JP5207591B2 - 半導体装置の製造方法および半導体装置 - Google Patents

半導体装置の製造方法および半導体装置 Download PDF

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Publication number
JP5207591B2
JP5207591B2 JP2006046872A JP2006046872A JP5207591B2 JP 5207591 B2 JP5207591 B2 JP 5207591B2 JP 2006046872 A JP2006046872 A JP 2006046872A JP 2006046872 A JP2006046872 A JP 2006046872A JP 5207591 B2 JP5207591 B2 JP 5207591B2
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Japan
Prior art keywords
group
component
mass
semiconductor device
parts
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2006046872A
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English (en)
Japanese (ja)
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JP2007224146A5 (https=
JP2007224146A (ja
Inventor
好次 森田
実 一色
浩 植木
智子 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to JP2006046872A priority Critical patent/JP5207591B2/ja
Priority to TW096105062A priority patent/TW200741906A/zh
Priority to US12/280,248 priority patent/US8802506B2/en
Priority to CN2007800063653A priority patent/CN101389461B/zh
Priority to MYPI20083212A priority patent/MY149696A/en
Priority to AT07714631T priority patent/ATE462545T1/de
Priority to EP07714631A priority patent/EP1986832B1/en
Priority to DE602007005610T priority patent/DE602007005610D1/de
Priority to PCT/JP2007/053131 priority patent/WO2007099823A1/en
Priority to KR1020087020670A priority patent/KR101349619B1/ko
Publication of JP2007224146A publication Critical patent/JP2007224146A/ja
Publication of JP2007224146A5 publication Critical patent/JP2007224146A5/ja
Application granted granted Critical
Publication of JP5207591B2 publication Critical patent/JP5207591B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2006046872A 2006-02-23 2006-02-23 半導体装置の製造方法および半導体装置 Expired - Fee Related JP5207591B2 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2006046872A JP5207591B2 (ja) 2006-02-23 2006-02-23 半導体装置の製造方法および半導体装置
TW096105062A TW200741906A (en) 2006-02-23 2007-02-12 Method of manufacturing a semiconductor device and a semiconductor device produced thereby
KR1020087020670A KR101349619B1 (ko) 2006-02-23 2007-02-14 반도체 장치의 제조방법 및 이로부터 제조한 반도체 장치
MYPI20083212A MY149696A (en) 2006-02-23 2007-02-14 Method of manufacturing a semiconductor device and semiconductor device produced thereby
AT07714631T ATE462545T1 (de) 2006-02-23 2007-02-14 Verfahren zur herstellung einer halbleitervorrichtung und dadurch hergestellte halbleitervorrichtung
EP07714631A EP1986832B1 (en) 2006-02-23 2007-02-14 Method of manufacturing a semiconductor device and a semiconductor device produced thereby
US12/280,248 US8802506B2 (en) 2006-02-23 2007-02-14 Method of manufacturing a semiconductor device and a semiconductor device produced thereby
PCT/JP2007/053131 WO2007099823A1 (en) 2006-02-23 2007-02-14 Method of manufacturing a semiconductor device and a semiconductor device produced thereby
CN2007800063653A CN101389461B (zh) 2006-02-23 2007-02-14 制备半导体器件的方法和由其生产的半导体器件
DE602007005610T DE602007005610D1 (de) 2006-02-23 2007-02-14 Verfahren zur herstellung einer halbleitervorrichtung und dadurch hergestellte halbleitervorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006046872A JP5207591B2 (ja) 2006-02-23 2006-02-23 半導体装置の製造方法および半導体装置

Publications (3)

Publication Number Publication Date
JP2007224146A JP2007224146A (ja) 2007-09-06
JP2007224146A5 JP2007224146A5 (https=) 2009-03-26
JP5207591B2 true JP5207591B2 (ja) 2013-06-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006046872A Expired - Fee Related JP5207591B2 (ja) 2006-02-23 2006-02-23 半導体装置の製造方法および半導体装置

Country Status (10)

Country Link
US (1) US8802506B2 (https=)
EP (1) EP1986832B1 (https=)
JP (1) JP5207591B2 (https=)
KR (1) KR101349619B1 (https=)
CN (1) CN101389461B (https=)
AT (1) ATE462545T1 (https=)
DE (1) DE602007005610D1 (https=)
MY (1) MY149696A (https=)
TW (1) TW200741906A (https=)
WO (1) WO2007099823A1 (https=)

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CN114502676A (zh) * 2019-09-23 2022-05-13 Ppg工业俄亥俄公司 可固化组合物
CN112873810A (zh) * 2019-11-29 2021-06-01 复盛应用科技股份有限公司 高尔夫球杆头盖片制造方法及模具
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Also Published As

Publication number Publication date
MY149696A (en) 2013-09-30
ATE462545T1 (de) 2010-04-15
CN101389461B (zh) 2011-02-09
US20100213623A1 (en) 2010-08-26
TW200741906A (en) 2007-11-01
EP1986832B1 (en) 2010-03-31
US8802506B2 (en) 2014-08-12
CN101389461A (zh) 2009-03-18
KR101349619B1 (ko) 2014-02-14
EP1986832A1 (en) 2008-11-05
DE602007005610D1 (de) 2010-05-12
KR20080108089A (ko) 2008-12-11
JP2007224146A (ja) 2007-09-06
WO2007099823A1 (en) 2007-09-07

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