JP5158088B2 - エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 - Google Patents
エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 Download PDFInfo
- Publication number
- JP5158088B2 JP5158088B2 JP2009533162A JP2009533162A JP5158088B2 JP 5158088 B2 JP5158088 B2 JP 5158088B2 JP 2009533162 A JP2009533162 A JP 2009533162A JP 2009533162 A JP2009533162 A JP 2009533162A JP 5158088 B2 JP5158088 B2 JP 5158088B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- curing agent
- microcapsule
- latent curing
- type latent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Dispersion Chemistry (AREA)
- Epoxy Resins (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009533162A JP5158088B2 (ja) | 2007-09-20 | 2008-09-17 | エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 |
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007243852 | 2007-09-20 | ||
JP2007243852 | 2007-09-20 | ||
JP2007243851 | 2007-09-20 | ||
JP2007243851 | 2007-09-20 | ||
JP2008043346 | 2008-02-25 | ||
JP2008043346 | 2008-02-25 | ||
JP2008166246 | 2008-06-25 | ||
JP2008166246 | 2008-06-25 | ||
PCT/JP2008/066774 WO2009038097A1 (fr) | 2007-09-20 | 2008-09-17 | Agent de durcissement latent de type microcapsule pour résine époxy et son procédé de fabrication, et composition de résine époxy à un composant et son produit durci |
JP2009533162A JP5158088B2 (ja) | 2007-09-20 | 2008-09-17 | エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2009038097A1 JPWO2009038097A1 (ja) | 2011-01-06 |
JP5158088B2 true JP5158088B2 (ja) | 2013-03-06 |
Family
ID=40467907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009533162A Expired - Fee Related JP5158088B2 (ja) | 2007-09-20 | 2008-09-17 | エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5158088B2 (fr) |
KR (2) | KR101243511B1 (fr) |
CN (2) | CN101802050A (fr) |
TW (2) | TW201008971A (fr) |
WO (1) | WO2009038097A1 (fr) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101086701B1 (ko) * | 2009-06-10 | 2011-11-25 | 한국과학기술연구원 | 물리화학적 결합 시스템을 이용한 향상된 보존안정성을 갖는 잠재성 경화제 복합체 입자와 그 제조 방법 |
KR102270461B1 (ko) * | 2016-03-10 | 2021-06-29 | 한국전자기술연구원 | 점접착제 조성물 및 그의 제조방법 |
KR101870777B1 (ko) * | 2017-03-28 | 2018-06-26 | 한국신발피혁연구원 | 마이크로캡슐형 잠재성 경화제의 제조방법 및 이 방법에 의해 제조된 마이크로캡슐형 잠재성 경화제 |
KR102095115B1 (ko) * | 2018-07-27 | 2020-03-30 | 한국전력공사 | 자가치유 실리콘 절연체 및 그 제조방법 |
CN111087576A (zh) * | 2019-12-31 | 2020-05-01 | 芜湖天道绿色新材料有限公司 | 一种可降解微胶囊固化剂的制备及应用 |
CN111171285B (zh) * | 2020-02-15 | 2022-04-26 | 常州大学 | 一种以聚氨酯为壳材的环氧树脂固化剂微胶囊及其制备方法 |
CN111518500B (zh) * | 2020-04-22 | 2023-04-11 | 湖北回天新材料股份有限公司 | 溶剂型单组分环氧微胶囊预涂螺纹锁固胶及其制备方法 |
CN111389317B (zh) * | 2020-04-28 | 2022-04-12 | 西北工业大学 | 基于巯基-异氰酸酯点击反应和油包油界面聚合的咪唑微胶囊的制备方法 |
CN116323837A (zh) * | 2020-09-30 | 2023-06-23 | 旭化成株式会社 | 聚氨酯系固化剂及其应用 |
JPWO2023286499A1 (fr) * | 2021-07-12 | 2023-01-19 | ||
CN114230767B (zh) * | 2021-12-13 | 2024-03-19 | 江苏钛得新材料技术有限公司 | 胶粘剂用咪唑类衍生物微胶囊型潜伏固化剂及其制备方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11199655A (ja) * | 1998-01-12 | 1999-07-27 | Hitachi Ltd | マイクロカプセル型りん系硬化促進剤とそれを用いた半導体封止用エポキシ樹脂組成物 |
JP2005344046A (ja) * | 2004-06-04 | 2005-12-15 | Asahi Kasei Chemicals Corp | 潜在性硬化剤および組成物 |
WO2007037378A1 (fr) * | 2005-09-29 | 2007-04-05 | Asahi Kasei Chemicals Corporation | Agent de durcissement microencapsule presentant une grande stabilite pour resine epoxy et composition de resine epoxy |
