JP5182993B2 - 表示装置及びその作製方法 - Google Patents
表示装置及びその作製方法 Download PDFInfo
- Publication number
- JP5182993B2 JP5182993B2 JP2009073264A JP2009073264A JP5182993B2 JP 5182993 B2 JP5182993 B2 JP 5182993B2 JP 2009073264 A JP2009073264 A JP 2009073264A JP 2009073264 A JP2009073264 A JP 2009073264A JP 5182993 B2 JP5182993 B2 JP 5182993B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- insulating film
- semiconductor film
- signal line
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 239000004065 semiconductor Substances 0.000 claims description 279
- 239000012535 impurity Substances 0.000 claims description 157
- 239000000758 substrate Substances 0.000 claims description 77
- 238000000034 method Methods 0.000 claims description 43
- 239000003990 capacitor Substances 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 25
- 238000005530 etching Methods 0.000 claims description 21
- 238000003860 storage Methods 0.000 claims description 16
- 238000000206 photolithography Methods 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 238000004380 ashing Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000010408 film Substances 0.000 description 636
- 239000010410 layer Substances 0.000 description 94
- 229910052581 Si3N4 Inorganic materials 0.000 description 53
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 53
- 239000010409 thin film Substances 0.000 description 51
- 238000002161 passivation Methods 0.000 description 44
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 34
- 239000004973 liquid crystal related substance Substances 0.000 description 34
- 229910052710 silicon Inorganic materials 0.000 description 25
- 239000010703 silicon Substances 0.000 description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 23
- 239000007789 gas Substances 0.000 description 21
- 229910052739 hydrogen Inorganic materials 0.000 description 21
- 239000001257 hydrogen Substances 0.000 description 21
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 18
- 230000008569 process Effects 0.000 description 18
- 239000013078 crystal Substances 0.000 description 17
- 229910052757 nitrogen Inorganic materials 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 16
- 239000010949 copper Substances 0.000 description 16
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 14
- 238000011282 treatment Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 13
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 13
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 12
- 229910021417 amorphous silicon Inorganic materials 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 125000004429 atom Chemical group 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 8
- 239000000460 chlorine Substances 0.000 description 8
- 230000007547 defect Effects 0.000 description 8
- 230000006870 function Effects 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000002834 transmittance Methods 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- 229910052990 silicon hydride Inorganic materials 0.000 description 7
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 150000004767 nitrides Chemical class 0.000 description 6
- 230000002265 prevention Effects 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 5
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- 229910000676 Si alloy Inorganic materials 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 4
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 4
- 229910052794 bromium Inorganic materials 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 229920001940 conductive polymer Polymers 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 239000001307 helium Substances 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 239000011630 iodine Substances 0.000 description 4
- 229910052740 iodine Inorganic materials 0.000 description 4
- 229910052743 krypton Inorganic materials 0.000 description 4
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 4
- 229910052754 neon Inorganic materials 0.000 description 4
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 4
