshiba | Semiconductor device with region of varying thickness |
US11830945B2 (en) | 2019-09-17 | 2023-11-28 | Kabushiki Kaisha Toshiba | Semiconductor device |
Also Published As
Publication number | Publication date |
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CN101246887B (zh) | 2011-12-21 |
EP1959499A3 (en) | 2010-07-14 |
US8653583B2 (en) | 2014-02-18 |
US20080197406A1 (en) | 2008-08-21 |
JP5638645B2 (ja) | 2014-12-10 |
JP2008205482A (ja) | 2008-09-04 |
CN101246887A (zh) | 2008-08-20 |
CN102376768A (zh) | 2012-03-14 |
CN102376768B (zh) | 2015-08-19 |
JP2013141005A (ja) | 2013-07-18 |
EP1959499A2 (en) | 2008-08-20 |
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