JP2007091900A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2007091899A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2007091901A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 緩反応性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
WO2007088889A1 (fr) * | 2006-02-03 | 2007-08-09 | Asahi Kasei Chemicals Corporation | Agent de durcissement de type microcapsule pour resine epoxy, composition d'agent de durcissement de type melange maitre pour resine epoxy, composition de resine epoxy de type en une partie et article traite |
JP2007204670A (ja) * | 2006-02-03 | 2007-08-16 | Asahi Kasei Chemicals Corp | 高含水含溶剤エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2007204669A (ja) * | 2006-02-03 | 2007-08-16 | Asahi Kasei Chemicals Corp | 特定小粒径粒度分布エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
-
2008
- 2008-09-17 JP JP2009533162A patent/JP5158088B2/ja not_active Expired - Fee Related
- 2008-09-17 CN CN200880107917A patent/CN101802050A/zh active Pending
- 2008-09-17 KR KR1020127000991A patent/KR101243511B1/ko not_active IP Right Cessation
- 2008-09-17 CN CN2012104288004A patent/CN102936331A/zh active Pending
- 2008-09-17 KR KR1020107008435A patent/KR20100072030A/ko not_active Application Discontinuation
- 2008-09-17 WO PCT/JP2008/066774 patent/WO2009038097A1/fr active Application Filing
- 2008-09-19 TW TW097136142A patent/TW201008971A/zh unknown
- 2008-09-19 TW TW101126619A patent/TW201244814A/zh unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11199655A (ja) * | 1998-01-12 | 1999-07-27 | Hitachi Ltd | マイクロカプセル型りん系硬化促進剤とそれを用いた半導体封止用エポキシ樹脂組成物 |
JP2005344046A (ja) * | 2004-06-04 | 2005-12-15 | Asahi Kasei Chemicals Corp | 潜在性硬化剤および組成物 |
WO2007037378A1 (fr) * | 2005-09-29 | 2007-04-05 | Asahi Kasei Chemicals Corporation | Agent de durcissement microencapsule presentant une grande stabilite pour resine epoxy et composition de resine epoxy |
JP2007091900A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2007091899A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2007091901A (ja) * | 2005-09-29 | 2007-04-12 | Asahi Kasei Chemicals Corp | 緩反応性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
WO2007088889A1 (fr) * | 2006-02-03 | 2007-08-09 | Asahi Kasei Chemicals Corporation | Agent de durcissement de type microcapsule pour resine epoxy, composition d'agent de durcissement de type melange maitre pour resine epoxy, composition de resine epoxy de type en une partie et article traite |
JP2007204670A (ja) * | 2006-02-03 | 2007-08-16 | Asahi Kasei Chemicals Corp | 高含水含溶剤エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2007204669A (ja) * | 2006-02-03 | 2007-08-16 | Asahi Kasei Chemicals Corp | 特定小粒径粒度分布エポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
Also Published As
Publication number | Publication date |
---|---|
TW201008971A (en) | 2010-03-01 |
KR20120024963A (ko) | 2012-03-14 |
WO2009038097A1 (fr) | 2009-03-26 |
JPWO2009038097A1 (ja) | 2011-01-06 |
KR20100072030A (ko) | 2010-06-29 |
KR101243511B1 (ko) | 2013-03-20 |
CN101802050A (zh) | 2010-08-11 |
TW201244814A (en) | 2012-11-16 |
CN102936331A (zh) | 2013-02-20 |
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