- 238000009832 plasma treatment Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 239000003870 refractory metal Substances 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 230000005236 sound signal Effects 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000001678 elastic recoil detection analysis Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000005001 rutherford backscattering spectroscopy Methods 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 239000007790 solid phase Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910000583 Nd alloy Inorganic materials 0.000 description 2
- 229910052779 Neodymium Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000001237 Raman spectrum Methods 0.000 description 2
- 229910003902 SiCl 4 Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 239000010407 anodic oxide Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910000423 chromium oxide Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 239000013081 microcrystal Substances 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- -1 silicon halide Chemical class 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910001930 tungsten oxide Inorganic materials 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910019974 CrSi Inorganic materials 0.000 description 1
- 229910016006 MoSi Inorganic materials 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000007500 overflow downdraw method Methods 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136213—Storage capacitors associated with the pixel electrode
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133345—Insulating layers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009073264A JP5182993B2 (ja) | 2008-03-31 | 2009-03-25 | 表示装置及びその作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008089241 | 2008-03-31 | ||
| JP2008089241 | 2008-03-31 | ||
| JP2009073264A JP5182993B2 (ja) | 2008-03-31 | 2009-03-25 | 表示装置及びその作製方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013004150A Division JP5285817B2 (ja) | 2008-03-31 | 2013-01-14 | 表示装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009265635A JP2009265635A (ja) | 2009-11-12 |
| JP2009265635A5 JP2009265635A5 (enExample) | 2012-02-23 |
| JP5182993B2 true JP5182993B2 (ja) | 2013-04-17 |
Family
ID=41115723
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009073264A Active JP5182993B2 (ja) | 2008-03-31 | 2009-03-25 | 表示装置及びその作製方法 |
| JP2013004150A Active JP5285817B2 (ja) | 2008-03-31 | 2013-01-14 | 表示装置 |
| JP2013115121A Active JP5685288B2 (ja) | 2008-03-31 | 2013-05-31 | 表示装置 |
| JP2015006406A Active JP5917728B2 (ja) | 2008-03-31 | 2015-01-16 | 表示装置 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013004150A Active JP5285817B2 (ja) | 2008-03-31 | 2013-01-14 | 表示装置 |
| JP2013115121A Active JP5685288B2 (ja) | 2008-03-31 | 2013-05-31 | 表示装置 |
| JP2015006406A Active JP5917728B2 (ja) | 2008-03-31 | 2015-01-16 | 表示装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US8138500B2 (enExample) |
| JP (4) | JP5182993B2 (enExample) |
| CN (2) | CN101551559B (enExample) |
| TW (1) | TWI499848B (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5182993B2 (ja) * | 2008-03-31 | 2013-04-17 | 株式会社半導体エネルギー研究所 | 表示装置及びその作製方法 |
| JP2011221098A (ja) * | 2010-04-05 | 2011-11-04 | Seiko Epson Corp | 電気光学装置用基板、電気光学装置、及び電子機器 |
| US20120001179A1 (en) * | 2010-07-02 | 2012-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP5948025B2 (ja) * | 2010-08-06 | 2016-07-06 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
| TWI438539B (zh) | 2010-12-16 | 2014-05-21 | Innolux Corp | 陣列基板的形成方法 |
| TWI422940B (zh) * | 2010-12-16 | 2014-01-11 | Innolux Corp | 陣列基板的形成方法 |
| CN102543861B (zh) * | 2010-12-17 | 2014-12-31 | 群创光电股份有限公司 | 阵列基板的形成方法 |
| TWI743509B (zh) | 2011-05-05 | 2021-10-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| KR102354212B1 (ko) * | 2012-08-03 | 2022-01-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| US8937307B2 (en) | 2012-08-10 | 2015-01-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| DE102013216824B4 (de) | 2012-08-28 | 2024-10-17 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung |
| TWI657539B (zh) | 2012-08-31 | 2019-04-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| KR102250010B1 (ko) | 2012-09-13 | 2021-05-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR102798241B1 (ko) | 2012-12-25 | 2025-04-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| US9976762B2 (en) * | 2013-03-14 | 2018-05-22 | General Electric Company | Synthetic jet driven cooling device with increased volumetric flow |
| US9231002B2 (en) | 2013-05-03 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
| JP6367655B2 (ja) * | 2013-09-13 | 2018-08-01 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2015179247A (ja) * | 2013-10-22 | 2015-10-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
| JP6556998B2 (ja) * | 2013-11-28 | 2019-08-07 | 株式会社半導体エネルギー研究所 | 表示装置 |
| KR102122402B1 (ko) * | 2013-12-31 | 2020-06-15 | 엘지디스플레이 주식회사 | 씨오티 구조 액정표시장치 및 이의 제조방법 |
| CN103928472A (zh) * | 2014-03-26 | 2014-07-16 | 京东方科技集团股份有限公司 | 一种阵列基板及其制作方法和显示装置 |
| CN105932030B (zh) * | 2016-06-08 | 2019-07-26 | 京东方科技集团股份有限公司 | 一种阵列基板及其制作方法、显示装置 |
| SE542644C2 (en) * | 2017-05-30 | 2020-06-23 | Photon Sports Tech Ab | Method and camera arrangement for measuring a movement of a person |
| TWI636510B (zh) * | 2017-12-05 | 2018-09-21 | 友達光電股份有限公司 | 薄膜電晶體基板及其製造方法 |
| CN116868261A (zh) * | 2021-02-26 | 2023-10-10 | 株式会社半导体能源研究所 | 显示装置及电子设备 |
| CN116382009B (zh) * | 2023-04-21 | 2025-07-25 | 上海天马微电子有限公司 | 一种液晶光栅及显示装置 |
Family Cites Families (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122123A (en) | 1980-03-03 | 1981-09-25 | Shunpei Yamazaki | Semiamorphous semiconductor |
| JPH0812354B2 (ja) | 1987-10-14 | 1996-02-07 | セイコーエプソン株式会社 | アクティブマトリクス基板の製造方法 |
| JPH0816756B2 (ja) | 1988-08-10 | 1996-02-21 | シャープ株式会社 | 透過型アクティブマトリクス液晶表示装置 |
| JPH0451140A (ja) * | 1990-06-19 | 1992-02-19 | Konica Corp | 圧力かぶり特性の良好なハロゲン化銀写真感光材料 |
| EP0473988A1 (en) * | 1990-08-29 | 1992-03-11 | International Business Machines Corporation | Method of fabricating a thin film transistor having amorphous/polycrystalline semiconductor channel region |
| JPH05289111A (ja) | 1992-04-13 | 1993-11-05 | Casio Comput Co Ltd | アクティブマトリックス液晶表示装置 |
| US5233448A (en) * | 1992-05-04 | 1993-08-03 | Industrial Technology Research Institute | Method of manufacturing a liquid crystal display panel including photoconductive electrostatic protection |
| JP3098345B2 (ja) | 1992-12-28 | 2000-10-16 | 富士通株式会社 | 薄膜トランジスタマトリクス装置及びその製造方法 |
| JP2556262B2 (ja) * | 1993-07-07 | 1996-11-20 | 日本電気株式会社 | 液晶表示パネル |
| JP3270674B2 (ja) * | 1995-01-17 | 2002-04-02 | 株式会社半導体エネルギー研究所 | 半導体集積回路の作製方法 |
| JP2780681B2 (ja) * | 1995-08-11 | 1998-07-30 | 日本電気株式会社 | アクティブマトリクス液晶表示パネル及びその製造方法 |
| JPH09105952A (ja) * | 1995-10-11 | 1997-04-22 | Toshiba Electron Eng Corp | アクティブマトリクス型液晶表示装置 |
| JP3226836B2 (ja) * | 1997-06-26 | 2001-11-05 | 日本電気株式会社 | 液晶表示装置及びその製造方法 |
| JP3683463B2 (ja) | 1999-03-11 | 2005-08-17 | シャープ株式会社 | アクティブマトリクス基板、その製造方法、及び、該基板を用いたイメージセンサ |
| JP2000310793A (ja) * | 1999-04-28 | 2000-11-07 | Canon Inc | 液晶素子 |
| US6825488B2 (en) | 2000-01-26 | 2004-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP2001217424A (ja) * | 2000-02-03 | 2001-08-10 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタおよびそれを用いた液晶表示装置 |
| US7023021B2 (en) | 2000-02-22 | 2006-04-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
| TW507258B (en) | 2000-02-29 | 2002-10-21 | Semiconductor Systems Corp | Display device and method for fabricating the same |
| JP4118485B2 (ja) * | 2000-03-13 | 2008-07-16 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6580475B2 (en) | 2000-04-27 | 2003-06-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
| JP2002014628A (ja) * | 2000-04-27 | 2002-01-18 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JP4869504B2 (ja) * | 2000-06-27 | 2012-02-08 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| KR20020002089A (ko) | 2000-06-29 | 2002-01-09 | 주식회사 현대 디스플레이 테크놀로지 | 고개구율 액정 표시 소자의 제조방법 |
| US6759313B2 (en) | 2000-12-05 | 2004-07-06 | Semiconductor Energy Laboratory Co., Ltd | Method of fabricating a semiconductor device |
| JP4112168B2 (ja) * | 2000-12-11 | 2008-07-02 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| TW525216B (en) | 2000-12-11 | 2003-03-21 | Semiconductor Energy Lab | Semiconductor device, and manufacturing method thereof |
| TW543145B (en) * | 2001-10-11 | 2003-07-21 | Samsung Electronics Co Ltd | A thin film transistor array panel and a method of the same |
| TWI288443B (en) * | 2002-05-17 | 2007-10-11 | Semiconductor Energy Lab | SiN film, semiconductor device, and the manufacturing method thereof |
| JP2004146691A (ja) * | 2002-10-25 | 2004-05-20 | Chi Mei Electronics Corp | 微結晶薄膜の成膜方法、薄膜トランジスタの製造方法、薄膜トランジスタおよび薄膜トランジスタを用いた画像表示装置 |
| US7133088B2 (en) * | 2002-12-23 | 2006-11-07 | Lg.Philips Lcd Co., Ltd. | Liquid crystal display device and method of fabricating the same |
| JP4182779B2 (ja) * | 2003-03-07 | 2008-11-19 | カシオ計算機株式会社 | 表示装置およびその製造方法 |
| JP5030406B2 (ja) * | 2004-08-30 | 2012-09-19 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| KR101107246B1 (ko) * | 2004-12-24 | 2012-01-25 | 엘지디스플레이 주식회사 | 박막 트랜지스터 기판 및 그 제조 방법 |
| JP4577114B2 (ja) * | 2005-06-23 | 2010-11-10 | ソニー株式会社 | 薄膜トランジスタの製造方法および表示装置の製造方法 |
| US7576359B2 (en) * | 2005-08-12 | 2009-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method for manufacturing the same |
| US7508036B2 (en) * | 2005-09-08 | 2009-03-24 | Chunghwa Picture Tubes, Ltd. | Thin film transistor and manufacturing process thereof |
| TWI498626B (zh) * | 2005-11-15 | 2015-09-01 | Semiconductor Energy Lab | 液晶顯示裝置 |
| KR101103374B1 (ko) | 2005-11-15 | 2012-01-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 |
| US7554644B2 (en) * | 2006-01-27 | 2009-06-30 | Tpo Displays Corp. | LCD panel having capacitor disposed over or below photo spacer with active device also disposed between the photo spacer and a substrate, all disposed over opaque region of display |
| CN100474087C (zh) * | 2006-02-09 | 2009-04-01 | 胜华科技股份有限公司 | 薄膜晶体管液晶显示器的像素结构 |
| WO2008029582A1 (en) * | 2006-09-08 | 2008-03-13 | Sharp Kabushiki Kaisha | Semiconductor device, method for manufacturing the semiconductor device, and display device |
| KR100978265B1 (ko) * | 2006-12-29 | 2010-08-26 | 엘지디스플레이 주식회사 | 액정표시장치 및 그 제조방법 |
| US7998800B2 (en) * | 2007-07-06 | 2011-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP2009049384A (ja) * | 2007-07-20 | 2009-03-05 | Semiconductor Energy Lab Co Ltd | 発光装置 |
| CN100576045C (zh) * | 2007-08-31 | 2009-12-30 | 友达光电股份有限公司 | 液晶显示装置及其制造方法 |
| JP5182993B2 (ja) * | 2008-03-31 | 2013-04-17 | 株式会社半導体エネルギー研究所 | 表示装置及びその作製方法 |
-
2009
- 2009-03-25 JP JP2009073264A patent/JP5182993B2/ja active Active
- 2009-03-30 US US12/413,717 patent/US8138500B2/en not_active Expired - Fee Related
- 2009-03-30 CN CN200910128358.1A patent/CN101551559B/zh not_active Expired - Fee Related
- 2009-03-30 TW TW098110498A patent/TWI499848B/zh active
- 2009-03-30 CN CN201210216767.9A patent/CN102707529B/zh not_active Expired - Fee Related
-
2012
- 2012-03-19 US US13/423,874 patent/US8519398B2/en active Active
-
2013
- 2013-01-14 JP JP2013004150A patent/JP5285817B2/ja active Active
- 2013-05-31 JP JP2013115121A patent/JP5685288B2/ja active Active
-
2015
- 2015-01-16 JP JP2015006406A patent/JP5917728B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101551559B (zh) | 2013-01-09 |
| CN102707529B (zh) | 2015-05-20 |
| US8138500B2 (en) | 2012-03-20 |
| JP2009265635A (ja) | 2009-11-12 |
| JP2013127626A (ja) | 2013-06-27 |
| JP5285817B2 (ja) | 2013-09-11 |
| US20090242888A1 (en) | 2009-10-01 |
| JP2013190820A (ja) | 2013-09-26 |
| US20120176576A1 (en) | 2012-07-12 |
| CN102707529A (zh) | 2012-10-03 |
| JP5917728B2 (ja) | 2016-05-18 |
| TW201003267A (en) | 2010-01-16 |
| JP2015111278A (ja) | 2015-06-18 |
| TWI499848B (zh) | 2015-09-11 |
| CN101551559A (zh) | 2009-10-07 |
| US8519398B2 (en) | 2013-08-27 |
| JP5685288B2 (ja) | 2015-03-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5182993B2 (ja) | 表示装置及びその作製方法 | |
| JP7432052B2 (ja) | 表示装置 | |
| JP7499925B2 (ja) | 半導体装置 | |
| JP5367338B2 (ja) | 表示装置の作製方法 | |
| JP6117884B2 (ja) | 液晶表示装置 | |
| JP5395384B2 (ja) | 薄膜トランジスタの作製方法 | |
| JP5288597B2 (ja) | 半導体装置の作製方法 | |
| KR20090104730A (ko) | 표시 장치 및 그 제조 방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120105 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120105 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121226 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130108 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130114 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5182993 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160125 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160125 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |